火药燃烧生成等离子体规律数值仿真研究

为了研究火药燃烧生成等离子体规律,分析了火药燃烧时的物理化学过程,建立了火药燃烧时生成等离子密度规律数学模型,并对火药燃烧时等离子体生成规律进行数值模拟仿真。将数值模拟的结果与试验结果进行对比,确定模型的正确性与可行性。利用所建立的数学模型,分析不同的装药结构参数对等离子体的影响,得到了等离子体密度变化的规律,为下一步提高等离子体生成浓度奠定基础。     

基于大数据分析的频谱资源管控系统设计

针对电磁环境恶化,频谱资源匮乏、分配不均及其在空间、时间和频域上存在的高度相关性的问题,文中提出了一种基于大数据分析的频谱资源管控系统。该系统由频谱监测与存储、数据分析处理和管控中心3个功能模块组成。首先,采用分布式的数据采集架构采集频谱信息和GPS信息;然后,使用大数据分析技术预测下一次时刻频谱资源的使用情况,以合理的检测可用信道、提高频谱监测的效率,优化频谱监测的策略;最后,使用管控中心管理不同等级用户的频谱使用权限。仿真测试结果表明,该系统能有效地处理海量的频谱数据、提高频谱资源的利用率。     

区域气象与雷电活动对雷击风险评估的细化与改进

本文以武汉市安山液化天然气存储基地为案例,提出利用区域内气象与雷电活动环境数据,针对重点雷击风险评估对象进行参数的修正,细化了风险评估服务的项目,改进了传统风险评估的实效性与针对性,为重点区域的雷电风险评估服务提供了更为实际科学的依据,能够有效地减低因雷电导致的人员伤亡、财产损失等各项灾害。     

迫弹激光引信用脉冲半导体激光电源的设计与应用

设计了适应于迫弹激光近炸引信的小体积、低电压、窄脉宽、高功率的脉冲半导体激光电源.采用电容充放电的模式,选用高速大功率MOSFET管作为开关,设计了相应的高速开关控制电路.激光电源模块的重复频率高达50kHz,常规热电池供电电压条件下的输出脉冲激光峰值功率为9W,光脉冲上升沿为4.2 ns,光脉宽为10 ns,为有效提...     

OFDMA系统中对干扰抑制的新型无线资源管理

In Orthogonal Frequency Division Multiple Access (OFDMA) systems, such as Long Term Evolution (LTE) and so on, the resources used by each user are orthogonal, and the OFDMA systems performances are mainly affected by the inter-cell interference. Therefore, the inter-cell interference mitigation technology becomes a hotspot. The objective of interference mitigation technologies used in OFDMA systems are to increase cell-edge throughput and average cell throughput. In this paper, the Resource Block Planning (BRBP) based scheme is proposed to mitigate the inter-cell interference and improve the cell-edge throughput. Comparison between the simulation results of BRBP and Round Robin (RR) illustrates that the enhanced performance of BRBP.     

F150交换机告警关联规则的研究

为了提高电信网络运营效率，降低维护成本，电信运营企业在网络告警管理系统中需要引入数据挖掘技术。本文主要研究利用数据挖掘技术来进行故障的管理，即对告警进行关联性分析，详细分析了告警序列数据的关联规则挖掘算法，并在南昌本地网F150交换机的告警数据库中予以实现，同时对实际挖掘结果进行分析和整理，推导出一些实用的关联规则。     

Comparative study of micro-BGA reliability under bending stress

The micro-ball grid array (/spl mu/BGA), a form of chip scale package (CSP), was developed as one of the most advanced surface mount devices, which may be assembled by ordinary surface mount technology. In the latest /spl mu/BGA type, eutectic tin-lead solder ball bumps are used instead of plated nickel and gold (Ni/Au) bumps. Assembly and reliability of the /spl mu/BGA's PCB, which is soldered by conventional surface mount technology, has been studied in this paper. The bending cycle test (1000 /spl mu//spl epsi/ to -1000 /spl mu//spl epsi/), is used to investigate the fatigue failure of solder joints of /spl mu/BGA, PBGA, and CBGA packages reflowed with different heating factors (Q/sub /spl eta//), defined as the integral of the measured temperature over the dwell time above liquidus (183/spl deg/C). The fatigue lifetime of the /spl mu/BGA assemblies firstly increases and then decreases with increasing heating factor. The greatest lifetime happens while Q/sub /spl eta// is near 500 second-degree. The optimal Q/sub n/ range is between 300 and 750 s/spl deg/C. In this range, the lifetime of the /spl mu/BGA assembly is greater than 4500 cycles if the assemblies are reflowed in nitrogen ambient. SEM micrographs reveal that both /spl mu/ & P-BGA assemblies fail in the solder joint at all heating factors. All fractures are near and parallel to the PCB pad. In the /spl mu/BGA assemblies cracks always initiate at the point of the acute angle where the solder joint joins the PCB pad, and then propagate in the section between the Ni/sub 3/Sn/sub 4/ intermetallic compound (IMC) layer and the bulk solder. In the CBGA assembly reliability test, the failures are in the form of delamination, at the interface between the ceramic base and metallization pad.     

Study of the self-alignment of no-flow underfill for micro-BGA assembly

As a concept to achieve high throughput low cost flip-chip assembly, a process development activity is underway, implementing next generation flip-chip processing based on large area underfill printing/dispensing, IC placement, and simultaneous solder interconnect reflow and underfill cure. The self-alignment of micro-BGA (ball grid array, BGA) package using flux and two types of no-flow underfill is discussed in this paper. A “rapid ramp” temperature profile is optimized for reflow of micro-BGA using no-flow underfill for self-aligning and soldering. The effect of bonding force on the self-alignment is also described. A SOFTEX real time X-ray inspection system was used to inspect samples to ensure the correct misalignment before reflow, and determine the residual displacement of solder joints after reflow. Cross-sections of the micro-BGA samples are taken using scanning electronic microscope. Our experimental results show that the self-alignment of micro-BGA using flux is very good even though the initial misalignment was greater than 50% from the pad center. When using no-flow underfill, the self-alignment is inferior to that of using flux. However, for a misalignment of no larger than 25% from the pad center, the package is also able to self-align with S1 no-flow underfill. However, when the misalignment is 37.5–50% from the pad center, there are 10–14% residual displacement after reflow. The reason is the underfill resistant force inhibiting the self-alignment of the package due to rapid increment of underfill viscosity during reflow. The self-alignment of micro-BGA package using no-flow underfill allows only <25% misalignment prior to the soldering. During assembling, although the bonding force does not influence on the self-alignment of no-flow underfill, a threshold bonding force is necessary to make all solder balls contact with PCB pads, for good soldering. The no-flow underfill is necessary to modify the fluxing/curing chemistry for overcoming the effect of tin metal salt produced during soldering on underfill curing, and for maintaining the low viscosity during soldering to help self-alignment.     

基于下视图像的打击效果评估系统研究

研究了打击效果评估的基本概念及该技术在国外的发展与应用情况,提出了基于下视图像的毁伤特征提取方法与典型目标毁伤评估准则。从物理级、功能级和系统级三个层次对打击效果评估进行了描述,提出了基于变化检测的物理级毁伤效果评估方法、基于自动目标识别的物理级毁伤评估方法和基于专家知识库的功能级毁伤评估方法,开发实现了基于下视图像的典型目标打击效果评估系统。仿真结果表明,所提出打击效果评估方法是有效的。     

噪声调频干扰信号对直扩系统误码率影响的仿真分析

分析了噪声调频干扰信号的性能,建立了干扰系统和噪声调频干扰信号的仿真模型,仿真出不同干扰频率和不同干扰带宽下噪声调频干扰信号对直扩系统影响的误码率曲线,结果证明了设计的噪声调频干扰模型能够有效的干扰扩频通信系统。