Control of the leakage current in SrTiO3 films by acceptor doping

Stoichiometric SrTiO3 (STO) films doped with Fe or Cr were prepared by r.f. magnetron sputtering technique. The effects of Fe or Cr doping in the SrTiO3 films were studied on the leakage current property which was discussed by defect chemistry. The experimental results can be explained by a model in which oxygen vacancies are the key defects responsible for the leakage current. Acceptor doping, with a small concentration of Fe or Cr, has led to a substantial improvement to 10–9 order in the leakage current density. Above the concentration of 0.010.02 mol% Fe2O3, Cr2O3, however, as the concentration increased, the leakage current increased. These acceptors in Ti4+ site are expected to electrically compensate for donor species such as oxygen vacancies, thereby reducing the concentration of mobile carriers that contribute to electrical conduction. Consequently, acceptor doped STO films have been shown to be superior to undoped films for applications requiring high leakage resistance, such as dynamic random access memory capacitors. © 1998 Chapman & Hall     

Thermal conductivity of CVD diamond films

Diamond films 60 and 170 µm in thickness were grown by PACVD (plasma-assisted chemical vapor deposition) under similar conditions. The thermal diffusivity of these freestanding films was measured between 100 and 300 K using AC calorimetry. Radiation heat loss from the surface was estimated by analyzing both the amplitude and the phase shift of a lock-in amplifier signal. Thermal conductivity was calculated using the specific heat data of natural diamond. At room temperature, the thermal conductivity of the 60 and 170 m films is 9 and 16 W-cm^–1. K^–1 respectively, which is 40–70% that of natural diamond, The temperature dependence of thermal conductivity of the CVD diamond films is similar to that of natural diamond, Phonon scattering processes are considered using the Debye model, The microsize of the grain boundary has a significant effect on the mean free path of phonons at low temperatures. The grain in CVD diamond film is grown as a columnar structure, Thus, the thicker film has the larger mean grain size and the higher thermal conductivity. Scanning electron microscopy (SEM) and Raman spectroscopy were used to study the microstructure of the CVD diamond films. In this experiment, we evaluated the quality of CVD diamond film of the whole sample by measuring the thermal conductivity.Paper presented at the Twelfth Symposium on Thermophysical Properties, June 19–24, 1994, Boulder, Colorado, U.S.A.     

Critical point analysis using domain lifting for fast geometry queries

In this paper, a general scheme for solving coherent geometric queries on freeform geometry is presented and demonstrated on a variety of problems common in geometric modeling. The underlying strategy of the approach is to lift the domain of the problem into a higher-dimensional space to enable analysis on the continuum of all possible configurations of the geometry. This higher-dimensional space supports analysis of changes to solution topology by solving for critical points using a B-spline-based constraint solver. The critical points are then used to guide fast, local methods to robustly update repeated queries. This approach effectively combines the speed of local updates with the robustness of global search solutions. The effectiveness of the domain lifting scheme (DLS) is demonstrated on several geometric computations, including accurately generating offset curves and finding minimum distances. Our approach requires a preprocessing step that computes the critical points, but once the topology is analyzed, an arbitrary number of geometry queries can be solved using fast local methods. Experimental results show that the approach solves for several hundred minimum distance computations between planar curves in one second and results in a hundredfold speedup for trimming self-intersections in offset curves.     

A new vertical‐alignment LC mode with high‐transmittance and fast‐response‐time features

Abstract— A novel pixel design for vertical‐alignment LCDs with superior transmittance has been developed. The new liquid‐crystal mode, refered to as the hole‐induced vertical‐alignment mode (Hi‐VA), uses a via hole of an organic layer on a TFT substrate to achieve multi‐domain alignment. Compared to the conventional design, the Hi‐VA mode has a transmittance of up to 135% with a contrast ratio of 2000:1. Moreover, the new structure is free from ITO patterning or protrusion on the color‐filter side, which makes the fabrication process simple and low cost.     

Simulation framework for small scale engagement

Developing future weapons systems has become increasingly complicated and costly. The armed forces of major nations use modeling and simulation techniques for new weapons systems from the conceptual stage to design, production, deployment and training stages to shorten the development cycle and guarantee their effectiveness. Failure in the development cycle carries too much loss in time and money. Therefore, computer-based modeling and simulation techniques are applied from the conceptual stage to gauge the efficacy of new weapons systems. The objective of this study is to develop a modeling and simulation methodology for small scale engagement using the DEVS formalism. The entities required for modeling and simulation are divided into three categories: combat, logical, and environmental entities. Combat entities represent the military hardware or combatants; logical entities represent the judgment and decision entities for the interaction between various entities; and environmental entities emulate the constituents of real combat environment. The combat entities are further modeled into Shell and Core Parts to maximize their reusability under various combat scenarios. The proposed framework is verified using a one-on-one combat engagement simulation (written in C++) between two submarines.     

Nanotextured superhydrophobic micromesh

A superhydrophobic micromesh covered with nanoprotrusions has been introduced and its applicability to a waterproof mobile phone speaker has been evaluated. The nanotextured superhydrophobic micromesh showed excellent water repellency, self-cleaning and waterproofing performances. In a waterproof speaker test using the fabricated nanotextured micromesh, the micromesh did not lose its waterproof function at 2 m water depth and did not form a remnant water film after being removed from the water. The packaged speaker showed almost the same sound quality before and after dipping at a 2 m water depth. These results demonstrate that the superhydrophobic nanotextured micromesh could be directly applicable for various products that need to resist water penetration, yet allow the transmission of gases and sound/light waves.     

A small‐area and low‐power data driver IC using two‐stage DAC with a capacitor array for active matrix flat‐panel displays

A small‐area and low‐power data driver integrated circuit (IC) using a two‐stage digital‐to‐analog converter (DAC) with a capacitor array is proposed for active matrix flat‐panel displays. The proposed data driver IC employs a capacitor array in the two‐stage DAC so as to reduce the DAC area and eliminate the need for a resistor string, which has high‐power consumption. To verify the proposed two‐stage DAC, a 20‐channel data driver IC with the proposed 10‐bit two‐stage DAC was fabricated using a 0.18‐μm complementary metal–oxide–semiconductor process with 1.8 and 6 V complementary metal–oxide–semiconductor devices. The proposed 10‐bit two‐stage DAC occupies only 43.8% of the area of a conventional 10‐bit two‐stage DAC. The measurement results show that the differential nonlinearity and integral nonlinearity are +0.58/?0.52 least significant bit and +0.62/?0.59 least significant bit, respectively. The measured interchannel deviation of the voltage outputs is 8.8 mV, and the measured power consumption of the 20‐channel data driver IC is reduced to 7.1 mW, which is less than half of the power consumed by the conventional one.     

Real-time approximation of molecular interaction interfaces based on hierarchical space decomposition

The interaction interface between two molecules can be represented as a bisector surface equidistant from the two sets of spheres of varying radii representing atoms. We recursively divide a box containing both sphere-sets into uniform pairs of sub-boxes. The distance from each new box to each sphere-set is conservatively approximated by an interval, and the number of sphere-box computations is greatly reduced by pre-partitioning each sphere-set using a kd-tree. The subdivision terminates at a specified resolution, creating a box partition (BP) tree. A piecewise linear approximation of the bisector surface is then obtained by traversing the leaves of the BP tree and connecting points equidistant from the sphere-sets. In 124 experiments with up to 16,728 spheres, a bisector surface with a resolution of 1/2⁴ of the original bounding box was obtained in 28.8 ms on average.