Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

单片机中断多优先级的软件扩展方法

为了解决MCS-51系列单片机只能由IP寄存器设定两级优先级的问题 ,文中给出了利用软件对中断优先级进行扩展的方法 ,同时给出了高于两个优先级的多优先级软件扩展程序。     

利用AutoCAD编制电气CAD

介绍如何利用AutoCAD开发适合电气专业使用的CAD系统，通过编制电气CAD的功能菜单，构造电气元件库，增强CAD的专业性能。编制电气CAD可以有效地统一本单位电气制图标准，方便电气工程师使用CAD进行专业设计。     

Intelligent process analytics for CRM

Many organisations use decision models in their processes such as tables or trees to provide decision support to their operational divisions. For example, in fault management, customer contact centre operators usually use a decision model in the form of prescribed interviews. Based on the answers given by customers, the operator navigates through the decision model to reach an assessment of the problem. In order to achieve customer satisfaction and operational excellence, it is very important to constantly monitor the performance of a decision model not only on an overall level, but also on the level of individual decisions. In this paper we present a configurable business process analytics tool, known as the intelligent Universal Service Management System, that constantly monitors decision data and is capable of optimising the decisions based on high-level business objectives. We explain the various features of the software and show how it can be used to optimise decision processes. We also show how we can easily provide a customised version to monitor the performance of provision processes.     

单片机控制下液晶显示器的使用

介绍液晶显示器EDM12864B的原理及其在单片机控制下的简单应用。     

光电平台无角位移减振机构运动分析

分析了光电平台的工作环境和角振动对成像质量的影响，应用空间机构学原理和减振理论，设计了一种既具减振功能又能抑制角位移的无角位移减振机构。对减振机构的减振机理及运动特性进行了分析，并利用三维建模软件和MSC．Visual Nastran 4D仿真分析软件对该减振机构进行了三雏实体仿真分析，通过输出的仿真数据及曲线检验无角位移减振原理的正确性。     

运行电站爆破震动控制研究

结合大渡河龚咀水电站下游河床整治爆破开挖拓宽，重点研究了爆破震动对运行电站机组及其仪表的影响，探讨了爆破震动安全判据和控制标准，用了若干实际工程采用的经验指标进行对比分析，所得结论意见可供同类工程作为爆震安全控制参考。     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

类胡萝卜素的命名

本根据国际理论与应用化学协会(IUPAC)所制定的命名规则和国际上认可的习惯名称，对类胡萝卜素的命名进行了详细的说明。     

深层搅拌桩防渗墙质量通病及防治

深层搅拌桩防渗漏墙技术可靠,工序简单、易于操作和控制,造价低廉,因而在堤防工程建设中得到了广泛的应用。文章简述了该技术的施工过程,并分析了该技术的质量通病,提出了防治措施,得出实际应用效果。