This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps. 相似文献
Information storage system that has a potentially ultrahigh storage density based on the principles of atomic force microscopy (AFM) has been developed. Micro-electro-mechanical systems (MEMS) technology plays a major role in integration and miniaturization of the standard AFM. Its potential application for ultrahigh storage density has been demonstrated by AFM with a piezoresponse mode to write and read information bits in ferroelectric Pb(Zr(x)Ti(1 - x))O3 films. With this technique, bits as small as 40 nm in diameter have been achieved, resulting in a data storage density of simply more than 200 Gb/in2. Retention loss phenomenon has also been observed and investigated by AFM in the piezoresponse mode. Finally, local piezoelectric measurements of PZT films by different processing technologies are discussed in detail. 相似文献
We report on two additional cases of metformin‐associated encephalopathy in patients with end‐stage renal disease (ESRD) undergoing hemodialysis. Two patients were seen at our hospital with abnormal neurological signs and symptoms. Magnetic resonance imaging (MRI) revealed the same pattern of high signal intensity in both basal ganglia in T2‐weighted images in the two patients. The two patients had started taking metformin 5 and 6 weeks earlier at the same dose of 1000 mg per day. Metformin was immediately stopped, and regular hemodialysis was conducted. Their signs and symptoms resolved completely after these measures. The high signal intensity in both ganglia in T2‐weighted MRI also disappeared. We should suspect metformin‐induced encephalopathy and withdraw the drug when presented with diabetic patients with chronic kidney disease and neurological signs and symptoms of unknown cause. 相似文献
This paper describes the design process for an automobile crumple zone for pedestrian protection. The impact load and bending moments predicted by impact analysis were used to design a plastic structure that may help reduce pedestrian injuries to the thigh area. The fracture effect was incorporated into the model by calculating the damage to the plastic material during impact, and the analysis was conducted under the European New Car Assessment Program (Euro NCAP) test conditions, using the upper legform developed by ESI Corporation. In addition, the values predicted by the analysis were validated by comparison with results of actual impact tests. 相似文献
Several different kinds of ordered mesoporous alumina (OMA)-supported and Ni-doped OMA-supported Ni catalysts have been prepared for catalytic partial oxidation of methane (CPOM) to produce hydrogen and CO gas mixture. The Ni metal was incorporated in various ways of the impregnation, the doping, and the partial doping followed by impregnation. The prepared OMA-supported catalysts showed a wormhole-like, pseudo-hexagonal structure. By incorporating Ni in the OMA matrix during synthesis of supports, the resulting catalysts showed better-distributed and less-sintered nanocrystals even after CPOM at elevated temperature for over 100 h. By employing the partial doping of Ni followed by impregnation of Ni, the prepared CPOM catalyst was found more productive due to the well-distributed and well-anchored Ni nanocrystals inside the OMA matrix and the confined ordered mesopores as well. Through the test under non-stoichiometric feed ratio, the catalyst prepared only by impregnation was found vulnerable to carbon deposition and deactivated more rapidly. Even worse, the formation rate of carbon deposition was so fast that the test could not be conducted due to the increased pressure difference. In contrast, the highly distributed Ni nanocrystals partially or fully utilizing doping were found to have stronger resistance to carbon deposition. 相似文献
The printability of patterns for printed electronic devices determines the performance, yield rate, and reliability of the devices; therefore, it should be assessed quantitatively. In this paper, parameters for printability assessment of printed patterns for width, pinholes, and edge waviness are suggested. For quantitative printability assessment, printability grades for each parameter are proposed according to the parameter values. As examples of printability assessment, printed line patterns and mesh patterns obtained using roll-to-roll gravure printing are used. Both single-line patterns and mesh patterns show different levels of printability, even in samples obtained using the same printing equipment and conditions. Therefore, for reliable assessment, it is necessary to assess the printability of the patterns by enlarging the sampling area and increasing the number of samples. We can predict the performance of printed electronic devices by assessing the printability of the patterns that constitute them.
Die quenching of AA2024 aluminum alloy billets was carried out on a servo press with ram-motion control of WC-20 mass%Co dies directly after solution heat treatment (SHT). To clarify the dependence on billet size for die quenching, two billets with a height of h0 = 8 mm or 16 mm and with the same diameter of 16 mm were prepared. The cylindrical billets were heated in an electric furnace at 823 K and transferred to the press. Then the billets were uniaxially compressed with a reduction in height (Δh/h0) of 2% or 5%, and further held between the dies. The sandwiching duration by dies (td.q.) was varied from 0 to 8 s. Based a measured temperature change, hardness and TG–DTA analysis, it is found that die quenching is successfully carried out without precipitation hardening only in the case of the billet with a height of 8 mm and td.q. > 6 s. The reduction in height is limited less than 5% by intergranular fracture on side surface of billet during the die quenching process. 相似文献
Food Science and Biotechnology - Despite with accumulating evidences on the anti-diabetic effects of mulberry branch (MB), the major active component for the activity has not been known. Oral... 相似文献