高非线性光纤及其应用

介绍了各种高非线性光纤的原理，并对其在超连续（SC）脉冲的产生和波长变换上的应用作了讨论。     

宣汉——达县地区飞仙关组储层预测方法研究

在宣汉-达县地区,以往仅依据地震属性来预测飞仙关组储层分布,钻探结果与实际情况不符,为此本文提出量化分析预测结合主参数分析的新方法和新思路。在量化分析中首先对飞仙关组储层进行高分辨率反演,获得储能系数图;然后结合主振幅剖面和主频率剖面分析,对储层进行预测。在研究区,本方法的预测结果与实钻情况相吻合。     

工艺空气压缩机组开车过程的思考

通过汽轮机组调速系统伺服马达不复位、主汽门不动作，反推出电磁阀控制线路接线错误，用人为短路压力开关等手段判断出组合油脱扣器活塞卡涩是造成现场延误开车的根本原因，提出完善大机组开车工作票制度、提高人员素质等措施。     

High power mid-infrared optically pumped PbSe/PbSrSe multiple-quantum-well vertical-cavity surface-emitting laser operation at 325 K

A high power, mid-infrared (/spl lambda/=3.8 /spl mu/m) lead-salt vertical-cavity surface-emitting laser (VCSEL) operating at 325 K is demonstrated. The laser emission is generated in a half-wavelength microcavity consisting of seven pairs of PbSe/PbSrSe multiple-quantum-wells embedded in two mirrors and optically pumped with 5 ns laser pulses.     

Existence of solitary waves in a prestressed nonlinear thermoelastic medium with dry friction

V. I. Lenin Belorussian State University, Minsk. Translated from Inzhenerno-fizicheskii Zhurnal, Vol. 62, No. 1, pp. 140–145, January, 1992.     

永州市抗御"碧利斯"台风的实践与思考

受2006年第四号台风“碧利斯”的影响,永州市出现了持续的强降雨过程,部分地区出现了大暴雨,引发了严重的洪涝灾害,成为近年来影响较为严重的一次台风暴雨。永州市在抗御这次台风暴雨过程中,高度警惕,充分准备,周密部署,科学调度,全力以赴抗灾救灾,将灾害损失降到了最低程度,全市没有垮一库一坝,没有因山洪灾害发生人员伤亡。文章总结了永州市的防灾抗灾经验,并针对防御台风暴雨存在的问题,探讨了进一步减轻台风暴雨灾害损失的对策。     

Design, modeling, and hardware correlation of a 3.2Gb/s/pair memory channel

With the rapid advance of silicon process technology, it is now possible to design input/output (I/O) circuits that operate at multigigabit data rates. As a result, accurate modeling and analysis of high-speed interconnect systems is essential to optimize the performance of the overall system. This paper describes the interconnect design, modeling, simulation, and characterization methodologies that are essential to achieve multigigabit data rates. It focuses on the physical layer verification and hardware correlation of functional systems and silicon to ensure robust system operation over 3.2Gb/s data rate using conventional low-cost packaging and printed circuit board (PCB) technologies. In order to capture conductor and dielectric losses, as well as other high-frequency effects of three-dimensional structures, accurate measurement-based simulation techniques that directly incorporate frequency-domain parameters from measurement or electromagnetic solver parameters into circuit simulation tools using fast Fourier transform (FFT) and bandlimiting windowing techniques are developed. Finally, simulation waveforms are correlated with prototypes at both component and system levels in both time and frequency domains.     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.