半导体激光器退化及其筛选

文章概述了半导体激光器失效因素，退化行为及改进可靠性的措施，特别就可靠性问题进行了讨论，指出用电导数参数对半导体激光器进行可靠性筛选和评估是一个行之有效的办法。     

新的非平面Flash Memory结构

提出了一种为在低压下工作的具有较快编程速度的新的非平面的flash memory单元结构,该结构采用简单的叠栅结构并只需增加一步光刻制做出这一新的沟道结构.对于栅长为1.2μm flash单元,获得了在Vg＝15V,Vd＝5V条件下编程时间为42μs,在Vg＝-5V,Vs＝8V条件下的擦除时间为24ms的高性能flash单元,这一新结构的编程速度比普通平面型快闪存储器要快很多.这种新结构flash单元在高速应用场合下具有很好的应用前景.     

基于F型管壳的旋转缝焊技术研究

本文深入研究了旋转缝焊技术,讨论了缝焊中焊边受力、速度变化和热量分布情况,分析了影响旋转缝焊气密性的主要因素.     

Stretchable Anti-Fogging Tapes for Diverse Transparent Materials

Surface wetting prevents surface fogging on transparent materials by facilitating filmwise condensation with specific chemistry, but suffers from material and geometry selectivity. Extreme environments associated with high humidity and mechanical loading further limit their anti-fogging persistence. Here, a stretchable anti-fogging tape (SAT) that can be applied to diverse transparent materials with varied curvatures for persistent fogging prevention is reported. The SAT consists of three synergistically combined transparent layers: i) a stretchable and tough layer with large elastic recovery, ii) an endurant anti-fogging layer insensitive to ambient humidity, and iii) a robustly and reversibly adhesive layer. The SAT maintains high total transmittance (>90%) and low diffuse transmittance (<5%) in high-humidity environments, under various modes of mechanical deformations, and over a prolonged lifetime (193 days tested so far). Two applications are demonstrated, including the SAT-adhered eyeglasses and goggles for clear fog-free vision, and the SAT-adhered condensation cover for efficient solar-powered freshwater production.     

Effects of annealing on the electric noise in semiconductor lasers

Thirty high-power quantum well semiconductor lasers of 808 nm wavelengths are aged at 18 ± 2 °C and 0.5 A. By measuring the variety of device noise before and after aging, it is found that the noise decreases after aging for 100 and 1000 h; moreover, the noise decreasing range of the failed device after aging is obviously higher than that of the good device. In addition, the noise characteristics of the failure device have some change, and the g–r noise occurs after aging. The investigation shows that it is due to the different behavior of the different kinds of defects during annealing.     

基于物联网技术的柔性管道巡检机器人

介绍了一种基于“物联网传感器”技术,具有强大信息传输功能的智能管道巡检机器人。该型智能管道巡检机器人主要运用于建筑领域,为施工过程中的“管道布设”、“基坑监测”及“重点管线巡查”提供硬件支持。该型机器人集“智能数据采集”、“智能数据分析”、“智能管内巡检”等功能于一身,能够满足全天候值守巡检的要求。同时,应用 “总线设计”及“模块化设计”的思路,使该型检测设备能够与各种类型的专用传感系统进行结合,方便检测人员根据现场的实际需求,随时组装出具有相应功能的管道巡检机器人。     

Analytical model of a superluminescent diode

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基于Nelder-Mead优化的PEMFC三阶RQ等效电路参数辨识研究

精确、有效的燃料电池等效电路有助于分析燃料电池内部工作情况,确保燃料电池系统稳定可靠地运行。针对燃料电池内部工作状态无法使用传感器精确监测的问题,提出了基于Nelder-Mead优化算法的PEMFC 3阶RQ等效电路参数辨识方法 ,根据电池工作原理建立3阶RQ非线性等效电路模型,将模型参数与实际物理意义相结合建立复数域下的实部、虚部加权目标函数,最后在电化学交流阻抗谱实验的基础上进行参数辨识研究。研究结果表明:在相同初始条件下,Nelder-Mead优化算法在精度、速度上与最小二乘法相当,但抗干扰能力更强;与遗传算法相比,精度相当但速度更高,可以用于燃料电池的在线参数辨识。     

Throughput Optimization via Association Control in Wireless LANs

With the rapid development of the mobile computing, accessing the Internet everywhere is important for mobile device users. Wireless LAN is a stable and reliable technique to provide network access for mobile devices. The Wireless LAN Access Points(APs) have been densely deployed so that a user can access the Internet almost everywhere. However, this fact brings some new challenges. Since the regular AP association strategy is signal-based when a user receive the signals of multiple APs. The APs with strong signal will be too overloaded while the bandwidth resource in other APs is wasted. The throughput of the whole WLAN is not optimized. Moreover, the diverse bandwidth demands among users further exacerbate the situation. In this paper, aiming at optimizing the throughput over the whole WLAN, a joint AP association and bandwidth allocation problem is formulated. The different users’ bandwidth demands are added as new constraints. We comprehensively analyze the solution space and prove the problem NP-hard. Our trace-driven evaluations show that the throughput is improved about 23.1 % compared to the conventional schemes.     

Fabrication of a 100%fill-factor silicon microlens array

正A simple method has been developed for the fabrication of a silicon microlens array with a 100%fill factor and a smooth configuration.The microlens array is fabricated by using the processes of photoresist(SU8- 2005) spin coating,thermal reflow,thermal treatment and reactive ion etching(RIE).First,a photoresist microlens array on a single-polished silicon substrate is fabricated by both thermal reflow and thermal treatment technologies. A typical microlens has a square bottom with size of 25μm,and the distance between every two adjacent microlenses is 5μm.Secondly,the photoresist microlens array is transferred to the silicon substrate by RIE to fabricate the silicon microlens array.Experimental results reveal that the silicon microlens array could be formed by adjusting the quantities of the reactive ion gases of SF_6 and O_2 to proper values.In this paper,the quantities of SF_6 and O_2 are 60 sccm and 50 sccm,respectively,the corresponding etch ratio of the photoresist and the silicon substrate is 1 to 1.44.The bottom size and height of a typical silicon microlens are 30.1μm and 3μm,respectively. The focal lengths of the microlenses ranged from 15.4 to 16.6μm.