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991.
We study access strategies for decorrelating detection applied in multirate direct-sequence code-division multiple-access (DS/CDMA) systems, including multimodulation (MM), multicode (MC), and variable-spreading-length (VSL) schemes by jointly considering signal constellations and multiple-access interference. The mathematical analysis shows that when the number of active users is large, the MM scheme outperforms MC and VSL schemes especially for high-rate transmission. We also conclude that the design of modulation is important in MC and VSL schemes. Numerical analysis demonstrates that applying 4-PSK instead of 2-PSK in MC and VSL schemes can improve about 9 dB performance gain. In addition, by considering cross-correlation of noise components, we propose a detector that minimizes the symbol error probability under the constraint that the complexity grows linearly with the number of active users as decorrelating detectors. Simulations show that about 4 dB performance gain over conventional decorrelating detectors can be achieved for multirate DS/CDMA communications.  相似文献   
992.
The growth kinetics of an intermetallic compound (IMC) layer formed between Sn-3.5Ag-0.5Cu (SAC) solders and Cu-Zn alloy substrates was investigated for samples aged at different temperatures. Scallop-shaped Cu6Sn5 formed after soldering by dipping Cu or Cu-10 wt.%Zn wires into the molten solder at 260°C. Isothermal aging was performed at 120°C, 150°C, and 180°C for up to 2000 h. During the aging process, the morphology of Cu6Sn5 changed to a planar type in both specimens. Typical bilayer of Cu6Sn5 and Cu3Sn and numerous microvoids were formed at the SAC/Cu interfaces after aging, while Cu3Sn and microvoids were not observed at the SAC/Cu-Zn interfaces. IMC growth on the Cu substrate was controlled by volume diffusion in all conditions. In contrast, IMC growth on Cu-Zn specimens was controlled by interfacial reaction for a short aging time and volume diffusion kinetics for a long aging time. The growth rate of IMCs on Cu-Zn substrates was much slower due to the larger activation energy and the lower layer growth coefficient for the growth of Cu-Sn IMCs. This effect was more prominent at higher aging temperatures.  相似文献   
993.
Transmission efficiency in radio channels can be considerably improved by using multiple transmit and receive antennas and employing a family of schemes called space-time (ST) coding. Both extended range and/or improved bandwidth efficiency can be achieved, compared with a radio link with a single transmit and receive antenna. Bit-interleaved coded modulation schemes give diversity gains on fading channels with higher order modulation constellations combined with conventional binary convolutional codes also for the case of a single transmit and receive antenna radio link. In this paper, we study a family of flexible bandwidth-efficient ST coding schemes which combine these two ideas in a narrowband flat-fading channel and single-carrier modems. We address receiver complexity for the case of a large number of transmit antennas and higher order modulation constellations. Especially, we focus on practical configurations, where the number of transmit antennas is greater than that of receive antennas. Simplified receivers using tentative decisions are proposed and evaluated by means of simulations. Tradeoffs between complexity reduction and performance loss are presented. We emphasize systems that are of particular interest in applications where the number of transmit antennas exceeds the number of receive antennas. A system with four transmit antennas with an eight-fold complexity reduction and a performance loss of about 1 dB is demonstrated  相似文献   
994.
In this paper, we rigorously investigate the energy minimization problem for wireless packet networks with automatic repeat request (ARQ) capability. We first formulate the problem for the single-hop case under constrained packet delay and reliability and derive the necessary and sufficient condition for the optimal transmission power at each ARQ stage. We formulate a global rule of optimal transmission power control that achieves optimality regardless of the delay and reliability constraints. Then we extend it to encompass the multi-hop case by dividing the overall problem into two subproblems-energy determination for each ARQ stage and energy distribution among the constituent nodes. We show that the optimality condition established for the single-hop case is also applicable to solve the energy determination problem in the multi-hop case, rendering an optimal solution to the energy distribution problem. Numerical examples reveal that a significant amount of energy is saved by adopting the optimal transmission power and the performance gain is strongly correlated with the decreasing property of the frame error rate  相似文献   
995.
A novel asymmetric MOSFET with no lightly doped drain on the source side is simulated on bulk Si using a device simulator (SILVACO). To overcome the problems of the conventional asymmetric process, a novel asymmetric MOSFET using a mesa structure and a sidewall spacer gate is proposed, and it provides a self-alignment process, aggressive scaling, and better uniformity. First of all, we have compared the simulated characteristics of the asymmetric and symmetric MOSFETs. Basically, both asymmetric and symmetric MOSFETs have an n-type channel and the same physical parameters. Compared with the symmetric MOSFET, the asymmetric MOSFET shows better device performance. Moreover, we have successfully fabricated 50-nm asymmetric NMOSFETs based on simulation results and investigated its operation and characteristics.  相似文献   
996.
A method of patterning large arrays of organic single crystals is reported. Using single‐walled carbon nanotube (SWNT) bundles as patterned templates, several organic semiconductor materials were successfully patterned, including p‐type pentacene, tetracene, sexiphenylene, and sexithiophene, as well as n‐type tetracyanoquinodimethane (TCNQ). This study suggests that the selective growth of crystals onto patterned carbon nanotubes is most likely due to the coarse topography of the SWNT bundles. Moreover, we observed that the crystals nucleated from SWNT bundles and grew onto SWNT bundles in a conformal fashion. The dependence of the number of crystals on the quantity of SWNT bundles is also discussed. The crystal growth can be directly applied onto transistor source‐drain electrodes and arrays of organic single‐crystal field effect transistors are demonstrated. The results demonstrate the potential of utilizing carbon nanotubes as nucleation templates for patterning a broad range of organic materials for applications in optoelectronics.  相似文献   
997.
One attraction of photonic crystals is the ability to control optical device characteristics by lithographically varying the geometry. In this letter, we demonstrate a 10×10 array of optically pumped two-dimensional (2-D) photonic crystal defect lasers with varying lattice parameters. By adjusting the photonic crystal interhole spacing as well as the hole diameter we are able to tune the laser wavelength from 1500 to 1625 nm on a monolithic InP-InGaAsP wafer. A wavelength resolution of 10 nm from device to device was obtainable, limited by the lithography and etching tolerances of our fabrication method  相似文献   
998.
The design of a two-element antenna for portable transceivers is considered. The antenna consists of a dipole terminated with a parallel loop-capacitor combination. The antenna has a single feed at a point on the loop opposite the junction and does not require external combining circuitry. The capacitor creates a phase shift between the dipole and loop currents, thereby greatly reducing the probability of deep s in the received signal when the antenna is deployed in free-space or in the vicinity of a fixed reflector, where standing wave patterns occur. Theoretical and simulation studies based on multiple incident/reflected plane wave fields typical of multipath environments are used to quantify the reduction in probability. Simulation results are presented for three antenna types: a dipole antenna, a loop-dipole antenna without a capacitor, and the loop-dipole antenna with capacitor. The results are verified by field measurements on an automated outdoor test range, where the incidence angle and distance from the reflector are varied. With a single incident plane wave, the loop-dipole-capacitor (LDC) design reduces the probability of deep s in the received signal by up to two orders of magnitude at low signal-to-noise ratios (SNRs) when compared with the standard dipole antenna and the loop-dipole antenna without the capacitor. The performance advantage of the new design decreases as the number of incident waves increases; however, it performs at least as well as the dipole antenna in all cases studied.  相似文献   
999.
Conventional CMOS charge pump circuits have some current mismatching characteristics. The current mismatch of the charge pump in the PLLs generates a phase offset, which increases spurs in the PLL output signals. In particular, it reduces the locking range in wide range PLLs with a dual loop scheme. A new charge pump circuit with perfect current matching characteristics is proposed. By using an error amplifier and reference current sources, one can achieve a charge pump with good current matching characteristics. It shows nearly perfect current matching characteristics over the whole VCO input range, and the amount of the reference spur is <-75 dBc in the PLL output signal. The charge pump circuit is implemented in a 0.25 μm CMOS process  相似文献   
1000.
A simple model for the Mode I popcorn effect is presented here for packages with rectangular die pad (P-DSO). A package “stability parameter”, relating to its moisture sensitivity, is derived from the popcorn model. It describes the critical factors for a robust package - molding compound properties and package, leadframe design for a given preconditioning and soldering process. Furthermore, nomograms generated from the model enable an easy estimation of moisture sensitivity levels (between 1 and 5) of packages with different die pad sizes and molding compound underpad thicknesses and for different soldering temperatures ranging from 220°C to 260°C (Pb-free soldering).  相似文献   
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