Effects of grain sizes, shapes, and distribution on minimum sizes of representative volume elements of cubic polycrystals

In the literature the concept of representative volume element (RVE) was introduced to correlate the effective or macroscopic properties of materials with the properties of the microscopic constituents and microscopic structures of the materials. However, to date little quantitative knowledge is available about minimum RVE sizes of various engineering materials. In our recent paper [J. Mech. Phys. Solids 50 (2002) 881], a new definition of minimum RVE size was introduced based on the concept of nominal modulus. Numerical experiments using the finite element method (FEM) were then carried out for determining the minimum RVE sizes of more than 500 cubic polycrystals in the plane stress problem, under the assumption that all grains in a polycrystal have the same square shape––called the simple polycrystal model. The major finding is that the minimum RVE sizes for effective elastic moduli have a roughly linear dependence on crystal anisotropy degrees. The present paper takes into account the effect of grain sizes, shapes, and distribution on the minimum RVE sizes for real cubic polycrystals that are formed by crystallization processes. Similar roughly linear dependence is found again, with the slope about 19% lower than that in the simple polycrystal model. This finding is interesting and useful because numerical experiments on minimum RVE sizes for a large number of crystals are quite time-consuming and the simple polycrystal model reduces significantly the FEM pre- and post-processing works. This should be particularly true in numerically testing minimum RVE sizes for three-dimensional polycrystals and for nonelastic properties in future works. With a maximum relative error 5%, all the polycrystals tested have a minimum RVE size of 16 or less times the grain size.     

Enhanced light output in nitride-based light-emitting diodes by roughening the mesa sidewall

In this letter, we will report on a nitride-based light emitting diode with a mesa sidewall roughening process that increases light output power. The fabricated GaN-based light-emitting diode (LED) wafers were first treated through a photoelectrochemical (PEC) process. The Ga/sub 2/O/sub 3/ layers then formed around the GaN : Si n-type mesa sidewalls and the bottoms mesa etching regions. Selective wet oxidation occurred at the mesa sidewall between the p- and the n-type GaN interface. The light output power of the PEC treated LED was seen to increase by about 82% which was caused by a reduced index reflectance of GaN-Ga/sub 2/O/sub 3/-air layers, by a rough Ga/sub 2/O/sub 3/ surface, by a microroughening of the GaN sidewall surface, and by a selective oxidation step profile of the mesa sidewall that increases the light-extraction efficiency from the mesa sidewall direction. Consequently, this wet PEC treated process is suitable for high powered nitride-based LEDs lighting applications.     

A new method for producing high melt strength polypropylene with reactive extrusion

A high‐melt‐strength polypropylene (HMSPP) was prepared using a twin‐screw reactive extruder from a commercial isotactic polypropylene through two stages, first, maleic anhydride is grafted to polypropylene to obtain a maleic anhydride‐grafted polypropylene (PP‐g‐MA), and then the grafted polymer is reacted with epoxy to extend the branched chain. Fourier transformed infrared spectroscopy indicated that maleic anhydride was grafted on polypropylene and reacted with epoxy. Melt flow rate and sag resistance test showed that the melt strength of the HMSPP improved considerably. Differential scanning calorimetry test showed that the long chain branches (LCBs) act as a nucleating agent in the crystallization of the HMSPP, which leads to a high crystallization temperature and crystallinity. Furthermore, the LCB efficiency of the HMSPP can also be calculated by analyzing its rheological property. POLYM. ENG. SCI., 2008. © 2008 Society of Plastics Engineers     

Studies on adsorption equilibrium of xylenes in AEL framework using biased GCMC and energy minimization

The adsorption of xylene isomers in AlPO₄-11 (AEL network) was investigated using biased grand canonical Monte Carlo (GCMC) simulations. Preferential o-xylene adsorption was predicted by the simulations, in agreement with previously reported experimental data. In AlPO₄-11 the selective adsorption behavior comes from the smaller length of the o-xylene molecule along the crystallographic c-axis compared to p-xylene. This is in contrast to AlPO₄-5 and AlPO₄-8, where the ortho-selectivity is caused by the characteristic face-to-face positioning of o-xylene. Energy minimization studies were also performed in a flexible AlPO₄-11 lattice to study the structural changes upon xylene adsorption. The energy minimization study showed that the AlPO₄-11 crystal distorts upon p- and o-xylene adsorption. The distortion mechanism is related to the strong interaction between xylene methyl groups and the sieve oxygen atoms in the O3 position in the wide region of the pore.     

Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.     

Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.     

赴日无线电监测技术考察报告

首先介绍了日本总务省关东综合通信局电波监理部的情况，然后对日本安立公司生产的RR510A型无线电监测接收机和技术参数以及MS8609A型数字移动无线发射机测试仪的功能进行了分析和介绍。     

The Simulation of Impact Loads on Beam-type Structures using a Pseudo-dynamic Procedure

Abstract:  This study proposes an alternate method for the analysis of beams with solid cross-section or built as a framed structure and subjected to transverse impact loads from an external striker. The procedure used in the analysis is a combination of two essential tools using pseudo-dynamic techniques. The method reported here involves only one degree of freedom for the structure modelling and assumes an elastic contact between an external striker and the beam structure, which in reality does not happen. As only one degree of freedom is considered in the analysis, some important limitations are inherent to the method proposed here. Essentially, there is the difficulty of modelling the displacement field associated with the transient structure behaviour accurately, as a consequence of fast-rate impact loads. Another difficulty faced by the method refers to a local structure behaviour associated with contact loads. The present method can deal with large displacements in transversely loaded beams associated to a collapse mechanism having a simple geometry and defined with precision from a single parameter. This ensures reasonable accuracy in the evaluation of the strain energy absorbing capacity of transversely impacted beam structures using a single degree of freedom model in a pseudo-dynamic procedure.     

Grain refinement of Al-7Si alloys and the efficiency assessment by recognition of cooling curves

Under sand cup solidification condition, the influence of Ti, B concentration, and holding time on the grain size of a high-purity Al-7Si alloy has been systematically studied. It is found that the grain size decreases rapidly at lower Ti or B additions, and is almost constant at the higher concentrations. For Al-3B refined Al-7Si alloys, the grain size increases at the initial period of holding time, and then rapidly becomes independent of holding time; while for Al-7Si alloys refined with Al-5Ti-1B, the grain size increases with holding time throughout. To evaluate the refinement efficiency, a new method named “intelligent evaluating of melt quality by pattern recognition of thermal analysis cooling curves” has also been introduced in this article. The results show that comparing the cooling curve of the evaluated melt with those in a database to find the most similar one to it can precisely assess the grain refinement efficiency of the measured Al-7Si alloy. In addition, the influence of Ti, B addition levels, and pouring temperatures on some characteristic parameters of cooling curve has also been discussed.