Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

The compression creep behavior was studied for the ternary solder alloy 95.5Sn-3.9Ag-0.6Cu in the as-cast condition. Samples were tested under stresses of 2–45 MPa and temperatures of −25–160°C. There was a significant variability in the creep curve shape, strain magnitude, and steady-state strain-rate properties. A multivariable linear-regression analysis of the steady-state strain-rate data, using the sinh-law stress representation, indicated two mechanisms distinguished by low- and high-temperature regimes of −25–75°C and 75–160°C, respectively. The sinh-law stress exponent (n) and apparent-activation energy (ΔH) in the −25–75°C regime were 4.4 ± 0.7 kJ/mol and 25 ± 7 kJ/mol (63% confidence intervals), respectively. Those same parameters in the 75–160°C regime were 5.2±0.8 kJ/mol and 95±14 kJ/mol, respectively, for the high-temperature regime. The values of ΔH suggested a short-circuit diffusion mechanism at low temperatures and a lattice or bulk-diffusion mechanism at high temperatures. The stress dependency of the steady-state strain rate did not indicate a strong power-law breakdown behavior or a threshold stress phenomenon. Cracks and grain-boundary sliding were not observed in any of the samples. As the creep temperature increased, a coarsened particle boundary and particle depletion zone formed in the region of fine Ag₃Sn particles that existed between the Sn-rich phase areas. The coarsened particle boundary, as well as accelerated coarsening of Ag₃Sn particles, were direct consequences of the creep deformation process.     

Electronic compensation technique to mitigate nonlinear phase noise

Nonlinear phase noise, often called the Gordon-Mollenauer effect, can be compensated electronically by subtracting from the received phase a correction proportional to the received intensity. The optimal scaling factor is derived analytically and found to be approximately equal to half of the ratio of mean nonlinear phase noise and the mean received intensity. Using optimal compensation, the standard deviation of residual phase noise is halved, doubling the transmission distance in systems limited by nonlinear phase noise.     

Integrated Dual-Display-Based 3G Mobile Phone / Wireless Terminal

In this paper, we describe HW and SW features of the developed prototype of a hybrid 3G mobile phone and wireless terminal, which provides integral video projection onto two VGA/2 displays that, when put side-by-side, form the integrated display with the ratio of the overall width to its overall height, equal to 4:3, so providing the integral video VGA format and enabling visual presentation of standard full-size web pages, PC mainstream SW screens (such as e.g. the ones of e-mail clients), multi-media content etc. When not in use, the displays can be fold back one onto each other, so preserving the industry-standard dimensions of the device. The two displays that share the image provide it with overall resolution of 640 x 480 pixels per inch. The device is driven by Texas Instruments OMAP 2420 multimedia processor with ARM1136 core and Linux operating system. In addition, the device is equipped with specially developped prototypes of unique spring/microgenerator-based battery charger as well as with ultra-thin mountable foil-based QWERTY keyboard.     

Performance of Efficient Signal Detection for LED-ID Systems

In this paper, effects of reader-to-reader interference are investigated for LED identification (LED-ID) system in a multi-reader environment. The LED-ID readers typically use different channels to avoid collision between readers. However, in-channel collision usually happens in terms of interrogation range. A reader-to-reader interference scenario is proposed, and nominal interrogation range of a desired reader is derived from this model. In order to evaluate the LED-ID reader-to-reader interference quantitatively, an efficient detection scheme is proposed and simulated by employing spreading sequence. The spreading sequence is inserted between each user’s frame formats. In the receiver, the desired signal is detected by using correlation among inserted spreading sequences. From simulation results, it is confirmed that the proposed scheme is very effective to enhance reliability of LED-ID communication systems.     

A blind audio steganalysis based on feature fusion

In this paper, we present a blind steganalysis based on feature fusion. Features based on Short Time Fourier Transform (STFT), which consists of second-order derivative spectrum features of audio and Mel-frequency cepstrum coefficients, audio quality metrics and features on linear prediction residue are extracted separately. Then feature fusion is conducted. The performance of the proposed steganalysis is evaluated against 4 steganographic schemes: Direct Sequence Spread Spectrum (DSSS), Quantization Index Modulation (QIM), ECHO embedding (ECHO), and Least Significant Bit embedding (LSB). Experiment results show that the classifying performance of the proposed detector is much superior to the previous work. Even more exciting is that the proposed methodology could detect the four steganography, with 85%+ classification accuracy achieved in all the detections, which makes the proposed steganalysis methodology capable of being regarded as a blind steganalysis, and especially useful when the steganalyzer are without the knowledge of the steganographic scheme employed in data embedding.     

Reprocessing of thermally oxidized aluminum arsenide (AlAs) in epitaxial multilayers without delamination

Annealing or processing of AlAs that has been subjected to a wet thermal oxidation process can result in severe delamination of material at the oxidation front. This paper reports a procedure for preventing this delamination and presents a possible cause for the delamination.     

Modeling of the zero-bias resistance-area product of long wavelength infrared HgCdTe-on-Si diodes fabricated from molecular beam epitaxy-grown epitaxial layers

The electrical effects of dislocations has been studied by modeling zero-bias resistance-area product (R₀A) of long wavelength infrared diodes fabricated in molecular beam epitaxy (MBE)-grown HgCdTe-Si epitaxial films. Results show that dislocations influence both 40 K and 78 K R₀A products in high dislocation density (HgCdTe/Si) material. In low dislocation density samples (HgCdTe/CdZnTe), the variations in 78 K R₀A are limited by the composition (x) variations in Hg_1-xCd_xTe material, whereas dislocation contribution dominates the variations at 40 K. The origin of relatively large spread in 40 K R₀A in both types of samples is traced to the statistical variations in the core charges of dislocations. It is concluded that additional alternatives besides the reduction of dislocation density (such as control of core charges), may also need attention in order to make Si a viable substrate material for the growth of HgCdTe epitaxial layers suitable for devices operating at 40 K.     

Development of nano-composite lead-free electronic solders

Inert, hybrid inorganic/organic, nano-structured chemicals can be incorporated into low melting metallic materials, such as lead-free electronic solders, to achieve desired levels of service performance. The nano-structured materials technology of polyhedral oligomeric silsesquioxanes (POSS), with appropriate organic groups, can produce suitable means to promote bonding between nano-reinforcements and the metallic matrix. The microstructures of lead-free solder reinforced with surface-active POSS tri-silanols were evaluated using scanning electron microscopy (SEM). Wettability of POSS-containing lead-free solders to copper substrate was also examined. Steady-state deformation of solder joints made of eutectic Sn-Ag solder containing varying weight fractions of POSS of different chemical moieties were evaluated at different temperatures (25°C, 100°C, and 150°C) using a rheometric solids analyzer (RSA-III). Mechanical properties such as shear stress versus simple shear-strain relationships, peak shear stress as a function of rate of simple shear strain, and testing temperature for such nano-composite solders are reported. The service reliability of joints made with these newly formulated nano-composite solders was evaluated using a realistic thermomechanical fatigue (TMF) test profile. Evolution of microstructures and residual mechanical property after different extents of TMF cycles were evaluated and compared with joints made of standard, unreinforced eutectic Sn-Ag solder.     

A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric

To realize embedded resistors on multilayer benzocyclobutene (BCB) either on-chip or on-board, a low-cost large format electroless process for deposition of NiP and NiWP thin-film resistors using both low-temperature (25°C) and high-temperature (90°C) baths has been developed. The electroless process exhibits uniform resistor thickness in the submicron range and offers low profile and excellent adhesion to the BCB dielectric layer. The resistor films also act as a seed layer for direct electroplating of copper traces. The NiP alloys can also be tailored to a variable temperature coefficient of resistance (TCR) with different alloy compositions. The electroless process can be adopted in the PCB manufacturing industries with no additional investment. This article is the first report on electroless plated thin film resistors on low loss BCB dielectric.     

A Distributed Query Protocol in Wireless Sensor Networks

In wireless sensor networks, query execution over a specific geographical region is an essential function for collecting sensed data. However, sensor nodes deployed in sensor networks have limited battery power. Hence, the minimum number of connected sensor nodes that covers the queried region in a sensor network must be determined. This paper proposes an efficient distributed protocol to find a subset of connected sensor nodes to cover the queried region. Each node determines whether to be a sensing node to sense the queried region according to its priority. The proposed protocol can efficiently construct a subset of connected sensing nodes and respond the query request to the sink node. In addition, the proposed protocol is extended to solve the k-coverage request. Simulation results show that our protocol is more efficient and has a lower communication overhead than the existing protocol.