Closed-form error analysis of the non-identical Nakagami-m relay fading channel

We present closed-form expressions for the average bit error probability (ABEP) of BPSK, QPSK and M-QAM of an amplify-and-forward average power scaling dual-hop relay transmission, over non-identical Nakagami-m fading channels, with integer values of m. Additionally, we evaluate in closed-form the ABEP under sufficiently large signal-to-noise ratio for the source-relay link, valid for arbitrary rn. Numerical and simulation results show the validity of the proposed mathematical analysis and point out the effect of the two hops unbalanced fading conditions on the error performance.     

Effect of process parameters on impact strength of Al-7% Si alloy castings produced by VAEPC process

The castings produced by the evaporative pattern casting (EPC) process have blow holes. The blow holes in EPC castings are because of the non-escape of the gas produced as a result of burning of polystyrene pattern in the sand mold. To overcome the problem of blow holes, the EPC process is combined with the vacuum (V)- process. The vacuum applied to EPC mold draws the decomposed gases and improves the casting quality produced by the EPC process. The developed hybrid process has been termed as the vacuum assisted evaporative pattern casting (VAEPC) process. The objective of this paper to investigates the effect of process parameters, i.e, degree of vacuum, pouring temperature, grainfineness number, amplitude of vibration and time of vibration on the impact strength of Al-7% Si alloy castings in VAEPC process. In order to evaluate the effect of selected process parameters, the response surface methodology (RSM) is used to formulate a mathematical model which correlates the independent process parameters with the desired impact strength. The central composite rotatable design has been used to conduct the experiments. The results indicate that the impact strength decreases with increases in the grainfineness number and pouring temperature. Whereas, it has an inverse relationship with amplitude of vibration, time of vibration and degree of vacuum. The best value of impact strength (2.34 N/mm²) has been obtained at 400 mm Hg degree of vacuum imposed, 650°C as pouring temperature, 60 as sand grainfineness number, 460 μm as amplitude of vibration, and 70 s as time of vibration.     

Structural and Superconducting Property Variations with Nominal Mg Non‐Stoichiometry in MgxB2 and Its Enhancement of Upper Critical Field

By applying a combination of characterisation tools, changes in structural and superconducting properties with nominal Mg non‐stoichiometry in Mg_xB₂ are found. The non‐stoichiometry produces enhanced in‐field critical current densities (J_c's) and upper critical field / irreversibility field (H_c2/H_irr(T)) values. Upper critical fields of ～ 21 T (4.2 K) were obtained in nominal Mg‐deficient samples compared to ～ 17 T (4.2 K) for near‐stoichiometric samples.     

New technical facilities for equipping power industry plants with automatic control systems

The specific features of SPPA-T3000, a new instrumentation and control system intended for automation of processes in power engineering, are briefly described. Distinctive features of the system architecture, central to which is using the model of web systems, are singled out.     

Standby power system VRLA battery reserve life estimation scheme

This paper presents a valve-regulated lead acid (VRLA) battery reserve life estimation scheme. The scheme is adaptive in both type and frequency of involvement. The scheme is based on capacity trending with the support of a number of state-of-health (SOH) indicators. These SOH indicators include accumulated thermal stress, float voltage, and indicators acquired from the start-of-discharge (coup de fouet) region. An implementation test case is given, indicating that the scheme is capable of providing an accurate estimation of reserve life long before the end of life. Furthermore, the estimation accuracy improves as the end of battery life approaches.     

Learning with belief levels

We study learning of predicate logics formulas from “elementary facts,” i.e. from the values of the predicates in the given model. Several models of learning are considered, but most of our attention is paid to learning with belief levels. We propose an axiom system which describes what we consider to be a human scientist's natural behavior when trying to explore these elementary facts. It is proved that no such system can be complete. However we believe that our axiom system is “practically” complete. Theorems presented in the paper in some sense confirm our hypothesis.     

Results of a User Study on 2D Hurricane Visualization

We present the results from a user study looking at the ability of observers to mentally integrate wind direction and magnitude over a vector field. The data set chosen for the study is an MM5 (PSU/NCAR Mesoscale Model) simulation of Hurricane Lili over the Gulf of Mexico as it approaches the southeastern United States. Nine observers participated in the study. This study investigates the effect of layering on the observer's ability to determine the magnitude and direction of a vector field. We found a tendency for observers to underestimate the magnitude of the vectors and a counter‐clockwise bias when determining the average direction of a vector field. We completed an additional study with two observers to try to uncover the source of the counter‐clockwise bias. These results have direct implications to atmospheric scientists, but may also be able to be applied to other fields that use 2D vector fields.     

Inverted Solution Processable OLEDs Using a Metal Oxide as an Electron Injection Contact.

A new type of bottom‐emission electroluminescent device is described in which a metal oxide is used as the electron‐injecting contact. The preparation of such a device is simple. It consists of the deposition of a thin layer of a metal oxide on top of an indium tin oxide covered glass substrate, followed by the solution processing of the light‐emitting layer and subsequently the deposition of a high‐workfunction (air‐stable) metal anode. This architecture allows for a low‐cost electroluminescent device because no rigorous encapsulation is required. Electroluminescence with a high brightness reaching 5700 cd m^–2 is observed at voltages as low as 8 V, demonstrating the potential of this new approach to organic light‐emitting diode (OLED) devices. Unfortunately the device efficiency is rather low because of the high current density flowing through the device. We show that the device only operates after the insertion of an additional hole‐injection layer in between the light‐emitting polymer (LEP) and the metal anode. A simple model that explains the experimental results and provides avenues for further optimization of these devices is described. It is based on the idea that the barrier for electron injection is lowered by the formation of a space–charge field over the metal‐oxide–LEP interface due to the build up of holes in the LEP layer close to this interface.     

Tri-Gate Bulk MOSFET Design for CMOS Scaling to the End of the Roadmap

A tri-gate bulk MOSFET design utilizing a low-aspect-ratio channel is proposed to provide an evolutionary pathway for CMOS scaling to the end of the roadmap. 3-D device simulations indicate that this design offers the advantages of a multi-gate FET (reduced variability in performance and improved scalability) together with the advantages of a conventional planar MOSFET (low substrate cost and capability for dynamic threshold-voltage control).     

Development of Stretch Solder Interconnections for Wafer Level Packaging

A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.