3G手机的市场与发展趋势

一、引言 第三代移动通信主要是在传输声音和数据的速度上的提升，它能够处理图像、音乐、视频流等多种媒体形式，提供包括网页浏览、电话会议、电子商务等多种信息服务。     

科学有序地发展调频同步广播

２００１年７月７日～８日,国家广电总局科技司在杭州召开《调频同步广播试点验收暨技术研讨会》,通过了浙江人民广播电台实施的“杭甫高速公路沿线调频同步广播应用试验” 的验收。验收后,郭炎生司长在会上讲话,既肯定了浙江的应用试验工作所取得的成绩,又对下一步调频同步广播的进一步研究试验和发展作了工作部署。该试验项目通过验收,标志着我国调频同步广播已走向了实用阶段。江澄主编为此撰文,回顾了我国调频广播发展历程,强调“科学、有序”是今后我国调频广播发展的关键。本期我们专门组织了一组这方面的专题文章以飨读者。     

毫米波GaAs pin单刀单掷开关单片

采用GaAs pin二极管,完成了15～40GHz的单刀单掷开关单片的设计、制作.GaAs pin二极管SPST开关单片具有低插损、高隔离、高功率的特点,在15～20GHz带内插损0.6dB,驻波优于1.5,隔离度大于40dB;在20～40GHz带内插损小于1.1dB,驻波优于1.35,隔离度大于35dB.pin二极管SPST开关单片的1dB功率压缩点P-1大于2W.GaAs pin二极管开关单片采用MOCVD生长的GaAs 纵向pin二极管材料结构,76mm GaAs圆片工艺加工制作.     

Effects of underfill materials on the reliability of low-K flip-chip packaging

The reliability of low-K flip-chip packaging has become a critical issue owing to the low strength and poor adhesion qualities of the low-K dielectric material when compared with that of SiO₂ or fluorinated silicate glass (FSG). The underfill must protect the solder bumps and the low-K chip from cracking and delamination. However, the material properties of underfill are contrary to those required for preventing solder bumps and low-K chip from cracking and delamination. This study describes the systematic methodologies for how to specify the adequate underfill materials for low-K flip-chip packaging. The structure of the test vehicle is seven copper layers with a low-K dielectric constant value of 2.7-2.9, produced by the chemical vapor deposition (CVD) process. Initially, the adhesion and the flow test of the underfill were evaluated, and then the low-K chip and the bumps stress were determined using the finite element method. The preliminary screened underfill candidates were acquired by means of the underfill adhesion and flow test, and balancing the low-K chip and the bumps stress simulation results. Next, the low-K chips were assembled with these preliminary screened underfills. All the flip-chip packaging specimens underwent the reliability test in order to evaluate the material properties of the underfill affecting the flip-chip packaging stress. In addition, the failed samples are subjected to failure analysis to verify the failure mechanism. The results of this study indicate that, of the underfill materials investigated, those with a glass transition temperature (T_g) and a Young’s modulus of approximately 70–80 °C and 8–10 GPa, respectively, are optimum for low-K flip-chip packaging with eutectic solder bumps.     

Stable,Superhydrophobic, and Conductive Polyaniline/Polystyrene Films for Corrosive Environments

A polyaniline/polystyrene composite film with a lotus‐leaf‐like structure is prepared via a simple electrospinning method. The film shows stable superhydrophobicity and conductivity, even in many corrosive solutions, such as acidic or basic solutions over a wide pH range, and also in oxidizing solutions. The special surface composition and morphology are the two important aspects that induce such unusual properties. The polystyrene content can strongly influence the morphology of the composite films, which thus display different superhydrophobicities and conductivities.     

Inside Front Cover: Three‐Dimensionally Ordered Gold Nanocrystal/Silica Superlattice Thin Films Synthesized via Sol–Gel Self‐Assembly (Adv. Funct. Mater. 7/2006)

The synthesis of three‐dimensionally ordered, transparent gold‐nanocrystal (NC)/silica superlattice thin films using the self‐assembly (by spin‐coating) of water‐soluble gold nanocrystal micelles and soluble silica is reported by Fan and co‐workers on p. 891. The robust, 3D NC/silica superlattice films are of interest for the development of collective optical and electronic phenomena, and, importantly, for the integration of NC arrays into device architectures. Nanocrystals and their ordered arrays hold many important applications in fields such as catalysis, surface‐enhanced Raman spectroscopy based sensors, memory storage, and electronic and optical nanodevices. Herein, a simple and general method to synthesize ordered, three‐dimensional, transparent gold nanocrystal/silica superlattice thin films by self‐assembly of gold nanocrystal micelles with silica or organosilsesquioxane by spin‐coating is reported. The self‐assembly process is conducted under acidic sol–gel conditions (ca. pH 2), ensuring spin‐solution homogeneity and stability and facilitating the formation of ordered and transparent gold nanocrystal/silica films. The monodisperse nanocrystals are organized within inorganic host matrices as a face‐centered cubic mesostructure, and characterized by transmission electron spectroscopy and X‐ray diffraction.     

Pilot power minimization with coverage and locatability constraints in CDMA systems

Position location (PL) of a UE requesting E-911 services should be provided by wireless communication service providers, according to the Federal Communications Commission (FCC) regulations. Raising pilot power fraction can improve the system locatability, while it may also cause pilot pollution and increase interference to UEs in neighboring cells. In this letter we find the optimal pilot power allocation subject to coverage and locatability constraints. The results have shown that with new localization techniques such as idle period downlink (IPDL) and cumulative virtual blanking (CVB), the coverage and locatability constraints can be satisfied without requiring long integration time and large pilot power fraction.     

光电探测器的激光破坏（损伤）阈值分析

本文系统收集各种光电探测器及其相似材料在受到激光辐照时所导致的软、硬破坏效应（有时称为激光损伤）,综合对比分析各种破坏阈值的大小,为激光与光电探测器相互作用的研究提供一个较为全面系统的参考。     

LP-MOCVD生长InGaAlP外延层In组分控制的动力学分析

本文分析了低压转盘ＭＯＣＶＤ生长室中气流的流动特征,首次提出了在高温（７００℃左右）下生长ＩｎＧａＡｌＰ外延层时,抑制Ｉｎ组分脱吸附的“动压力模型”．解释了托盘转速和生长压力等生长参数对Ｉｎ组分控制的影响．     

软件无线电中直接波形合成的研究

直接数字频率合成（DDS）是一种新型的频率合成技术。介绍了如何利用DDS技术来产生调频波形及其他的数字调制波形;阐述了一种新的适合于软件无线电实现的算法,即采用预先计算后存贮在贮存器中的波形来代替实时运算,直接合成数字调制波形（DWS）;研究了一种压缩查找表的方法。此外,还对此算法在实现过程中遇到的截断误差、运算量和存贮量的问题进行了探讨。对于所提及的算法,给出了仿真结果。