热蒸发紫外LaF3薄膜光学常数的表征

薄膜光学常数的精确测定对于设计和制备多层薄膜具有重要意义。在JGS1型熔融石英基底上,采用热蒸发沉积方法制备了不同厚度的LaF3单层薄膜样品,利用光度法来获取弱吸收薄膜和基底的光学常数,计算得到其在185～450nm范围内折射率n和消光系数k的色散曲线。实验结果表明,当膜层厚度较薄时,LaF3薄膜折射率表现出不均匀性现象。随着薄膜厚度的增加,薄膜折射率不均匀性减小。在求解过程中选用不均匀模型后,拟合结果与实际测试光谱曲线吻合得很好,提高了薄膜光学常数的计算精度。     

步进调频宽带雷达距离扩展目标频域检测算法

论文研究高斯杂波背景下步进调频宽带雷达的距离扩展目标检测问题。根据步进调频宽带雷达目标高分辨距离像的特点,提出一种基于回波功率谱的距离扩展目标频域检测算法。该算法无需对目标抽取形成1维距离像,直接利用目标高分辨距离像功率谱与杂波功率谱的差异,在频域实现了距离扩展目标回波能量的积累。推导了算法的检验统计量,给出了虚警概率的表达式。最后通过Monte-Carlo仿真验证了算法的检测性能。仿真结果表明该文的目标检测算法较目标抽取后的检测算法在检测性能上有明显提高,同时其检测性能也优于同条件下基于视频积累的距离扩展目标检测算法,并且具有良好的鲁棒性和工程可实现性。     

Fast handoff with reducing waste rate approach for wireless resources management in UMTS mobile networks

3G Wideband CDMA systems adopt the Orthogonal Variable Spreading Factor code tree as the channelization codes management for achieving high data rate transmission in personal multimedia communications. It assigns a single channelization code for each accepted connection. Nevertheless, it wastes the system capacity when the required rate is not powers of two of the basic rate. One good solution is to assign multiple codes for each accepted connection but it causes two inevitable drawbacks: long handoff delay and new call setup delay due to high complexity of processing with multiple channelization codes, and high cost of using more number of rake combiners. Especially, long handoff delay may result in more call dropping probability and higher Grade of Service, which will degrade significantly the utilization and revenue of the 3G cellular systems. Therefore, we propose herein an adaptive efficient codes determination algorithm based on the Markov Decision Process analysis approach to reduce the waste rate and reassignments significantly while providing fast handoff. Numerical results demonstrate that the proposed approach yields several advantages, including the lowest GOS, the least waste rate, and the least number of reassignments. Meanwhile, the optimal number of rake combiners is also analyzed in this paper. This research was supported in part by the National Science Council of Taiwan, ROC, under contract NSC-93-2213-E-324-018.     

The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

The formation of Ag₃Sn plates in the Sn-Ag-Cu lead-free solder joints for two different Ag content solder balls was investigated in wafer level chip scale packages (WLCSPs). After an appropriate surface mount technology reflow process on a printed circuit board, samples were subjected to 150°C high-temperature storage (HTS), 1,000 h aging, or 1,000 cycles thermal cycling test (TCT). Sequentially, the cross-sectional analysis was scrutinized using a scanning electron microscope/energy dispersive spectrometer (SEM/EDX) to observe the metallurgical evolution of the amount of the Ag₃Sn plates at the interface and the solder bulk itself. Pull and shear tests were also performed on samples. It was found that the interfacial intermetallic compound (IMC) thickness, the overall IMC area, and the numbers of Ag₃Sn plates increase with increasing HTS and TCT cycles. The amount of large Ag₃Sn plates found in the Sn-4.0Ag-0.5 Cu solder balls is much greater than that found in the Sn-2.6Ag-0.5Cu solder balls; however, no significant difference was found in the joint strength between two different Ag content solder joints.     

A new scheme for bidirectional WDM-PON using upstream and downstream channels generated by optical carrier suppression and separation technique

We propose a new bidirectional dense wavelength-division-multiplexing (DWDM)-based passive optical network using optical carrier suppression and separation technique to generate both upstream and downstream wavelength channels from a single laser. Thirty-two DWDM channels have been generated, and symmetric 10-Gb/s data transmission of a wavelength pair has been demonstrated.     

PVT-aware leakage reduction for on-die caches with improved read stability

Effectiveness of previous SRAM leakage reduction techniques vary significantly as the leakage variation gets worse with process and temperature fluctuation. This paper proposes a simple circuit technique that adaptively trades off overhead energy for maximum leakage savings under severe leakage variations. The proposed run-time leakage reduction technique for on-die SRAM caches considers architectural access behavior to determine how often the SRAM blocks should enter a sleep mode. A self-decay circuit generates a periodic sleep pulse with an adaptive pulse period, which puts the SRAM array into a sleep mode more frequently at high leakage conditions (fast process, high temperature) and vice versa. An 0.18-/spl mu/m 1.8-V 16-kbyte SRAM testchip shows 94.2% reduction in SRAM cell leakage at a performance penalty less than 2%. Measurement results also indicate that our proposed memory cell improves SRAM static noise margin by 25%.     

Trajectory design considering derivative of jerk for head-positioning of disk drive system with mechanical vibration

In this paper, we propose a novel design method of target trajectory for high-speed and high-precision head positioning of a hard disk drive (HDD) system. To realize smooth acceleration and deceleration, the derivative of jerk is considered not to activate any mechanical vibrations. We applied the well-known optimal control theory to fix the initial and terminal conditions. Moreover, we show that various performances can be improved by introducing time-varying weighting coefficients. Some experimental results using a 2.5-in HDD are shown to verify the effectiveness of the proposed method.     

竞走运动员运动训练计划管理系统的设计与开发探究

随着我国经济和科技的快速发展,现代信息化技术的应用已经深入到了社会上的各个领域。在竞走运动员训练计划中建立信息化管理系统是信息化时代发展的必然需求,也是科学化、合理化运动员运动训练计划的制定。使得运动员的运动潜力得到挖掘和激发,使得运动员的竞技水平能够在比赛中得到有效的发挥。     

基于OMAP3530的视频监控客户端设计与实现

本设计基于OMAP3530处理器的开发平台设计视频监控客户端。该客户端通过SIP协议和服务器端通信。视频监控客户端在OMAP3530开发板实现,其ARM端完成客户端呼叫,建立与视频服务器连接,音视频数据流接收、播放和存储等功能,其DSP端完成解码器实时实现。设计重点为客户端oRTP和eXosip库的移植、监控界面的设计和H.264解码器实时实现。     

SiC及其功率器件的激光制孔研究进展

SiC作为第三代半导体材料的典型代表,因具有优异的物化性能,在功率器件领域具有极大的应用前景.文章简要介绍了激光制孔的基本原理,综述了 SiC的长脉冲与超短脉冲激光制孔研究进展,对比了长脉冲与超短脉冲激光的加工特点,分析了不同脉冲宽度下SiC的制孔效果.同时,介绍了 GaN/SiC,AlGaN/GaN/SiC等SiC功率器件的激光制孔研究现状.最后,指出了 SiC及其功率器件激光制孔面临的挑战,并展望了未来的发展方向.