Surface Preparation of Copper and Its Alloys for Adhesive Bonding and Organic Coatings

Two new surface treatments for copper are described, one based on oxidation with alkaline permanganate and the other on electrodeposition of chromium oxide from alkaline chromate bath. The nature and thickness of generated surface layers are discussed on the basis of scanning electron microscope, X-ray fluorescence, atomic absorption and electrolytic reduction results. Data on initial strengths and durability of joints made with different alloys and adhesives are given. It is shown that selective etching of zinc from low copper alloys, before surface treatment, improves initial joint strength and durability.     

Surface Preparation of Steel for Adhesive Bonding and Organic Coatings

A new process for surface treatment of steel is described. Joints made with this new treatment show superior durability characteristics, as determined by the length of the time to failure when the joints are subjected to different levels of static stress and conditioned at moderately elevated temperature and high relative humidity. Polymer coated panels show superior resistance to salt spray and humidity. The results of electron diffraction and scanning electron microscope studies are given.     

Dynamic Mechanical Analysis of Amorphous-Phase Organization in Acrylic Polymers

Factors affecting polymer network organization were studied in highly crosslinked acrylics of the type used in dental adhesive resins. The variables tested were comonomer content and processing conditions. BisEMA (2,2,-bis[4-(2-methacryloyloxyethoxy)-phenyl]-propane) and BisEMA + TEGDMA (triethyleneglycol dimethacrylate) were cured with and without 25% comonomer. Comonomers had characteristics that are expected to influence intrachain organization in amorphous phases: TEGDMA, crosslinking; methyl methacrylate (MMA), monomer conversion; isobornyl methacrylate (IBM), low cure shrinkage; tetrahydrofurfuryl methacrylate (THFM), antiplasticization. Dynamic mechanical analysis temperature scans were run at 0.1 Hz 2h or 24h after ambient cure, or 24h postcure after heating at 75° or 125°C. After 24h, tan δ maxima occurred in ranges centering on approximately -30°, 75° and 150°C (T_g). Heating at 125°C nearly eliminated all peaks except T_g, reduced tan δ peaks and increased T_g by 0–14°. T_g increased in the order: TEGDMA>125°C>IBM>MMA>75°C>2h>24h>THFM. The ability to crosslink, and postcure heating at 125°C, were the more important factors found to increase intrachain organization in amine-promoted, unfilled BisEMA resins of the type used in dental sealants, luting cements and bulk-filling resin composite materials.     

The Effect of Silane Coupling Agents on the Durability of Titanium Alloy Joints

An aqueous solution of γ-glycidoxypropyltrimethoxysilane (GPS) applied to titanium alloy adherends greatly improved bond durabilities compared to alloy surfaces that were only abraded and solvent cleaned, γ-aminopropyltriethoxysilane (APS) also gave improved durability but was not so effective.

Three epoxy adhesives differed considerably in their responses to the five metal pretreatments that were compared. Overall, a sodium hydroxide anodise treatment gave the highest resistance to crack growth in the wedge test.     

High Resolution Optical Interference Measurements of Changes in Bond-Line Thickness—A Review

A novel moire optical interference method, originally developed¹ to measure the swelling displacement normal to the plane of a simple butt joint during water uptake at the joint edge, was subsequently used to investigate the unexpected occurrence of shrinkage and, at the same time, swelling during exposure to organic solvents. In later experiments, synergistic displacement fields generated during simultaneous exposure to water and organic solvents were studied. The same method has also been used to investigate the origin of adhesion failures at copper plated-through holes in thermally cycled multi-layer circuit boards.

The method employs a thin glass cover slip as one adherend. Changes in bondline thickness flex the cover slip thereby changing the gap between the latter and a nearby optical flat. By using monochromatic light to illuminate the specimen, interference between incident and reflected light is achieved. The small displacements of individual fringes associated with changes in gap size are used to generate moire patterns which bear a 1:1 relationship to the local changes in bondline thickness. Application of thin plate elasticity theory to the flexing of the cover slip yields the stress acting normal to the joint. The magnitude of this normal stress is strongly inhomogeneous, oscillating in sign and reaching compressive values as high as 50MNm^?2 for water uptake by a simple butt joint, and exceeding the yield strength of oxygen-free high conductivity copper (1MNm^?2) for the thermal expansion that accompanies simulated soldering of a multi-layer circuit board.

Attention is drawn to the high resolution achievable with the method. Changes in bond-line thickness of the order of Δ/10, where Δ is the wavelength of the light giving rise to the interference pattern, are readily resolved. It is pointed out that the method may well be sufficiently sensitive to detect the effects of different physical properties (thermal conductivity, specific heat capacity) of adherend surface on the nature of the cured adhesive and hence on the mechanical behaviour of the bond-line.     

13C NMR study of presence of uron structures in amino adhesives and relation with wood‐based panels performance

The chemical structure of amino adhesives produced by the strongly acid process was investigated by ¹³C Nuclear Magnetic Resonance spectroscopy. This technique allowed the identification of functional groups and its quantitative determination. Concentration of cyclic polymeric structures (urons) was shown to be related with adhesive performance and with particleboard physico‐mechanical properties and formaldehyde content. Higher urons concentration presented lower viscosity and reactivity. Particleboards produced with resins with lower urons concentration presented lower formaldehyde content, but also lower internal bond strength. Wood‐based panels produced fulfilled E1 class requirements for formaldehyde emissions, indicating that strongly acid process is an alternative to the conventional alkaline–acid process. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 4500–4507, 2013     

Modification of wheat gluten with citric acid to produce superabsorbent materials

Wheat gluten was reacted with citric acid to produce natural superabsorbent materials able to absorb up to 78 times its weight in water. The properties of the modified gluten samples were characterized using Fourier Transform Infra‐red (FTIR) spectroscopy, thermogravimetric analysis, and water uptake. The reaction between gluten and citric acid was examined for gluten : citric acid ratios of 0.38 : 1 to 0.75 : 1 at temperatures from 100 to 130°C. More citric acid reacted for samples containing higher citric acid concentrations and at higher temperatures. FTIR analyses indicated the presence of carboxylate groups on the modified gluten samples, which resulted in modified samples having higher water uptake values than neat gluten. The sample with a gluten:citric acid ratio of 0.5 : 1 and reaction temperature of 120°C had the largest water uptake value. Also, all modified gluten samples had lower thermal stability than neat gluten. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013