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991.
Melatonin is an endogenously produced indoleamine and secreted by the pineal gland. Melatonin has pleiotropic bioactivities and is involved in epigenetic regulation. Suboptimal conditions during maternal and perinatal phases can elicit epigenetic regulation of genes for nephrogenesis and reset physiological responses to develop programmed hypertension. This review discusses the early utility of melatonin to prevent programmed hypertension in later life by epigenetic regulation in the kidney, with an emphasis on: (1) the role of melatonin in epigenetic regulation; (2) the beneficial effects of melatonin on programmed hypertension; (3) epigenetic regulation of maternal melatonin therapy in different developmental windows of offspring kidneys analyzed by whole-genome RNA next-generation sequencing; and (4) current blocks in the application of melatonin in preventing programmed hypertension.  相似文献   
992.
由于设计-建造(DB)模式在节约工期、节省成本方面具有显著优势,已成为现代建筑业应用广泛的项目管理模式之一。本文查阅648篇关于DB总承包管理的英文文献,统计分析文献的时间序列和文献类型;采用内容分析法,识别这些文献的研究主题与研究方法;总结文献研究的参与方类型和项目类型。研究结果表明:1990~2009年间的DB文献最多;DB的各类文献中,期刊论文最多;DB文献最常用的研究方法是案例分析,最主要的研究主题是绩效,最关注的参与方是业主,最重视研究的项目类型是公共工程项目。研究结果为国内DB总承包管理的研究者提供参考和借鉴。  相似文献   
993.
对PPP项目市场需求风险的影响因素、分担偏好、参与者的管理能力等问题进行探讨,以实例提出PPP项目市场需求风险完全由政府承担、政府与私人投资者共同承担及私人投资者承担的三种模式。在此基础上提出风险分担中政府所应承担的责任,以及市场分担与项目竞争强度的关系等观点,以期为政府后续PPP项目市场需求风险的管理提供参考和借鉴。  相似文献   
994.
Hierarchically flowerlike Ag microstructure with uniform silver nanosheets as building blocks has been facilely prepared on a composite film surface via in situ reduction of Ag+ by a polyaniline component. The morphology of the as-prepared Ag microstructure is determined by the reaction duration, not the concentration of Ag+ in the reaction process. The complex geometry, rough surface, and interlaced nanosheets of the hierarchical Ag microstructure create interstitial sites and thus result in enhanced Raman signals.  相似文献   
995.
The moisture-dependent thermal conductivity of two types of lightweight ceramic brick body is analyzed using both theoretical and experimental approaches. The basic physical properties are determined at first. Then, an impulse method is applied for the thermal-conductivity measurement. Initially, the material samples are dried, after that, they are exposed to liquid water for specific time intervals, and finally the moisture content is allowed to homogenize within the whole volume. The thermal-conductivity measurement is performed for different moisture contents achieved in this way. In the theoretical part, the homogenization principles are used for the calculation of the moisture-dependent thermal conductivity, utilizing the distribution functions based on the pore-size distribution measurement. Finally, a comparison of the measured and calculated data is done, and the validity of the applied effective media treatment is assessed.  相似文献   
996.
Affective design is an important aspect of new product development, especially for consumer products, to achieve a competitive edge in the marketplace. It can help companies to develop new products that can better satisfy the emotional needs of customers. However, product designers usually encounter difficulties in determining the optimal settings of the design attributes for affective design. In this article, a novel guided search genetic algorithm (GA) approach is proposed to determine the optimal design attribute settings for affective design. The optimization model formulated based on the proposed approach applied constraints and guided search operators, which were formulated based on mined rules, to guide the GA search and to achieve desirable solutions. A case study on the affective design of mobile phones was conducted to illustrate the proposed approach and validate its effectiveness. Validation tests were conducted, and the results show that the guided search GA approach outperforms the GA approach without the guided search strategy in terms of GA convergence and computational time. In addition, the guided search optimization model is capable of improving GA to generate good solutions for affective design.  相似文献   
997.
998.
999.
Electroless Ni–P under bump metallization (UBM) has advantages of even surface, low cost and simplicity to deposit, but their mechanical strength, corrosion resistance and stability still face challenges under high soldering temperature. Incorporating carbon nanotubes (CNTs) into electroless Ni–P UBM might be expected to provide Ni–P–CNT composites with high mechanical strength and stability. Ni–P–CNT composite coatings as well as Ni–P coatings were fabricated by electroless plating process. In order to homogeneously disperse CNTs in composite coatings, acid pre-treatment and surfactant dispersant were introduced. During composite electroless plating, the ultrasonic agitation was also employed. In this study, scanning electronic microscopy (SEM) was used to observe the morphology and the CNTs were proved to be uniformly distributed in Ni–P–CNT coatings by SEM and atomic force microscopy. It was verified that the surface of the composite was quite smooth and continuous; CNTs are equably embedded in the matrix, which is advantageous for conductivity, mechanical strength and corrosion resistance. Shear tests were conducted to evaluate the effect of CNT reinforcement on the mechanical properties of joints, and the joints with CNT additions exhibited higher shear strength at different reflow cycles. Moreover, deposition mechanism of CNTs with Ni was analyzed and confirmed by transmission electron microscopy. Factors that affecting plating process was also discussed, and the optimum plating condition was suggested in this study.  相似文献   
1000.
In order to identify the effect on the properties and behavior of tin–zinc–bismuth (Sn-8 wt% Zn-3 wt% Bi or Sn-13.6 at.% Zn-1.6 at.% Bi) based solders produced by adding nickel (Ni) nano-particles, the interfacial microstructure between plain and composite solders with newly developed immersion silver (Ag) plated copper (Cu) substrates has been investigated as a function of reaction time, at various temperatures. For plain Sn–8Zn–3Bi solder joints, a scallop-shaped Cu–Zn–Ag intermetallic compound layer was found to adhere to the surface of the immersion Ag-plated Cu substrate. However, after addition of Ni nano-particles into the Sn–8Zn–3Bi solder, Cu–Zn–Ag (at the bottom) and (Cu, Ni)–Zn (at the top) intermetallic compound layers were observed at the interfaces. In addition, these intermetallic compound layer thicknesses increased substantially with increases in the temperature and reaction time. In the solder ball region, needle-shaped α-Zn rich phase and spherically-shaped Bi-particles appeared to be homogeneously distributed throughout a beta-tin (β-Sn) matrix. However, after the addition of Ni nano-particles, needle-shaped α-Zn rich phase appeared that exhibited a fine microstructure, due to the heterogeneous nucleation of the Ni nano-particles. The calculated activation energy for the Cu–Zn–Ag intermetallic compound layer for the plain Sn–8Zn–3Bi solder/immersion Ag-plated Cu system was 29.95 kJ/mol—while the activation energy for the total [Cu–Zn–Ag + (Cu, Ni)–Zn] intermetallic compound layers formed in the Sn–8Zn–3Bi–0.5Ni (Sn-13.6 at.% Zn-1.6 at.% Bi ~1 at.% Ni) composite solder/immersion Ag-plated Cu system was 27.95 kJ/mol. Addition of Ni nano-particles reduces the activation energy which enhanced the reaction rate as we know that lower the activation energy indicates faster the reaction rate.  相似文献   
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