Monoclinic Zirconia Bodies by Thermoplastic Ceramic Extrusion

Two ultrafine, undoped ZrO₂ powders with median primary particle sizes of 9 and 25 nm were used to prepare ceramic suspensions for thermoplastic extrusion. The organic vehicle consisted of an industrial-grade poly(ethylene- co -vinyl acetate) (EVA) or polyethylene (PE-HD) and decanoic acid as a dispersing agent. The powder volume loadings achieved were 44% and 52% by volume for the two powders, respectively. The amount of dispersant needed was calculated from a new model based on available chemisorption sites on the powder surface. Mixing and extrusion were conducted using a conventional modular plastic processing unit. Green bodies were dewaxed up to 450°C in an inert atmosphere and sintered to full density in air at 1060° and 1100°C, respectively. Analysis of the ceramic phase content and the microstructure of the bodies is presented.     

Detecting landscape forms using Fourier transformation and singular value decomposition (SVD)

Landscape structure is a main determinant of ecological landscape potentials. The basic differentiation of relief into depressions and elevations at deliberately chosen scales can be managed comfortably by the Fourier transformation. The automated extraction of these structures from an elevation map using Fourier transformation or singular value decomposition can help to overcome complicated and errorprone procedures based on the determination of numerical structure parameters such as slope and aspect. The combination of automated extraction methods and moving window technology can lead to further, more integrated insights related to complex landscape patterns.     

Simulation based analysis of secondary effects on solder fatigue

Secondary effects on thermal fatigue of solder joints, which frequently have been neglected, were studied by means of the finite element method (FEM). Based on a semi-empirical approach to predict fatigue life by evaluating the cyclic accumulated equivalent creep strain or energy density, effects of organic boards intrinsic properties on solder joint fatigue were investigated. Aspects of more realistic FR-4 board modelling were studied, in particular concerning its in-plane anisotropy and intrinsic warpage behaviour. Intrinsic board warpage was measured on test board level as well as for boards from series production. High intrinsic warpage was in particular found for several test boards. The effects for the worst case scenario observed so far were analysed for both first level and second level interconnects. The change in predicted fatigue life varied between 30% and 500%, the latter most critical effects were found at large QFN components. Another secondary effect studied was to include the frequently neglected interfacial intermetallics into FEM. It turned out that for components with relatively large standoff like LFBGAs the effects were actually negligible, but for the highly miniaturized components like chip resistors CR0201 they are the decisive factor.     

Antarctic springtime depletion of atmospheric mercury

Unlike other heavy metals that are inherently associated with atmospheric aerosols, mercury in ambient air exists predominantly in the gaseous elemental form. Because of its prolonged atmospheric residence time, elemental mercury vapor is distributed on a global scale. Recently, Canadian researchers have discovered that total gaseous mercury levels in the lower tropospheric boundary layer in the Canadian Arctic are often significantly depleted during the months after polar sunrise. A possible explanation may involve oxidation of elemental mercury, followed by adsorption and deposition of the oxidized form, leading to an increased input of atmospheric mercury into the Arctic ecosystem. Here we present the first continuous high-time-resolution measurements of total gaseous mercury in the Antarctic covering a 12-month period between January 2000 and January 2001 at the German Antarctic research station Neumayer (70 degrees 39' S, 8 degrees 15' W). We report that mercury depletion events also occur in the Antarctic after polar sunrise and compare our measurements with a data setfrom Alert, Nunavut, Canada. We also present indications that BrO radicals and ozone play a key role in the boundary-layer chemistry during springtime mercury depletion events in the Antarctic troposphere.     

Das digitale geologische Strukturmodell Bitterfeld als neuer Baustein in der Sanierungsforschung

Identification, assessment and remediation of a large-scale groundwater contamination requires a profound knowledge of the geological structure to predict the fate of contaminants in the subsurface. Within the SAFIRA-project, a model sector of the Bitterfeld/Wolfen area was chosen to transfer the structural geological data of the Tertiary and Quarternary aquifer units into a digital geological model. Using 125 selected drillholes as a base of 28 networked cross-sections, small-scale lithological and structural heterogeneities, in particular of the Quarternary layers, could be assigned to 31 litho-stratigraphic sedimentation units and depicted using a 10 × 10 m GIS grid. An assignment of hydraulic parameters to individual sedimentary bodies allows a combination with flow and transport models. The structural model was generated by combining gridding sections and additional point and lateral information of sediment distribution and allows -beyond visualisation purposes- volumetric calculations of distinct sedimentary units, which are relevant for an assessment of retardation processes in the remaining lignite seam. The present structural model is the base for a “Spatial Model Bitterfeld” and anables further investigations on the environmental impact of different scenarios.     

Comparison of analysis methods for package-induced stresses on moulded Hall sensors

Due to the piezoresistive and the piezo-Hall effect in semiconductor materials, Hall sensors show a strong temperature dependency and also a drift when subjected to temperature cycles Manic et al. (2000). Four factors mainly influence the mechanical stress in the sensitive layer. These are the geometry of the device, the differences of the coefficients of thermal expansion of the package materials, the temperature-dependent material properties and the time-dependent, viscous material properties. The objective of this investigation was to determine the mechanical stress in a moulded Hall sensor during the packaging process by finite-element simulation in comparison to experimental methods. It is shown that after each process-step the mechanical stress in the sensitive layer changes over time depending on the absolute value and the rate of the temperature change. Measurements of the inverse bending radius of glued and moulded chips show good agreement to the simulations.