Polymer miscibility in organic solvents and in plasticizers—a two-dimensional approach

From thermodynamic considerations based on associated solution models and from the Hansen's three-dimensional solubility parameter concept, it is found that the solvent power of an organic liquid for a given polymer can be characterized by two parameters, δ_h and χ_H, where δ_h is the hydrogen-bonding solubility parameter of the liquid, and χ_H is a term which takes account of the dispersion and polar interactions between the liquid and the polymer and of the effects due to temperature and molecular size of the liquid. It is also found that Hansen's solubility sphere for the polymer can be represented as a solubility circle in the proposed χ_H^?δ_h plane. The proposed approach is applied successfully to polymer–plasticizer systems.     

基于情感计算的商品评论分析系统

针对电子商务中的商品评论信息过载问题,运用情感计算理论,通过挖掘商品评论信息中的商品特征及相应的情感褒贬态度,为消费者提供一个商品特征粒度上的情感分析结果,从而帮助消费者从庞杂的商品评论中快速获取有效信息。系统首先采集指定商品的评论集并挖掘商品特征,然后结合情感语料库和词汇相似度计算,利用依存关系找到特征-极性词对以及程度副词和否定词。基于以上结果,考虑程度副词的强度,以及程度副词和否定词共现语序不同造成的语义差异,提出了商品评论情感倾向程度的计算方式。最后,进行系统实现并验证算法的有效性。实验结果表明,系统具有良好的应用效果。     

本体聚合中的预热和过滤

讨论了本体聚合中预热和过滤的顺序，对冷过滤、热过滤的优缺点进行了探讨，提出了建议     

Organic-inorganic hybrid materials from a new octa(2,3-epoxypropyl)silsesquioxane with diamines

Hybrid materials based on a new polyhedral oligomeric silsesquioxane, octa(2,3-epoxypropyl)silsesquioxane (OE) with diamines of 4,4′-methylenedianiline (DDM) and 5-trifluoromethyl-1,3-phenylenediamine (FPA) were prepared and characterized. OE was synthesized from cage-structured octaallylsilsesquioxane (OA) with m-chloroperbenzoicacid. The FTIR studies suggested that the N-H bond in diamines was not completely reacted with epoxy group due to steric hindrance and also extensive hydrogen bonding existed in the hybrid materials. The retention of the cage structure in the prepared hybrid materials was suggested by the FTIR and ²⁹Si NMR studies. The OE/FPA hybrid materials had superior thermal/mechanical characteristics than the OE/DDM due to the higher rigidity of the FPA than that of DDM or the silicon-fluorine interaction enhancing crosslinking reaction or hydrogen bonding. The prepared OE/FPA had a T_g of 170 °C, which was higher than diglycidyl ether of bisphenyl A (DGEBA)/DDM at the same stoichiometric ratio. It also had excellent thermal, mechanical, and dielectric characteristics with high storage modulus of 1.8 GPa (30 °C) and 0.3 GPa (250 °C), low coefficient of thermal expansion of 86 μm/m °C, and dielectric constant of 2.19. Thus, it can be high performance materials with potential applications for electronic packaging.     

IT capability and organizational performance: the roles of business process agility and environmental factors

The business value of information technology (IT) has been one of the top concerns of both practitioners and scholars for decades. Numerous studies have documented the positive effects of IT capability on organizational performance but our knowledge of the processes through which such gains are achieved remains limited due to a lack of focus on the business environment. Such a linkage therefore remains the subject of debate in the information systems literature. In this study, we fill this gap by investigating the mediating role of business process agility and the moderating roles of environmental factors. On the basis of matched survey data obtained from 214 IT and business executives from manufacturing firms in China, our analyses show that even though firm-wide IT capability presents the characteristics of rarity, appropriability, non-reproducibility, and non-substitutability, its impact on organizational performance is fully mediated by business process agility. Our results also show that the impact of the environment is multifaceted and nuanced. In particular, environmental hostility weakens the effect of IT capability on business process agility, while environmental complexity strengthens it. The theoretical and practical implications of this study, and its limitations, are also discussed.     

(α-MS)S-B-(α-MS)S三嵌段共聚物的合成及其结构与性能

以α-甲基苯乙烯(α-MS),苯乙烯(S)和丁二烯(B)为单体,采用两步聚合偶合法,先将α-MS,S,THF及n-BuLi于30℃下聚合1h,再加入环己烷和B,于50℃下聚合4h,最后加入偶合剂苯甲酸苯酯,反应2～3h,即得到(α-MS)S-B-(α-MS)S三嵌段热塑性弹性体。该共聚物经GPC,IR,UV,NMR,DSC等表征,(?)_n=(10～13)×10~4,(?)_w/(?)_n=1.1～1.3;当硬段/软段为30/70(质量比)时,软段中1,4-结构含量为70％～85％,形态具有相分离特征,随α-MS/S值的增加,硬段T_g可在90～160℃调节,其力学性能有一定的改善,并接近或超过SBS热塑性弹性体。     

Model for the effects of water on the cationic UV-curing of cyclohexyl epoxides

The effect of relative humidity on the photoin-duced curing kinetics of cyclohexyl epoxide and epoxide/polyol coating formulations was investigated in real-time using FTIR spectroscopy. In total, five formulations were used in this study, including a cyclohexyl epoxide without polyol, and four with polyols. The polyol formulations were varied with respect to ratio of epoxide to polyol, and molar functionality of the hydroxyl group. The formulations were exposed to a maximum of seven different relative humidities (6, 16, 20, 30, 51, 62, 75 RH). The curing speed and overall conversion of the epoxy group passed through a maxima for all the formulations. The polyol had an effect on the hydrophilicity of the overall formulation. It was also found that water and polyols had a synergistic effect on the UV-curing kinetics, in effect lowering the relative humidity to achieve a maxima. A model for UV-curing mechanisms at low, medium, and high relative humidity was proposed for both systems with and without the polyols. Part of this work was done at the Polymers and Coatings Dept., North Dakota State University, Fargo, ND 58105. Presented at the 80th Annual Meeting of the Federation of Societies for Coatings Technology, Oct. 30–Nov. 1, 2002, in New Orelans, LA. Dept. of Polymer Engineering, Akron, OH 44325-0301.     

一种新型混沌扩频卫星隐蔽通信算法

针对Logistic及改进型混沌映射只存在唯一满映射点的缺陷,设计了一种新型混沌映射函数,拓宽了满映射参数的取值范围,进而提高了混沌序列遍历性,并基于相干混沌移位键控技术,构建了新型混沌扩频卫星隐蔽通信系统。分别对新型混沌序列的随机性、相关性和平衡性,以及隐蔽通信系统的误码率进行了仿真分析,结果表明:新型混沌映射比已有映射遍历性更好,平衡性更高。原业务信号与扩频调制信号的功率比值大于20dB时,原业务接收机接收误码率基本不受影响。扩频因子为80、信道信噪比大于6dB时,隐蔽接收机误码率小于10-3,能满足一定的隐蔽通信要求。     

Effect of imidization temperature on properties of polymide films

Some mechanical and electrical properties of the BPDA/ODA/PDA polyimide film prepared on mylar followed by various cure schedules have been studied. It has been found by FTIR that the imidization reaches its maximum after a 200°C cure schedule for this polyimide. However, the optimum condition of curing is a 350°C cure schedule. Following this cure schedule, one can obtained a polymide film with good mechanical and electrical properties. © 1993 John Wiley & Sons, Inc.