Fatty acid-containing lipids of the yeast Saccharomyces cerevisiae during post-fermentation decline in viability

On exhaustion of the sugar supply in the medium, cells of the yeast Saccharomyces cerevisiae maintained at 30°C lost most of their phospholipid content and their viability, as assessed by methylene blue staining, within a few days. Both processes occurred more rapidly in cells which had fermented glucose rather than maltose. During this period of decline the cell content of other fatty acid esters, mainly t riacylglycerols, increased. This seemed greater in cells grown with maltose than with glucose but the latter cells also synthesised distinct amounts of waxes. The total quantity of lipid per cell did not change significantly during loss of viability although the composition of the lipid fraction did.     

Partial discharge detection by AE sensors for prefabricated joints for xlpe cables

This paper describes detection by the AE (acoustic emission) sensor of partial discharge in a prefabricated joint, one of the accessories for XLPE cables which is composed of factory-formed parts. Since the prefabricated joints can be installed in a short time, an increasing number of such joints has been used on power transmission lines. However, the interface between the parts of prefabricated joints tends to exhibit weak points because of a structure peculiar to this type of joint. The AE sensor is provided for practicability in comparison with conventional electrical defect detection methods. In the course of the present study, a method for locating a defect using multiple signals from the AE sensors was developed and its validity was evaluated by the dielectric breakdown test.     

Polymer film deposition with fine pitch openings by stencil printing

It is confirmed that stencil printing with a novel developed printable polyimide paste can be used for polymer film deposition on LSI wafers. A thick polyimide film with openings for solder ball bumping can be deposited on all of the LSIs on a wafer by stencil printing at one time. This stencil printing process does not need an expensive lithography process, providing cost-effective wafer-level chip scale packages (WLCSPs). In this study, a novel polyimide paste was tailored to have a higher thixotropy ratio than conventional printable polyimide materials. The novel printable polyimide paste shows that the viscosity ratio of more than 3.5 at the shear rate of 1 to 10 s⁻¹ and that the viscosity increases rapidly after the shear rate is lowered. Fine spaces of 40 μm between 250 μm openings were obtained for 10 μm thick polyimide films on Si wafers. It has been also confirmed that the new paste shows the variation range of 30 μm at the opening size of 385 μm within 100 continuously printed wafers. Even after the new paste was shear-thinned repeatedly, rheological behavior of the new paste was not changed. This robustness leads to higher efficiency of the materials for mass-producing. From the reliability viewpoint of the printed polyimide films, no peelings were observed on plasma-CVD SiN films after the pressure cooker test under the condition of 127 °C and 0.25 MPa with the humidity of 100% for 300 h. The optimal stencil printing process using the novel developed paste will lead to significant cost reduction of a patterned polymer deposition process. Finally, WLCSPs using the stencil printing of the new polyimide paste have been demonstrated for SRAM LSIs on 8-in. wafers.     

主轴转速对半导体芯片切割品质的影响

针对目前大量使用的有机材料基板芯片和使用量相对较少的铜板基板芯片，分别设计了一组实验，并对由实验切割出来的芯片的主要评价项目逐项进行了检测，明确了主轴转速对两种芯片的外形尺寸误差、芯片的喇叭口现象、切断面的角度误差、崩碎坑的数量和大小、表面粗糙度等的影响；得出了不管是哪一种基板的芯片，出现不合格的主要是崩碎坑指标这一结论。通过分析和比较，得出了实际使用的主轴转速不宜低于15000r／min这一对于高速切割机的设计和切割工艺的制定具有重要参考价值的结论。     

High efficiency transformation of maize (Zea mays L.) mediated by Agrobacterium tumefaciens

Transformants of maize inbred A188 were efficiently produced from immature embryos cocultivated with Agrobacterium tumefaciens that carried "super-binary" vectors. Frequencies of transformation (independent transgenic plants/embryos) were between 5% and 30%. Almost all transformants were normal in morphology, and more than 70% were fertile. Stable integration, expression, and inheritance of the transgenes were confirmed by molecular and genetic analysis. Between one and three copies of the transgenes were integrated with little rearrangement, and the boundaries of T-DNA were similar to those in transgenic dicotyledons and rice. F1 hybrids between A188 and five other inbreds were transformed at low frequencies.     

Stereoregular oligomers of methyl methacrylate

Summary Packed column SFC has been found suitable for the rapid and detailed analysis of the isotactic and syndiotactic oligomers of MMA, when the temperature gradient technique was applied and the modifier was employed. Oligomer components from trimer to 20-mer separated completely. The heptamer fraction collected three times by SFC gave the ¹H NMR spectrum of satisfactorily high S/N ratio; the spectrum agreed well with that of the standard sample. Separation by tacticity as well as by molecular weight was observed for the SFC of a mixture of the isotactic and syndiotactic oligomers. The isotactic oligomers had longer retention time than the syndiotactic oligomers of the corresponding degree of polymerization. Part 3: cf. Ute K. Nishimura T, Hatada K, Polym J (1989) 21: 1027     

The effects of external stress on the cubic-tetragonal transformation in rapidly quenched ZrO2-Y2O3

The effects of the external stress on the displacive cubic (c) to tetragonal (t) transformation, taking place during rapid quenching of ZrO₂-Y₂O₃ alloys by a hammer-anvil unit, were examined through the statistical analysis of the crystallography of the product phases. The initially formed c-phase had no strong texture with respect to the stress direction. However, specific t variants among crystallographically equivalent ones were formed preferentially. From these observations, it is concluded that the applied stress plays an important role on the deformation to change the lattice during the c t transformation.     

半导体芯片切割加工品质的评价方法

在对日本一些著名半导体生产企业实际生产中所用的质量控制方法和企业生产规范进行认真分析的基础上,提出了一组具有代表性的主要检测项目和相应的检测方法.设计了一组芯片切割实验方案并进行了切割实验,对所提出的检测项目及要求逐项进行了检测.明确了在正常切割条件下各项指标出现不合格品可能性的大小,证明了所提出的检测项目和检测方法对于控制芯片切割品质的有效性.研究成果对于芯片切割加工品质评价方法的规范化和标准化,对于高速切割机的设计和切割工艺的制定等均具有重要的参考价值.