Comparison of multiple prompt γ-ray analysis and prompt γ-ray analysis for the elemental analysis of geological and cosmochemical samples

Multiple prompt γ-ray analysis (MPGA) and conventional neutron-induced prompt γ-ray analysis (PGA) are nondestructive analytical methods for bulk chemical compositions, and their analytical capabilities were compared for elemental analyses of geological and cosmochemical samples. Detection sensitivities of PGA are often restricted by poor signal-to-noise ratios and interferences from different origins. MPGA can substantially reduce the background level, especially for hydrogenous samples, relative to PGA, which opens up a possibility to use lower energy prompt γ-rays of some trace elements. Although it is one of the major constituent elements of rock samples, Mg is hard to be determined by PGA. With MPGA, Mg contents could be determined with reasonable consistency with their corresponding recommended values in geological and cosmochemical samples by carefully selecting suitable coincident prompt γ-ray energy pairs without interference correction. MPGA was applied to a hydrogenous meteorite, Ivuna, which contains H at 2% mass level. MPGA detection limits for most of the elements studied can be reduced up to 1 order of magnitude when compared with PGA detection limits under the present experimental conditions.     

An efficient dynamic reliability-dependent bit allocation for biometric discretization

A biometric discretization scheme converts biometric features into a binary string via segmenting every one-dimensional feature space into multiple labelled intervals, assigning each interval-captured feature element with a short binary string and concatenating the binary output of all feature elements into a bit string. This paper proposes a bit allocation algorithm for biometric discretization to allocate bits dynamically to every feature element based on a Binary Reflected Gray code. Unlike existing bit allocation schemes, our scheme bases upon a combination of bit statistics (reliability measure) and signal to noise ratio (discriminability measure) in performing feature selection and bit allocation procedures. Several empirical comparative studies are conducted extensively on two popular face datasets to justify the efficiency and feasibility of our proposed approach.     

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

In the flip-chip ball grid array (FCBGA) assembly process, no-flow underfill has the advantage over traditional capillary-flow underfill on shorter cycle time. Reliability tests are performed on both unmolded and molded FCBGA with three different types of no-flow underfill materials. The JEDEC Level-3 (JL3) moisture preconditioning, followed by reflow and pressure cooker test (PCT) is found to be a critical test for failures of underbump metallization (UBM) opening and underfill/die delamination. In this paper, various types of modeling techniques are applied to analyze the FCBGA-8×8 mm on moisture distribution, hygroswelling behavior, and thermomechanical stress. For moisture diffusion modeling, thermal-moisture analogy is used to calculate the degree of moisture saturation in the multi-material system of FCBGA. The local moisture concentration along the critical interface, e.g. die/underfill, is critical for delamination, because the moisture weakens the interfacial adhesion strength, generates internal vapor pressure during reflow, and induces tensile hygroswelling stress on UBM during PCT. The results of moisture distribution can be used as loading input for the subsequent hygroswelling modeling. The magnitude of hygroswelling stress acting on UBM is found to be greater than the thermal stress induced during reflow, both in tensile mode which may cause the UBM-opening failure. Underfill with lower saturated moisture concentration (C_sat) and coefficient of moisture expansion (CME) are found to induce lower UBM stress and has better reliability results. Molded package generally has higher stress level than unmolded package. Parametric studies are performed to study the effects of no-flow underfill materials, package type (molded vs. unmolded), die thickness, and substrate size on the stresses of UBM during reflow and PCT.     

A Low-Complexity Routing Algorithm with Power Control for Self-Organizing Short-Range Wireless Networks

Mobile computing has become very pervasive, where the number of electronic devices equipped with wireless capabilities has increased significantly in recent years. This poses serious demands on wireless, mobile and self-organizing networks. Despite the fact that devices are getting smaller and more powerful, advances in battery technology have not yet reached the stage where devices can autonomously operate for days. Therefore, devices for self-organizing networks will strongly rely on the efficient use of their batteries. We present a cluster-based low-complexity routing algorithm for self-organizing networks of mobile nodes. Our proposed algorithm, called Cluster-based Energy-saving Routing Algorithm (CERA), allows mobile nodes to autonomously create clusters to minimize the power consumption. CERA is implemented as two separate protocols: the intra-cluster data-dissemination protocol, and the inter-cluster routing protocol. We present an extensive analysis of the overall protocol architecture by varying the critical factors related to protocol behavior. As a result, the CERA implementation generally saves up to 25% of energy, while keeping the overhead, in terms of energy consumption, acceptably low.     

Retrodirective array augmentation for electronic RCS modification

In this paper, an active Pon type retrodirective array (RDA) is augmented with a passive array in order to provide electronic modification of the transmit function of the combination in response to the influence of an external interrogating signal. By the use of a single phase shifter and level setting control, it will be shown that different types of broadcast mode can be initiated. The first of these is the self-tracking capability normally associated with a Pon heterodyne RDA. Broadside radiation production associated with a conventional in-phase fed passive array operating in transmission mode is also demonstrated. Additionally, new modes of operation which include the use of the configuration are described: 1) as a radiation nulling device; 2) its use as a sidelobe suppressor; and 3) as a beamwidth control device     

In situ synthesis of silver nanoparticles on silk fabric with PNP for antibacterial finishing

This research presents a generic strategy to fabricate antibacterial textile through in situ synthesis of silver nanoparticles on the fabric with smart polymeric molecules. Silk fabric and polyamide network polymer (PNP) were chosen for this study. PNP which has numerous amino groups and three-dimensional structure was applied to entrap silver ions into silk fabric. The pretreated silk fabrics were heated by steam method to make silver nanoparticles synthesized in situ on them without any other reductant and linker to provide silk fabric with antibacterial properties. The results indicated that the treated silk fabrics had excellent antibacterial activity and laundering durability. The quantitative bacterial tests showed the bacterial reduction rates of Staphylococcus aureus and Escherichia coli were able to reach above 99 % with not more than 0.05 mmol/L of AgNO₃. The whiteness of silk fabric only changed from 90.47 to 86.49. The antibacterial activity of the treated silk fabric was maintained at 98.86 % reduction even after being exposed to 30 consecutive home laundering conditions. In addition, the results of scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray photoelectron spectroscopy confirmed that silver nanoparticles had generated and dispersed well in Ag⁰ form on the surface of silk fibers. The understanding acquired from this work will allow one to work with the preparation of other silver nanoparticles functional textiles with excellent antibacterial activities and laundering durability through this facile, eco-friendly in situ synthesis method.     

Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array)

Board-level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this study, drop test of printed circuit boards (PCBs) with a four-screw support condition was conducted for a 15 mm times 15 mm fine-pitch ball grid array (FBGA) package assembly with solder ball compositions of 36Pb-62Sn-2Ag and Sn-4Ag-0.5Cu on printed circuit board (PCB) surface finishes of organic solderability preservative, electroless nickel immersion gold, and immersion tin. Finite element modeling of the FBGA assembly was performed to study the stress-strain behavior of the solder joints during drop test. The drop test results revealed a strong influence of different intermetallic compound formation on soldered assemblies drop durability. The lead-based solder supersedes the lead-free composition regardless of the types of surface finish. Joints on organic solderability preservative were found to be strongest for each solder type. Other factors affecting drop reliability such as component location on the board and thermal cycling aging effects are reported. Finite element modeling results showed that a solder joint is more prone to failure on the PCB side, and the predicted solder joint stresses are location dependent. Predicted failure sites based on simulation results are consistent with experimental observations.     

Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

This paper presents micro fabrication process and wafer-level integration of a silicon carrier, which consists of two Si chips that are bonded together with evaporated AuSn-solder. There are micro fins and channels fabricated in the Si chip and form the embedded cooling layer after bonding. The embedded cooling layer is connected with an inlet and an outlet to form a fluidic path for heat transfer enhancement. Besides, in the silicon carrier, there are through silicon vias (TSVs) with metal film on sidewall for electrical interconnection. Two or more carriers can then be stacked together with a silicon interposer in between to make up of a stacked cooling module for high power heat dissipation. The advantage of this 3-D stacking method is that it provides a method of simultaneously realizing electrical interconnection and fluidic path and it can extract heat from the constraints of 3-D silicon module chips to surface without external liquid circulation.     

嵌入式存储器测试

随着存储器需求的增加以及制造技术的进步,嵌入式存储器在SOC系统中的地位越来越重要。与传统的分立存储器件测试相比,嵌入式存储器的测试呈现出新的挑战。本文试图全面叙述嵌入式存储器的各种结构,并介绍各种DFT（可测性设计）测试技术,如SCAN〔扫描〕、MBIST（存储器内建自测试）以及BISR（内建自修复）。