Modelling of electrostatic gate operations in the Kane solid state quantum computer

The nuclear spin quantum computer proposed by Kane [Nature 393 (1998) 133] exploits as a qubit array ³¹P dopants embedded within a silicon matrix. Single-qubit operations are controlled by the application of electrostatic potentials via a set of metallic ‘A’ gates, situated above the donors, on the silicon surface, that tune the resonance frequency of individual nuclear spins, and a globally applied RF magnetic field that flips spins at resonance. Coupling between qubits is controlled by the application of potentials via a set of ‘J’ gates, between the donors, that induce an electron-mediated coupling between nuclear spins. We report the results of the study of the electric field and potential profiles arising within the Kane device from typical gate operations. The extent to which a single nuclear spin can be tuned independently of its neighbours, by operation of an associated A-gate, is examined and key design parameters in the Kane architecture are addressed. Implications for current fabrication strategies involving the implantation of ³¹P atoms are discussed. Solution of the Poisson equation has been carried out by simulation using a TCAD modelling package (Integrated Systems Engineering AG).     

Modelling methodology for thermal analysis of hot solder dip process

The shift of electronics industry towards the use of lead-free solders in components manufacturing brought also the challenge of addressing the problem of tin whiskers. Manufacturers of high reliability and safety critical equipment in sectors such as defence and aerospace rely increasingly on the use of commercial-of-the-shelf (COTS) electronic components for their products and systems. The use of COTS components with lead-free solder plated terminations comes with the risks for their long term reliability associated with tin whisker growth related failures. In the case of leaded type electronic components such as Quad Flat Package (QFP) and Small Outline Package (SOP), one of the promising solutions to this problem is to “re-finish” the package terminations by replacing the lead-free solder coatings on the leads with conventional tin–lead solder. This involves subjecting the electronic components to a post-manufacturing process known as Hot Solder Dip (HSD). One of the main concerns for adopting HSD (refinishing) as a strategy to the tin whisker problem is the potential risk for thermally induced damage in the components when subjected to this process.     

Perceptually lossless medical image coding

A novel perceptually lossless coder is presented for the compression of medical images. Built on the JPEG 2000 coding framework, the heart of the proposed coder is a visual pruning function, embedded with an advanced human vision model to identify and to remove visually insignificant/irrelevant information. The proposed coder offers the advantages of simplicity and modularity with bit-stream compliance. Current results have shown superior compression ratio gains over that of its information lossless counterparts without any visible distortion. In addition, a case study consisting of 31 medical experts has shown that no perceivable difference of statistical significance exists between the original images and the images compressed by the proposed coder.     

Assessing the performance of crack detection tests for solder joints

This paper presents both modelling and experimental test data to characterise the performance of four non-destructive tests. The focus is on determining the presence and rough magnitude of thermal fatigue cracks within the solder joints for a surface mount resistor on a strip of FR4 PCB. The tests all operate by applying mechanical loads to the PCB and monitoring the strain response at the top of the resistor. The modelling results show that of the four tests investigated, three are sensitive to the presence of a crack in the joint and its magnitude. Hence these tests show promise in being able to detect cracking caused by accelerated testing. The experimental data supports these results although more validation is required.     

系统模块(SiP)和三维封装(3D)在移动通讯中的应用

电子封装业界正遭受着前所未有的来自手机和其他移动通讯终端设备挑战。在这一领域里,IC封装的关键是尺寸微型化,缩减成本和市场时机。这一挑战的背后隐含着手机技术发展的两大趋势:系统模块化和日益增长的复杂性及功能。越来越多的功能正在被组合到手机上即PDA、MP3、照相机、互联网等等。功能的增加需要靠模块化来实现,而模块化又促进了更多功能的组合。同时,模块化使得移动通讯终端设备得以微型化、降低成本和缩短设计周期。业界越来越多地感受到整体射频模块和通讯模块解决方案的必要性。这些整体模块把手机设计师从电路设计的细节中解脱出来,从而能专著于高层的手机应用和系统的设计。为了满足上诉移动通讯产品的苛刻要求,大量的新兴电子封装技术和封装产品应运而生。最引人注目的例子在于对系统模块穴SiP雪和三维穴3D雪封装的重点资金和技术投入。这两项先进封装技术有着各自不同的特征和应用范围。总体介绍先进封装技术在移动通讯中的应用,重点讨论电子封装材料和工艺所面临的挑战和最新发展趋势。对移动通讯带来的新一轮集成化及其所产生的潜在供应链问题也做了适当的讨论。     

Free carrier absorption and lattice vibrational modes in bulk ZnO

The electronic properties of semiconductors are highly dependent on carrier scattering mechanisms determined by crystalline structure, band structure, and defects in the material. Experimental characteristics of lattice vibrational modes and free carrier absorption in single-crystal ZnO samples obtained from different sources are presented in this work to provide a further understanding of carrier scattering processes pertaining to electronic properties. Infrared absorption measurements indicate strong absorption peaks due to a combination of optical and nonpolar phonon modes in the 9–13 μm spectral region. The Raman spectra obtained for these samples similarly reveal the presence of these phonon modes. Infrared absorption measurements also demonstrate free carrier absorption in the 3–9 μm spectral region for higher conductivity samples, where a λ^m dependence is observed with m=2.7–3, indicating both longitudinal optical phonon scattering and ionized impurity scattering. From these results, we show that infrared absorption can be used as a routine nondestructive technique to determine the material characteristics and quality of bulk ZnO.     

Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules

In the reliability theme a central activity is to investigate, characterize and understand the contributory wear-out and overstress mechanisms to meet through-life reliability targets. For power modules, it is critical to understand the response of typical wear-out mechanisms, for example wire-bond lifting and solder degradation, to in-service environmental and load-induced thermal cycling. This paper presents the use of a reduced-order thermal model coupled with physics-of-failure-based life models to quantify the wear-out rates and life consumption for the dominant failure mechanisms under prospective in-service and qualification test conditions. When applied in the design of accelerated life and qualification tests it can be used to design tests that separate the failure mechanisms (e.g. wire-bond and substrate-solder) and provide predictions of conditions that yield a minimum elapsed test time. The combined approach provides a useful tool for reliability assessment and estimation of remaining useful life which can be used at the design stage or in-service. An example case study shows that it is possible to determine the actual power cycling frequency for which failure occurs in the shortest elapsed time. The results demonstrate that bond-wire degradation is the dominant failure mechanism for all power cycling conditions whereas substrate-solder failure dominates for externally applied (ambient or passive) thermal cycling.     

The future is small : The role of RE in a decentralised energy model

The energy industry is changing rapidly and the combination of liberalisation, technological change and environmental pressures are pointing towards a decentralised energy model with a major contribution from renewables. Chris Hewett, from UK think-tank the Institute for Public Policy Research, reviews a recent international electricity conference and new Financial Times report which both come to the conclusion that small is not only beautiful, but profitable.     

Accurate analytical method for the extraction of solar cell model parameters

Analytical expressions are derived for the rapid extraction of solar cell single diode model parameters from experimental data. The resulting parameter values are shown to have less than 5% error for most solar cells     

Making light work: illuminating the future of biomedical optics

In 1996, the Royal Society held a Discussion Meeting entitled 'Near-infrared spectroscopy and imaging of living systems'. In 2010, this topic was revisited in a Theo Murphy Royal Society Scientific Discussion Meeting entitled 'Making light work: illuminating the future of biomedical optics'. The second meeting provided the opportunity for leading researchers to reflect on how the technology, methods and applications have evolved over the past 14 years and assess where they have made a major impact. Particular emphasis was placed on discussions of future prospects and associated challenges. This Introduction provides an overview of the state of the art of near-infrared spectroscopy (NIRS) and biomedical optics, with specific reference to the contributed papers from the invited speakers included in this issue. Importantly, we also reflect on the contributions from all of the attendees by highlighting the issues raised during oral presentations, facilitated panel sessions and discussions, and use these to summarize the current opinion on the development and application of optical systems for use in the clinical and life sciences. A notable outcome from the meeting was a plan to establish a biennial international conference for developers and users of NIRS technologies.