Processing and characterization of a-Si:H photoresists for a vacuum-compatible photolithography process

The vision of achieving a completely in-vacuum process for fabricating HgCdTe detector arrays is contingent on the availability of a vacuumcompatible photolithography technology. One such technology for vacuum photolithography involves the use of amorphous-hydrogenated Si (a-Si:H) as a photoresist. In this work, we deposit a-Si:H resists via plasma-enhanced chemical-vapor deposition (PECVD) using an Ar-diluted silane precursor. The resists are then patterned via excimer laser exposure and development etched in a hydrogen plasma where etch selectivities between unexposed and exposed regions exceed 600:1. To determine the best conditions for the technique, we investigate the effects of different exposure environments and carry out an analysis of the a-Si:H surfaces before and after development etching. Analysis via transmission electron microscopy (TEM) reveals that the excimer-exposed surfaces are polycrystalline in nature, indicating that the mechanism for pattern generation in this study is based on melting and crystallization. To demonstrate pattern transfer, underlying CdTe films were etched (after development of the resist) in an electron cyclotron resonance (ECR) plasma, where etch selectivities of approximately 8:1 have been achieved. The significance of this work is the demonstration of laser-induced poly-Si as an etching mask for vacuum-compatible photolithography.     

Terahertz Heterodyne Array Receivers for Astronomy

Journal of Infrared, Millimeter, and Terahertz Waves - We review the development of multi-pixel heterodyne receivers for astronomical research in the submillimeter and terahertz spectral domains....     

Localized Collection of Airborne Analytes: A Transport Driven Approach to Improve the Response Time of Existing Gas Sensor Designs

The detection of single binding has been a recent trend in sensor research introducing various sensor designs where the active sensing elements are nanoscopic in size. Currently, transport and collection of airborne analytes for gas sensors is either diffusion based or non‐localized and it becomes increasingly unlikely for analytes to interact with sensing structures where the active area is shrunk, trading an increased sensitivity with a slow response time. This report introduces a corona discharge based analyte charging method and an electrodynamic nanolens based analyte concentration concept to effectively transport airborne analytes to sensing points to improve the response time of existing gas sensor designs. Localized collection of analytes over a wide range, including microscopic particles, nanoparticles, and small molecules, is demonstrated. In all cases, the collection rate is several orders of magnitudes higher than in the case where the collection is driven by diffusion. The collection scheme is integrated on an existing SERS (surface‐enhanced Raman spectroscopy) based sensor. In terms of response time, the process is able to detect analytes at 9 ppm (parts per million) within 1 s. As a comparison, 1 h is required to reach the same signal level when diffusion‐only‐transport is used.     

Charge transfer in thin films of donor–acceptor complexes studied by infrared spectroscopy

The degree of charge transfer in thin films of organic charge transfer (CT)-complexes, which are deposited via thermal evaporation, is examined via infrared-spectroscopy. We demonstrate a linear relationship between the shift in the excitation energy of the CN-stretching mode of CT-complexes with the acceptor 7,7,8,8-tetracyanoquinodimethane (TCNQ) and the charge transfer. The measured correlation corresponds very well with DFT calculations. For Na-TCNQ we observe a splitting in the peak of the CN-stretching mode, which can be explained by the coupling of two modes and was confirmed by the calculations. In CT-complexes with partial charge transfer the appearance of an electronic excitation is demonstrated.     

Plasma-Cleaned InSb (112)B for Large-Area Epitaxy of HgCdTe Sensors

Plasma etching of (112)B InSb to prepare this semiconductor for the heteroepitaxy deposition of CdTe and initial studies of CdTe epilayers grown by molecular beam epitaxy (MBE) on InSb (112)B substrates cleaned with various plasma treatments are presented. X-ray diffraction rocking curve maps of the MBE CdTe epilayers on 3-inch InSb (112)B substrates have full-width at half-maxima (FWHM) values in the range of 20 arcsec to 30 arcsec. An etch pit density analysis of the 3-inch CdTe epilayers reveals a defect density of 1.0 × 10⁷ cm⁻² and 7.7 × 10⁵ cm⁻² at the center and edge of the wafer, respectively. Evaluation of a standard HgCdTe annealing process suggests that the removal of the InSb substrate is likely to be needed prior to any postgrowth annealing in Hg overpressure. Finally, we present a low-energy helium plasma exposure of wet-etched InSb (112)B substrates that provides a uniform epi-ready surface that is nearly stoichiometric, and free of oxide and residual contaminants.     

Relevance of Thermal Mismatch in Large-Area Composite Substrates for HgCdTe Heteroepitaxy

It is well known that the large lattice mismatch (>14%) associated with CdTe/Si, CdTe/Ge, and CdTe/GaAs composite substrates, is a great contributor to large dislocation densities and other defects that limit the performance of HgCdTe-based infrared detectors. Though thermal expansion mismatch is another possible contributor to material defects, little work has been done towards documenting and understanding its effects in these systems. Here, we perform studies to determine the relative contributions of lattice and thermal mismatch to CdTe film characteristics, including dislocation density and residual stress. Unannealed and thermally cycled films are characterized using x-ray diffraction, defect decoration, and Nomarski and transmission electron microscopy. For CdTe/Si, the residual stress is consistently observed to be tensile, while for CdTe/Ge and CdTe/GaAs, a compressive residual film stress is measured. We show based on theoretically predicted stress levels that the experimental measurements imply the dominance of thermal mismatch in the residual stress characteristics.     

Structural Analysis of CdTe Hetero-epitaxy on (211) Si

X-ray diffraction full-width at half-maximum (XRD FWHM), reflection high-energy electron diffraction (RHEED), and atomic force microscopy (AFM) indicate a mosaic structure for molecular-beam epitaxy (MBE) (211)B CdTe/Si. AFM measurements indicate long, thin, small-angle-disoriented grains for CdTe/Si epilayers. These disoriented grains are ~1 μm in the [] direction and are ~40 nm in the [] direction. The RHEED pattern in the [] direction depicts nearly ideal single-crystal periodicity. The RHEED pattern in the [] direction is indicative of small-angle-disoriented crystalline grains. Scanning electron microscopy (SEM), AFM, and XRD measurements all indicate an approximate factor of 10 increase in the Everson etch pit density (EPD) over standard Nomarski microscopy Everson EPD determination.