排序方式： 共有12条查询结果，搜索用时 0 毫秒
11.
聚酰亚胺基板上的无粘结剂的铜将普遍应用于精细导线和高密度电子互连的领域。医疗、硬盘驱动和COF(chip on flex)应用上往往要求线宽/间距(L/S)为50μm(2mil)或更精细。无粘结剂材料将有利 相似文献
12.
For the profession to advance, software engineering education must improve. The author proposes a conceptual model for achieving this that is founded on the triad of people, process, and technology. He then outlines a sample curriculum based on his model 相似文献