县区电网电压无功控制系统设计

针对目前地区电网电压无功控制的现状,提出了电网电压无功监控系统的设计方案。说明优化控制系统应该实现的功能,选用线性规划(LP)算法为核心程序,正常状态下以有功网损最小为目标函数。依据分离原理提出两层分级控制的系统结构,分析优化控制系统的工作流程及特点。     

蜕变——中国气象局华风影视大楼

华风气象影视大楼总面积4万平方米，根据空间功能不同分为办公大楼和商务写字楼两部分，办公大楼是集演播室、制作机房、办公室为一体的九层综合性建筑。设计师杨宇在刚接触到这个项目的时候，面对的是一个既成事实的建筑。     

"十一五"规划国家级重点通信项目

《信息产业科技发展“十一五”规划》提出设立部分重大项目,力争实现重点突破,形成一批具有自主知识产权的核心技术和创新产品,打造较为完整的产业链,形成世界一流的产业群。这其中,与通信相关的重点项目主要有:宽带无线移动通信、下一代网络、家庭网络、智能终端、数字电视等。本部分将对我国在以上领域的现状、项目的具体内容和目标、实现这些目标的具体计划以及相关厂商在各领域的努力和成绩进行介绍。     

Thermo-Sensitive Ba0.64Sr0.36TiO3 Thin Film Capacitors for Dielectric Type Uncooled Infrared Sensors

Ba_0.64Sr_0.36TiO₃ (BST) thin films are prepared on Pt/Ti/SiO₂/Si₃N₄/SiO₂/Si substrates by a sol-gel method. Thermo-sensitive BST thin film capacitors with a Metal-Ferroelectrics-Metal (M-F(BST)-M) structure are fabricated as the active elements of dielectric type uncooled infrared sensors. XRD are employed to analyze the crystallographic structures of the films. AFM observations reveal a smooth and dense surface of the films with an average grain size of about 35 nm. Rapid temperature annealing (RTA) process is a very efficient way to improve crystallization quality. The preferable annealing temperature is 800°C for 1 min. The butterfly shaped C-V curves of the capacitors indicate the films have a ferroelectric nature. The dielectric constant and dielectric loss of the films at 100 kHz are 450 and 0.038, respectively. At 25°C, where the thermo-sensitive capacitors work, the temperature coefficient of dielectric constant (TCD) is about 5.9 %/°C. These results indicate that the capacitors with sol-gel derived BST thin films are promising to develop dielectric type uncooled infrared sensors.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

选择测试阀在现场测试中的应用

选择测试阀是新一代全通径压控式测试器，在结构和性能上有了本质的创新，使现场操作更加简便、安全，对井筒条件要求低，更适用于高温、高压、深井、气井的地层测试，拓宽了地层测试和其它井下作业的兼容性。经7井次应用，其安全性、可靠性越来越得到认可。     

内置旁路型软起动器的替代性

本文根据软起动器的发展趋势，就目前市场上应用的三种类型的软起动器进行分析，说明各自的优缺点，同时给出结论，内置旁路型淘汰其它类型的软起动器的必要性。     

砾岩储层精细描述中标准测井资料的应用

克拉玛依油田七区的标准测井资料是指使用标准电极系视电阻率测井、自然电位测井和井径测井,以相同的1:500深度比例尺及相同的横向比例进行测井作业所取得的资料.这种资料本来并不具备定量解释储层孔隙度和含油饱和度的能力,但这种资料占该区测井资料总量的比率高达34%.利用标准电极系视电阻率资料和岩心分析资料建立了视电阻率-岩性图版,利用自然电位减小系数α和岩心孔隙度分析资料φ建立了α-φ图版,根据综合测井资料求出标准测井视电阻率校正系数,进而确定了饱和度计算方程的参数.与相应的综合测井资料计算结果相对比,用该方法得到的孔隙度平均绝对误差及相对误差分别为1.85%和11.88%;含油饱和度平均绝对误差及相对误差分别为9.08%和24.75%.将该方法有选择地应用到该区砾岩储层精细描述研究中,弥补了缺乏综合测井资料无法进行测井储层评价及参数研究的缺陷.     

金属基复合材料的高应变速率超塑性

综述并评论了金属基复合材料的高应变速率超塑变形机制，描述了金属基复合材料在高应变速率超塑变形中的一些理化现象，说明了变形过程中的各种影响因素，总结了具有高应变速率超塑性能的金属基复合材料及其性能，并指出了在金属基复合材料的高应变速率超塑性研究方面的不足。     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.