Analysis of the Scattering Characteristic of Several Waveguide Components Using Boundary Element Method

Several kinds of waveguide components such as curved waveguide bends, arbitrary angle waveguide bends and T-junctions have been analyzed with boundary element method in this paper. A new discretization method for the boundary element method to solve the waveguide discontinuities has been given. The numerical results obtained agree well with the experimental results and numerical results in other literature. Especially, the scattering characteristics of Forded E-, H-plane T-junctions in 3mm band have been analyzed using boundary element method and the calculation results are presented.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Finding structure in audio for music information retrieval

This paper presents a brief overview of recent approaches to two problems in music information retrieval: query by example and automated source separation. It describes the challenges inherent in musical query by example and the systems that take very different approaches to the problem. The paper also explores approaches to source separation in a musical context, focusing on systems that take distinct approaches to the problem. Finally, it comments about the future directions for digital signal processing (DSP) research in the context of music information retrieval.     

Protecting local access telecommunications networks: Toward a minimum-cost solution

The problem of designing fibre-optic networks for local-access telecommunications generates (at least) three non-trivial subproblems. In the first of these subproblems one must determine how many fibre-optic cables (fibres) are required at either end of a street. In the next subproblem a minimum-cost network must be designed to support the fibres. The network must also provide distinct paths from either end of the street to the central exchange(s). Finally, the fibre-optic cables must be placed in protective covers. These covers are available in a number of different sizes, allowing some flexibility when covering each section of the network. In this paper we describe a dynamic programming (DP) formulation for finding a minimum-cost (protective) covering for the network (the third of the subproblems). This problem is a generalised set covering problem with side constraints and is further complicated by the introduction of fixed and variable welding costs. The DP formulation selects covers along each arc (in the network), but cannot exactly model the fixed costs and so does not guarantee optimality. We also describe an integer programming (IP) formulation for assessing the quality of the DP solutions. The cost of the networks constructed by the IP model is less than those designed using the DP model, but the saving is not significant for the problems examined (less than 0.1%). This indicates that the DP model will generally give very good solutions. Furthermore, as the problem dimensions grow, DP gives significantly better solution times than IP.     

Nonlinear crack dynamics and scaling aspects of fracture (experimental and theoretical study)

Nonlinear dynamics of crack propagation are investigated experimentally and theoretically with the goal of clarifying the nature of limiting crack velocity, the transition from steady state to branching regimes of crack dynamics, and the dynamics of crack arrest. The theoretical explanation of limiting steady-state crack velocity and the transition to a branching regime was proposed due to the study of collective behavior of a microcrack ensemble at the crack tip area. The experimental study of crack dynamics was carried out in a preloaded plate PMMA specimen using the high-speed camera coupled with the photo-elasticity method, the point stress recording with a laser system, and the failure surface roughness measurement.     

Fabrication, assembly, and characterization of molecular electronic components

One of the ultimate miniaturizations in nanotechnology is molecular electronics, where devices will consist of individual molecules. There are many complications associated with the use of molecules in electronic devices, such as the electronic perturbations in the molecule associated with being bonded to an electrode, how electrons traverse the metal-molecule junction, and the difficulty of macroscopically addressing single to very few molecules. Whether fabricating a test structure or a usable device, the use of self-assembly is fundamental to the fabrication of molecular electronic devices. We will discuss how to fabricate self-assembled monolayers into test assemblies and how to use intermolecular interactions to direct molecules into desired positions to create nanostructures and to connect functional molecules to the outside world. These assemblies serve as test structures for measurements on single or bundled molecules. The development of several experimental techniques, including various scanning probes, mercury drop junctions, break junctions, nanopores, crossed wires, and other techniques using nanoparticles have enabled the ability to test these structures and make reproducible measurements on single molecules. Many of these methods have been developed to test molecules with potential for integration into devices such as oligo (phenylene-ethynylene) molecules and other /spl pi/-conjugated molecules, in ensemble or single-molecule measurements.     

On optimal sequential prediction for general processes

This paper considers several aspects of the sequential prediction problem for unbounded, nonstationary processes under pth power loss /spl lscr//sub p/(u,v)=|u-v|/sup p/, 1相似文献   

Kinetic Characteristics of Amino Acid Salt Crystallization in Methanol‐Water System

Nucleation and growth mechanisms and kinetics of crystals of an amino acid salt were investigated in a methanol‐water system by measuring and evaluating the induction time as a function of the supersaturation ratio and temperature in batch salting out crystallization experiments. Discrimination between the possible crystallization mechanisms, and estimation of the kinetic parameters were carried out using nonlinear parameter identification. The results concerning the growth mechanism obtained were checked additionally by measuring the induction time as a function of number density of seed crystals.     

Stability analysis of a feedback-controlled resonant DC-DC converter

This paper reports on the stability analysis of one member of a dual-channel resonant DC-DC converter family. The study is confined to the buck configuration in symmetrical operation. The output voltage of the converter is controlled by a closed loop applying constant-frequency pulsewidth modulation. The dynamic analysis reveals that a bifurcation cascade develops as a result of increasing the loop gain. The trajectory of the variable-structure piecewise-linear nonlinear system pierces through the Poincare plane at the fixed point in state space when the loop gain is small. For stability criterion the positions of the characteristic multipliers of the Jacobian matrix belonging to the Poincare map function defined around the fixed point located in the Poincare plane is applied. In addition to the stability analysis, a bifurcation diagram is developed showing the four possible states of the feedback loop: the periodic, the quasi-periodic, the subharmonic, and the chaotic states. Simulation and test results verify the theory.     

From Poldhu to the Italian station of Coltano: Marconi and the first years of transcontinental wireless

This paper presents the evolution of low-frequency, high-power transcontinental transmission, starting from the first successful transatlantic link from Poldhu up to the Italian transcontinental station of Coltano. The trend toward higher and higher transmitting power, and the dead end into which wireless was heading if it were not for research in the higher frequency ranges, are pointed out.