镀镍云母导电复合材料的研究

对云母粒子化学镀镍及以LDPE为基材,镀镍云母粒子为填料制备的导电复合材料进行研究。认为此种导电复合材料只有质量轻、强度大及良好的导电等性能。     

莫来石材料的研究现状及其应用

较详细地介绍了莫来石的性能、生产、研究现状和用途。尤其对多元复合莫来石韧性陶瓷及莫来石超细粉末的制备进行了评述,同时展望了莫来石作为高级陶瓷材料的发展前景。     

国产核电厂蒸汽发生器下封头接管区模拟装置承受循环载荷能力的试验

国产核电厂蒸汽发生器下封头群孔接管区具有应力分布复杂、焊接施工条件差的特点。为考核其承受循环载荷的能力，设计制造了与实物相似的模拟试验装置，根据核电厂运行寿命期内的载荷特点，确定了模拟试验装置的试验载荷与试验循环数。循环加载试验的结果表明，蒸汽发生器下封头群孔接管区承受循环载荷的能力在寿命期内是符合要求的。     

太钢电弧炉上应用四星接法MOA的必要性

分析了太钢电弧炉变压器高压侧相间过电压的产生原因，比较了用于限制过电压的避雷器的两种接法．结论是用四垦接法ＭＯＡ限制过电压的效果较显著．     

Process and design analysis for ultrafine-pitched wiresweep elimination in advanced copper heat spreader BGA package

The semiconductor device trend for increasing functionalities and performances yet with smaller overall feature sizes presents escalating obstacles to the decreasing form factor along with demanding thermal carrying capability required at the package level. To confront this compounding issue, ultrafine-pitch wirebond interconnect coupled with thermally enhanced copper heat spreader attached to the package are introduced. However, the additional copper heat spreader thickness introduced within the package challenges the design of the package's wire, its loop height, and the molding process control to prevent wire sweeping occurrences. This study investigates the impact of different ultrafine pitched wire types, wire loop designs, copper heat spreader structures, and mold material types on eliminating device short from occurring due to the wire sweeping phenomena. A full factorial experiment is performed using an active silicon device packaged in a thermally enhanced ball grid array (BGA) test vehicle. In addition, test characterization is carried out using x-ray and multiinsertions hot/cold continuity tests. Then, a detailed failure analysis is performed by package decapsulation and scanning electron microscopy/energy-dispersive x-ray (SEM/EDX) to confirm the experimental findings. In conclusion, the study finds that for an ultrafine-pitched thermally enhanced BGA package, wire type is insignificant to reduce wire shorting occurrences. However, mold material and copper heat spreader structure using an optimized wire loop design are significant factors in eliminating wiresweep shorting phenomena. This study concludes with a wirebond interconnect and heat slug design recommended along with an improved process parameters and assembly material sets found from the experiment.     

MX345芯片及单片机控制

MX345芯片用于产生模拟信令—CTCSS单音.本文在介绍MX345编码/解码器工作原理的基础上,设计出MX345芯片与单片机的接口电路.最后给出控制软件.     

Crystallite growth characteristics in superfine zirconia powders and compacts

Crystallite growth characteristics of coprecipitated superfine zirconia powders have been investigated. It was found that the crystallite growth in powders follows a cubic law at 800 and 1000°C; however, the crystallite size data for compacts of both Y-TZP and YSZ cannot be fitted with a traditional parabolic or cubic law, but with a linear relation between crystallite size and the logarithm of time. In addition, it was also found that the degree of agglomeration of the powders can affect the crystallite growth.     

Geotechnical properties of the soft soil in Guangzhou College City

The paper describes some geotechnical properties of the soft soils in Guangzhou College City, China, which are difficult to both sample and test. Laboratory and in situ tests were carried out to assess the physical and mechanical indices of the soils. The data were statistically analyzed and linear regression undertaken such that equations could be developed by which the geotechnical properties of the soft soils can be predicted. The statistical validity of the degree of correlation confirmed that using these equations, the mechanical indices can be estimated from physical indices determined by routine testing.