Etching behavior of CVD zinc selenide in inorganic acid solutions

Chemical interaction between polished surfaces of polycrystalline zinc selenide and inorganic acid solutions of various concentrations has been studied.     

Electromagnetic wave reflection from Fe/Cr nanostructures

The reflection of electromagnetic waves in the millimeter wave band from Fe/Cr nanostructures has been studied. It is established that the giant magnetoresistance (GMR) in the nanostructure leads to an increase in the reflection and a decrease in the transmission of microwaves, while the magnetic resonance leads to a decrease in both the reflection and transmission coefficients.     

A high dynamic magnetooptic current transformer with advanced signal processing

In the power industry, current has to be measured for metering and protection purposes. Conventional sensor setups need two transformers to realize the high dynamic range. By the described mixed analog/digital signal processing algorithm, the inherent low photonic noise of the input signals was maintained up to the full sensor output. The system design is based on a rigorous investigation and optimization of the error sources in the signal processing chain. The results are proved by a demonstrator, achieving a dynamic range from 0.05 to 100 times the rated current and a ratio root mean square error of less than 0.5%.     

High-temperature oxidation of intermetallics formed by group IV transition metals with chromium

We have studied the oxidation resistance of chromium intermetallics: TiCr₂, HfCr₂, and ZrCr₂, in the temperature interval 873–1473 K with isothermal holding of the specimens for up to 20 h. We have shown that the intermetallics TiCr₂ and HfCr₂ are oxidized 2–3 times more slowly than pure titanium and hafnium, but more than 1–2 orders of magnitude faster than chromium at T≤1273 K and 4–6 times faster at 1473 K. In this temperature interval, the intermetallic ZrCr₂ is rapidly oxidized at an increasing rate as the heating temperature rises. The scaling resistance of intermetallics of Group IV d metals with chromium is determined by formation of scales in which the major role is played by the oxides TiO₂, HfO₂, and ZrO₂, with weak protective properties.     

Numerical solution for shape optimization of an impactor penetrating into a semi-infinite target

The shape of the impactor with the maximum depth of penetration (DOP) for a given impact velocity is found using a numerical procedure for solving a corresponding non-classical variational problem. It is shown that the optimum shape in a general case is close to a blunt cone. The variation of the optimal shape of the impactor and the dependence of the DOP vs. the initial (impact) velocity and friction coefficient is studied. The analysis is performed also for optimal conical impactors.     

New encapsulation development for fine pitch IC devices

The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production.     

Energy management for commercial servers

Servers: high-end, multiprocessor systems running commercial workloads, have typically included extensive cooling systems and resided in custom-built rooms for high-power delivery. Recently, as transistor density and demand for computing resources have rapidly increased, even these high-end systems face energy-use constraints. Commercial-server energy management now focuses on conserving power in the memory and microprocessor subsystems. Because their workloads are typically structured as multiple application programs, system-wide approaches are more applicable to multiprocessor environments in commercial servers than techniques that primarily apply to single-application environments, such as those based on compiler optimizations.