营尔凹陷下白垩统油气勘探应避开高压水层

营尔凹陷下白垩统(K₁₎存在下沟组和赤金堡组2套源岩，目前它们已到成熟阶段。凹陷东侧长沙岭构造在下白垩统下沟组和赤金堡组储层中也发现油藏，但主要分布在高压水层的顶部及下部，而高压水层段存在良好的储层，并未发现油气。文章根据高压水层段的储层荧光特征，通过储层烃与源岩的对比，分析了下白垩统高压水层对油气运移的影响。研究结果表明：高压水层段，储层荧光弱，储层抽提物特征既不同于赤赤金堡组源岩，也不同于下构组源岩，为就近捕获的产物；高压水层未发生大规模的油气运移，其形成时间早于油气运移的时间。建议该区油气勘探目标的选择应避开高压水层，选择凹陷附近的圈闭、高压水层以下的层位。     

一种分析碳酸盐岩孔隙系统数字图像的新方法

碳酸盐岩的孔隙类型多，孔径变化范围大，孔隙系统结构复杂，研究难度大。长期以来，是利用光学显微镜法、毛细管压力分析法、岩石孔隙系统复制法和图像分析仪法等方法或其中几种方法配合来研究碳酸盐岩孔隙系统。随着计算机图像技术的迅速发展和日益完善，借助该项技术通过碳酸盐岩孔隙系统数字图像来研究碳酸盐岩孔隙系统已经成为现实。文章提出一种研究碳酸盐岩孔隙系统数字图像的新方法。通过样品光薄片的光学显微镜（OM）数字图像和环境扫描电子显微镜（ESEM）数字图像二值化识别孔隙；构造孔隙度、孔隙贡献率和孔隙形状参数的计算公式用于数字图像分析，得到孔隙大小分布和孔隙形状分布。在此基础上，总结碳酸盐岩孔隙参数对其渗透率的控制作用。与传统的孔隙系统研究方法相比，该方法与计算机图像技术紧密结合，具有定量、快速的明显优势。     

燃气管网动态仿真的研究及应用

研究和了解燃气在管道中的流动，是进行燃气管网系统优化和提高管网输运系统安全性的前提和基础。以流体力学三大守恒方程为基础，建立了等温和非等温条件下的燃气管网稳态和动态仿真理论模型。以有限差分法为基础，得到了上述模型的求解方法，并加入了耗散项，提高了求解方法的稳定性。通过增加初始点和延长出口点的方法，简化了模型的求解。通过在北京六环天然气管网中的初步应用，分别得到了与实际值综合相对误差为1.21％和2.62％的压力和流量仿真值，从而验证了模型及求解方法的可靠性。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

一种基于无理数加密算法的数字签名方案

为了提高现代网络信息传输的安全性,利用无理数小数点后数字的无穷性、无规律性、分布均匀性,提出一种全新的加密算法,并用它所产生的密钥流进行数字签名,实现身份验证不可抵赖、信息传输无篡改,确保信息传输的完整性、真实性,达到提高加密效率、相互认证的效果。     

Fabrication of Schottky barrier MOSFETs using self-assembly CoSi2 nanopatterning and spacer gate technologies

A self-assembly patterning method for generation of epitaxial CoSi₂ nanostructures was used to fabricate 50 nm channel-length MOSFETs. The transistors have either a symmetric structure with Schottky source and drain or an asymmetric structure with n⁺-source and Schottky drain. The patterning technique is based on anisotropic diffusion of Co/Si atoms in a strain field during rapid thermal oxidation. The strain field is generated along the edges of a mask consisting of 20 nm SiO₂ and 300 nm Si₃N₄. During rapid thermal oxinitridation (RTON) of the masked silicide structure, a well-defined separation of the silicide layer forms along the edge of the mask. These highly uniform gaps define the channel region of the fabricated device. The separated silicide layers act as metal source and drain. A poly-Si spacer was used as the gate contact. The asymmetric transistor was fabricated by ion implantation into the unprotected CoSi₂ layer and a subsequent out-diffusion process to form the n⁺-source. I–V characteristics of both the symmetric and asymmetric transistor structures have been investigated.     

Formulation of a ceramic ink for a wide-array drop-on-demand ink-jet printer

This paper describes the methodology for simulating a reprographic ink with a ceramic ink based on a commercially available zirconia powder for direct ceramic ink-jet printing. Of over-riding importance was matching viscosity and this was tested systematically by using a mineral oil–hexane binary system. Of secondary importance was adjustment of the pressure defect behind the nozzle to compensate for small differences in surface tension. The inks tested in the wide array print-head were based on low electrical conductivity liquids to avoid damage to the electroding system. The organic binder for the zirconia ink was paraffin wax and the dispersant was a hydroxystearic acid based polyester.     

移动网络中的独立式安全管理系统

本文提出一种适用于移动网络的安全管理系统,由于访问网络能够独立地对漫游用户进行认证,所以称该系统为独立式安全管理(ISM).基于ISM设计一种漫游用户的认证协议,通过对协议的比较分析可以看出,相对于其它安全管理系统,ISM的突出优点是安全责任划分清晰、认证效率高.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

丁苯干燥箱热风循环流程的改造

齐鲁股份有限公司橡胶厂针对丁苯橡胶装置干燥箱的设计及运行缺陷,借鉴吸收国内外先进干燥箱的生产技术与经验,组织技术攻关,对干燥箱热风循环工艺流程进行改造,实现了节能降耗以及废气污染物排放的减少,提高了干燥箱热能利用效率与生产能力。