Prognostic factors of early sequelae and fatal outcome of Japanese encephalitis

A clinical case control study to identify prognostic factors present at hospital admission associated with early sequelae and fatal outcome of acute Japanese encephalitis (JE) was carried out in Gusi county, Henan Province, central China from June to September 1991. A total of 70 patients with laboratory-confirmed acute JE were studied, of whom 3 cases died and 33 cases had neurological or psychiatric sequelae at the end of three months follow-up. The results showed that acute JE at younger age, with higher body temperature, high white cell count in CSF, and deep coma present at hospital admission were markers for unfavorable outcomes (sequelae or fatal). A history of the vaccination was not correlated with the early sequelae and fatal outcome of the disease. The paper suggests that early diagnosis and treatment and universal JE vaccination for all susceptible populations are keys for decreasing incidence of sequelae and fatal outcome of acute JE.     

片状陶瓷材料高低温电性能参数的自动检测

由进口电性能仪配上自制的高温系统，计算机自动采集数据，配置成一套高低温电性参数测定装置，该装置的特点是，升温快，炉体小巧，炉芯可更换盛液氮装置，屏蔽良好，等温区长，温工及参数测量精确可靠。     

PPS：基于PROSITE数据库检索蛋白质功能位点的计算机程序

用标准Ｃ语言在ＩＢＭ－ＰＣ兼容微机上开发了基于ＰＲＯＳＩＴＥ数据库检索蛋白质序列功能位点的ＰＰＳ程序，ＰＲＯＳＩＴＥ是Ｂａｉｒｏｃｈ建立的蛋白质功能位点或结构模式的资料库，为蛋白质序列分析和结构功能研究提供了新工具。     

钢管内径光电检测装置

介绍了一种检测细长钢管内径的光电检测装置。该装置利用线阵ＣＣＤ作传感器，采用８０３１单片机作为主控制。     

多级脉冲深穿透射孔技术

目前国内较先进的射孔工艺是增效射孔和三相流射孔,这2种射孔工艺均存在射孔深度和造缝深度浅的问题,尤其是对低渗油藏和纵向渗透率远大于横向渗透率的油藏,此造缝深度并不能满足油田生产的需要.介绍了一种新型的射孔技术,它是一种能进行深度射孔造缝的多级射孔技术,利用三级推进剂燃爆时产生峰值不连续的高温、高压气流,形成多级脉冲,多次冲击射孔孔眼前沿的裂缝,使其有效延伸至地层深处,从而较单独的射孔更能有效地增加油气产量.通过地面水泥靶的试验,证明了该射孔器的延缝功能和安全性;通过塘32等井的现场试验,证明该射孔技术对污染地层解堵有显著效果,可明显地降低地层破裂压力.     

浅谈水泥基渗透结晶型防水材料标准及性能指标

针对GB18445-2001《水泥基渗透结晶型防水材料》标准在使用过程中发现的一些问题，对标准中的部分性能指标的确定及试验方法提出修改意见。     

浅谈降低电解槽氟化铝单耗的方法

氟化铝是电解生产中十分重要的原料，它对控制电解槽电解质温度，保持电解槽技术条件发挥着重要的作用。但随着电解生产成本的逐渐降低，氟化铝的消耗成为电解生产成本中的一项重要内容。本文就某分厂电解槽氟化铝添加的生产工艺、设备、控制以及管理等方面，提出降低氟化铝单耗的简要方法。     

Impact of temperature cycle profile on fatigue life of solder joints

In this paper the influence of the temperature cycle time history profile on the fatigue life of ball grid array (BGA) solder joints is studied. Temperature time history in a Pentium processor laptop computer was measured for a three-month period by means of thermocouples placed inside the computer. In addition, Pentium BGA packages were subjected to industry standard temperature cycles and also to in-situ measured temperature cycle profiles. Inelastic strain accumulation in each solder joint during thermal cycling was measured by high sensitivity Moire interferometry technique. Results indicate that fatigue life of the solder joint is not independent of the temperature cycle profile used. Industry standard temperature cycle profile leads to conservative fatigue life observations by underestimating the actual number of cycles to failure.     

液态混合有机标准物质研究

本研究采用重量法配制有机液态混合标样 ,并对配制方法、混合标样的均匀性、稳定性及影响不确定度的因素进行了研究 ,并用气相色谱法进行了比对分析。经稳定性监测 ,稳定度大于等于一年 ,不确定度小于± 2 %。