The structure and properties of a Cr<Subscript>3</Subscript>C<Subscript>2</Subscript>-Ni coating deposited by a high-velocity plasma jet onto a copper substrate

Chromium carbide-nickel coatings were deposited onto a technical grade copper substrate by means of a high-velocity plasma jet of a plasmatron operating in specially selected regimes. An analysis of the coatings showed evidence of the formation of a Ni-based solid solution, a complex chromium carbide (Cr₇C₃), and an fcc crystal phase with a lattice parameter of 3.614 Å. The surface of the coatings exhibits a characteristic relief resulting from a dynamic interaction between melted and fused particles of the initial powder. The local hardness on some areas of the surface and in depth of the coating reaches 66±4.5 HRC, while the coating adhesion strength varies from 25 to 300 MPa.     

Trellis and convolutional precoding for transmitter-based interference presubtraction

This paper studies the combination of practical trellis and convolution codes with Tomlinson-Harashima precoding (THP) for the presubtraction of multiuser interference that is known at the transmitter but not known at the receiver. It is well known that a straightforward application of THP suffers power, modulo, and shaping losses. This paper proposes generalizations of THP that recover some of these losses. At a high signal-to-noise ratio (SNR), the precoding loss is dominated by the shaping loss, which is about 1.53 dB. To recover shaping loss, a trellis-shaping technique is developed that takes into account the knowledge of a noncausal interfering sequence, rather than just the instantaneous interference. At rates of 2 and 3 bits per transmission, trellis shaping is shown to be able to recover almost all of the 1.53-dB shaping loss. At a low SNR, the precoding loss is dominated by power and modulo losses, which can be as large as 3-4 dB. To recover these losses, a technique that incorporates partial interference presubtraction (PIP) within convolutional decoding is developed. At rates of 0.5 and 0.25 bits per transmission, PIP is able to recover 1-1.5 dB of the power loss. For intermediate SNR channels, a combination of the two schemes is shown to recover both power and shaping losses.     

Study of thermal effects and self-heating phenomena in planar power SOI MOS transistors

Heat removal problems, thermal effects, and self-heating phenomena occurring during operation of planar power SOI MOS transistors are considered. Using device-technological simulating methods, the transistor characteristics and safe operation range were studied. It was shown that limitations of the safe operation range are mostly associated with structure self-heating rather than with the parasitic bipolar transistor.     

中国铁通企业信息化战略规划和措施

首先简单回顾了中国铁通成立之初计费管理系统的一期建设和二期扩容后支撑能力的明显不足,以及信息化建设初期各部门独立IT系统运行中的问题,然后较详细介绍了企业信息化规划的整体思路.包括业务系统和流程、组织和业务流程重组、信息技术战略和架构等.并在实践的基础上,列举了信息化系统实施过程中应避免的做法和应注意的事项.     

A new efficient method for one‐pot conversions of aryl carboxylic acids into nitriles without solvent

A new efficient method for synthesising nitriles, important organic reagents, is reported in this paper. In an environmentally benign solvent‐free system, aryl carboxylic acids were converted into the corresponding nitriles via one‐pot reactions, by amidation with ethyl carbamate followed by dehydration with thionyl chloride, in excellent yields. The results showed that the method has the advantages of lower cost, higher yield, less pollution and greater ease of work‐up. Copyright © 2008 Society of Chemical Industry     

Structure and properties of CE/CTBN/EP blends: II. Effect of EP on the mechanical properties and thermostability of the CE/CTBN system

Carboxyl‐terminated butadiene‐acrylonitrile rubber (CTBN) has often been used to improve the toughness of cyanate ester (CE) resin while sacrificing modulus and thermostability. In this paper, the addition of the appropriate amount of epoxy resin (EP) to the CE/CTBN system is shown to not only increase the modulus and thermostability of the blend, but also improve the toughness. The values of impact strength showed a maximum for the CE/CTBN/EP 100/5/5 blend. The temperature of 10 % weight loss (T₁₀) improves from 376 °C for CE/CTBN 100/5 to 407 °C for the CE/CTBN/EP 100/5/2.5 blend. It is proposed that addition of the appropriate amount of EP can decrease the mobility and increase the stability of CTBN via the reaction between the terminal carboxyl group of CTBN and the hydroxyl group of EP. But a very high EP concentration will decrease the crosslinking density of CE, consequently reducing the mechanical properties and thermostability of the blends. Copyright © 2004 Society of Chemical Industry     

Morphology and properties of poly[2‐methoxy‐5‐(2′‐ethyl‐hexyloxy)‐para‐phenylene vinylene]/silica nanoparticle hybrid films

Poly[2‐methoxy‐5‐(2′‐ethyl‐hexyloxy)‐para‐phenylene vinylene] (MEH‐PPV)/silica nanoparticle hybrid films were prepared and characterised. Three kinds of materials were compared: parent MEH‐PPV, MEH‐PPV/silica (hybrid A films), and MEH‐PPV/coupling agent MSMA/silica (hybrid B films), in which MSMA is 3‐(trimethoxysilyl) propyl methacrylate. It was found that the hybrid B films could significantly prevent macrophase separation, as evidenced by scanning electron and fluorescence microscopy. Furthermore, the thermal characteristics of the hybrid films were largely improved in comparison with the parent MEH‐PPV. The UV‐visible absorption spectra suggested that the incorporation of MSMA‐modified silica into MEH‐PPV could confine the polymer chain between nanoparticles and thus increase the conjugation length. The photoluminescence (PL) studies also indicated enhancement of the PL intensity and quantum efficiency by incorporating just 2 wt% of MSMA‐modified silica into MEH‐PPV. However, hybrid A films did not show such enhancement of optoelectronic properties as the hybrid B films. The present study suggests the importance of the interface between the luminescent organic polymers and the inorganic silica on morphology and optoelectronic properties. Copyright © 2004 Society of Chemical Industry