A wavelet transform based POCS Superresolution algorithm

Research interest in multi-frame Superresolution has risen substantially in recent years.This paper presents a modified Projection Onto Convex Set (POCS) superresolution method based on wavelet transform.The method analyzes the image formation model from wavelet multiresolution analysis point of view and defines an closed convex set and its corresponding projection based on wavelet transform.An iterative procedure is utilized to reduce the estimated errors of the result image,and this guarantees the estimated image to lay in the intersection of different convex sets,thus produces a high resolution image with a reduced error.The effectiveness of the algorithm is demonstrated by experimental results.     

The theoretical BER performance analysis of a cooperative diversity scheme in frequency selective fading channel

A novel cooperative diversity scheme based on Distributed Space-Time Block Coding and Multi-Carrier Code Division Multiple Access (DSTBC-MC-CDMA) is proposed which works well in frequency selective fading channels with multiple single-antenna users. And an analytical error model is established to describe the symbol decoding errors between interusers, based on which a close form expression for theoretical Bit Error Rate (BER) performance of the scheme is derived to analyze the influence of the interuser decoding errors on the BER performance of the scheme. Then simulation is complimented to verify the analytic result above, which also shows that the BER performance of DSTBC-MC-CDMA outgoes that of non-cooperative MC-CDMA with considerable gains. Further- more, the simulations coincide with the theoretical results well.     

Efficient implementation of 3D filter for moving object extraction

In this paper the design and implementation of Multi-Dimensional (MD) filter, particularly 3-Dimensional (3D) filter, are presented. Digital (discrete domain) filters applied to image and video signal processing using the novel 3D multirate algorithms for efficient implementation of moving object extraction are engineered with an example. The multirate (decimation and/or interpolation) signal processing algorithms can achieve significant savings in computation and memory usage. The proposed algorithm uses the mapping relations of z-transfer functions between non-multirate and multirate mathematical expressions in terms of time-varying coefficient instead of traditional polyphase de- composition counterparts. The mapping properties can be readily used to efficiently analyze and synthesize MD multirate filters.     

New method of formation design for both GMTI and InSAR using distributed satellites

This letter proposes a method for designing a specific formation of satellites where the flying motion only exists in a circle orbit plane of the reference satellite, which means that the orbit eccen- tricity is zero. This method combines the Hill equation, the Kepler equation, and the geometrical meaning of orbit elements. It creates the redundancy condition to simplify the deducing process, utilizes multiple conditions to solve the orbit elements for the satellite formation, and obtains the analytical relationship of the orbit elements for the formation satellites with the formation parameters and the orbit elements of the reference satellite. Using these formulations, the orbit elements and formation parameters for the formation satellites can be solved for the given orbit elements of the reference satellite. The letter describes the proposed double-ellipse formation for both GMTI and InSAR, and the validity of the formation is demonstrated via simulation.     

DWT based HMM for face recognition

A novel Discrete Wavelet Transform (DWT) based Hidden Markov Module (HMM) for face recognition is presented in this letter. To improve the accuracy of HMM based face recognition algorithm, DWT is used to replace Discrete Cosine Transform (DCT) for observation sequence ex- traction. Extensive experiments are conducted on two public databases and the results show that the proposed method can improve the accuracy significantly, especially when the face database is large and only few training images are available.     

A 4th order fully integrated active RC complex filter with novel automatic tuning systems

This letter introduces a 4th order active RC complex filter with 1.5MHz center frequency and 1MHz bandwidth. The total harmonic distortion of the filter is less than –60dB and the image rejection ratio is greater than 60dB. A novel technique is also proposed in this letter to automatically adjust the variation of the time constant. The advantages of the proposed method are its high precision and simplicity. Using 5bits control words, the tuning error is less than ±1.6%.     

Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop

The moisture diffusion in globtop material for a chip-on-board (COB) package coated with SiN_x and silicone, respectively, or coated with SiN_x plus silicone were measured by embedding a humidity sensor in the globtop and recording the capacitive change in three different temperature/humidity environments. The experimental results were simulated by Fick’s diffusion law with finite-element method modeling. The moisture diffusion coefficients and activation energies were calculated to quantitatively compare the moisture-resistance effects of different coatings. For example, at 85°C/85% RH, the moisture diffusion coefficients for the uncoated reference, SiN_x-coated, silicone-coated, and silicone/SiN_x double-layered coated samples are 1E-5, 0.8E-5, 0.7E-5, and 0.2E-5 mm²/s, respectively. The experimental and simulation results show that double-layered coating with silicone/SiN_x has excellent moisture-resistance properties because it not only smoothes the steps on a printed circuit board (PCB) but also keeps the good moisture resistance of the inorganic films.     

Aging study on interfacial microstructure and solder-ball shear strength of a wafer-level chip-size package with Au/Ni metallization on a Cu pad

Eutectic solder balls (63Sn-37Pb) joined to Cu pads with an Au/Ni metallization have been widely used in wafer-level chip-size package (WLCSP) technology for providing electrical and mechanical interconnections between components. However, some reliability issues must be addressed regarding the intermetallic compounds (IMCs). The formation of a brittle IMC layer between the solder/Cu pad interface impacts considerably upon the solder-ball shear strength. In addition, it will degrade the long-term operating reliability of the WLCSP. This study investigates, by means of experiments, the growth of the IMC layer under isothermal aging for the eutectic Sn-Pb solder reflowed on a Cu pad with an Au/Ni metallization. Forming the Cu pad with an Au/Ni metallization was achieved by a simple semiconductor-manufacturing process. The effects of the intermetallic layer on solder-ball shear strength were examined for various parameters, including the thickness of the Au layer, solder-ball size, and the diameter of the Cu pad. Experimental results indicate that two IMC layers, Au_0.5Ni_0.5Sn₄ and Ni₃Sn₄, form at the solder/Cu pad interface after aging. The Au_0.5Ni_0.5Sn₄ intermetallic layer dominates the total thickness of the IMC layer and grows with aging time while the solder-ball shear strength decreases after aging. The degradation of the solder-ball shear strength was found to be caused mainly by the formation of the Au_0.5Ni_0.5Sn₄ layer. The experimental results established that a thinner Au layer on Cu pad can effectively control the degradation of solder-ball shear strength, and this is especially true for smaller ball sizes.     

Process windows for low-temperature Au wire bonding

The process windows are presented for low-temperature Au wire bonding on Au/Ni/Cu bond pads of varying Au-layer thicknesses metallized on an organic FR-4 printed circuit board (PCB). Three different plating techniques were used to deposit the Au layers: electrolytic plating, immersion plating, and immersion plating followed by electrolytic plating. Wide ranges of wire bond force, bond power, and bond-pad temperature were used to identify the combination of these processing parameters that can produce good wire bonds, allowing the construction of process windows. The criterion for successful bonds is no peel off for all 20 wires tested. The wire pull strengths and wire deformation ratios are measured to evaluate the bond quality after a successful wire bond. Elemental and surface characterization techniques were used to evaluate the bond-pad surfaces and are correlated to wire bondability and wire pull strength. Based on the process windows along with the pull strength data, the bond-pad metallization and bonding conditions can be further optimized for improved wire bondability and product yields. The wire bondability of the electrolytic bond pad increased with Au-layer thickness. The bond pad with an Au-layer thickness of 0.7 μm displayed the highest bondability for all bonding conditions used. The bondability of immersion bond pads was comparable to electrolytic bond pads with a similar Au thickness. Although a high temperature was beneficial to wire bondability with a wide process window, it did not improve the bond quality as measured by wire pull strength.     

Mechanical strength of Sn-3.5Ag-based solders and related bondings

The tensile strengths of bulk solders and joint couples of Sn-3.5Ag-0.5Cu, Sn-3.5Ag-0.07Ni, and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge solders and the shear strengths of ball grid array (BGA) specimens, solder-ball-attached Cu/Ni/Au metallized substrates were investigated. The tensile strength of the bulk is degraded by thermal aging. The Ni-containing solder exhibits lower tensile strength than Sn-3.5Ag-0.5Cu after thermal aging. However, the Ni-containing solder joints show greater tensile strength than the Cu/Sn-3.5Ag-0.5Cu/Cu joint. Fracture of the solder joint occurs between the intermetallic compound (IMC) and the solder. The shear strength and fracture mechanism of BGA specimens are the same regardless of solder composition.