Thermal and mechanical properties of epoxy composites reinforced by a natural hydrophobic sand

If a low weight percentage of crude fine fillers can improve properties of polymer materials directly without complicated chemical treatment process involved, it will be significant for many industrial applications. Our previous study indicated that a kind of Cancun natural sand could be an effective filler material for polymer composites. In this current work, the epoxy composites reinforced by this kind of natural sand particles were prepared and thermal and mechanical properties of the composites containing up to 5 wt % of the sand particles were characterized. Results showed that the highest flexural strength appears in the epoxy composite containing 1 wt % sand particles. A damage model was used to interpret the flexural properties, which showed an acceptable agreement with the experimental results. The glass transition temperature, high temperature storage modulus, and dimensional stability of the sand/epoxy composites monotonically increased with the addition of the sand particles. The sand particle/epoxy composites also displayed a noticeable enhancement in thermal conductivity. Theoretical analysis showed that in addition to conduction, other heat transport mechanisms played roles in the improved heat transmission through the composites. As a natural porous micron-scale material, Cancun sand has the potential for applications in cost-effective composites with enhanced mechanical and thermal properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Effect of current stressing on the reliability of 63Sn37Pb solder joints

The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 10² A/cm² in the solder joint with diameter of 800 μm and 1.7 × 10⁴ A/cm² in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with 3 A current had an extensive growth of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion. This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was initially formed during the reflow soldering.     

粉末冶金温压工艺的研究进展及其展望

综述了粉末冶金温压工艺的研究进展,概述了温压工艺的粉末原料、聚合物、温度、压力、烧结环节对温压工艺的影响和温压工艺的致密化机理。详细介绍了温压工艺的新进展—流动温压、高压温压等,并对其应用前景进行了展望。     

一种中温C/C复合材料抗氧化涂层的制备及其性能

制备了一种工作温度约1 173 K的C/C复合材料抗氧化复合涂层,它由磷酸盐过渡层和陶瓷相阻挡层构成,通过与单一陶瓷相涂层的对比试验研究了它的抗氧化机理。涂覆有该复合涂层的C/C复合材料试样,在空气中1 173 K时氧化10 h的失重率为11.25％,氧化失重率为9.84×10~(-5)g/(cm~2·min),而且其氧化失重率随氧化时间延长而降低;4 h内经过30次从1 173 K至室温急冷急热循环后,失重率为6.38％,涂层基本完好,说明涂层在温度不超过1 173 K时具有良好的抗氧化性和抗热震性。该种涂层适合于中温下C/C复合材料的抗氧化保护。     

Techniques and Apparatus for Measuring Rotational Core Losses of Soft Magnetic Materials

In many situations such as the cores of a rotating electrical machine and the T joints of a multiphase transformer, the local flux density varies with time in terms of both magnitude and direction, i.e. the flux density vector is rotating. Therefore, the magnetic properties of the core materials under the rotating flux density vector excitation should be properly measured, modeled and applied in the design and analysis of these electromagnetic devices. This paper presents an extensive review on the development of techniques and apparatus for measuring the rotational core losses of soft magnetic materials based on the experiences of various researchers in the last hundred years.     

新型高温永磁体的研制

通过分析影响磁体高温性能的因素,设计了新磁体的成分为:Cu含量高,Fe含量低,Zr适量,Sm含量高;采用粉末冶金工艺制备了高温Sm_2(CoFeCuZr)_(17)永磁体。制得的磁体室温磁性能为:B_r1.075 T,H_(ei)2 098.2 kA/m,H_(eb) 776.1 kA/m,H_k843.8 kA/m,(BH)_(max)210.0 kj/m~3;在200℃时的磁性能为:B_r0.991 T,H_(ci)1 175.7 kA/m,H_(cb)531.7 kA/m,H_k577.9 kA/m,(BH)_(max)172.5 kJ/m~3;矫顽力温度系数β(20～200℃)为-0.24％/℃。经理论分析和实验验证,磁体的使用温度均超过400℃,为高温环境(高于400℃)提供了一种实用性永磁材料。     

Piezoelectric Nanogenerators for Self-Powered Nanodevices

A novel approach converts nanoscale mechanical energy into electric energy for self-powering nanodevices.In our own work, we've used piezoelectric zinc-oxide nanowire (ZnO NW) arrays to demonstrate a novel approach for converting nanoscale mechanical energy into electric energy. Here, we review the fundamental principle behind the nanogenerator, present an approach for improving its performance, and discuss some of the challenges we face in pushing this technology to reach its potential.     

塔河渣油高温催化临氢热转化技术研究

以塔河减压渣油（简称塔河减渣）为原料，在实验室小型试验装置和中型连续试验装置上，对在较高温度条件下催化临氢热转化加工塔河减渣的工艺操作条件及改质效果进行了系统研究。采用高分散的油溶性催化剂，在高压釜反应器中考察了反应温度、反应压力、催化剂添加量、溶剂油添加量、反应时间以及助剂添加量对塔河减渣催化临氢热转化反应的转化率和缩合率的影响，优化了操作参数。在优化的操作条件下，进行了塔河减渣催化临氢热转化中型试验，得到初馏点大于524 ℃组分的裂化率为85.2%，馏分油收率为80%，金属（Ni+V）和沥青质脱除率均大于90%。     

Verifiable Distributed Oblivious Transfer and Mobile Agent Security

The mobile agent is a fundamental building block of the mobile computing paradigm. In mobile agent security, oblivious transfer (OT) from a trusted party can be used to protect the agent’s privacy and the hosts’ privacy. In this paper, we introduce a new cryptographic primitive called Verifiable Distributed Oblivious Transfer (VDOT), which allows us to replace a single trusted party with a group of threshold trusted servers. The design of VDOT uses a novel technique called consistency verification of encrypted secret shares. VDOT protects the privacy of both the sender and the receiver against malicious attacks of the servers. We also show the design of a system to apply VDOT to protect the privacy of mobile agents. Our design partitions an agent into the general portion and the security-sensitive portion. We also implement the key components of our system. As far as we know, this is the first effort to implement a system that protects the privacy of mobile agents. Our preliminary evaluation shows that protecting mobile agents not only is possible, but also can be implemented efficiently. This work was supported in part by the DoD University Research Initiative (URI) program administered by the Office of Naval Research under grant N00014-01-1-0795. Sheng Zhong was supported by ONR grant N00014-01-1-0795 and NSF grants ANI-0207399 and CCR-TC-0208972. Yang Richard Yang was supported in part by NSF grant ANI-0207399. A preliminary version of this paper was presented at the DialM-POMC Joint Workshop on Foundations of Mobile Computing in 2003. Sheng Zhong received his Ph.D. in computer science from Yale University in the year of 2004. He holds an assistant professor position at SUNY Buffalo and is currently on leave for postdoctoral research at the Center for Discrete Mathematics and Theoretical Computer Science (DIMACS). His research interests, on the practical side, are security and incentives in data mining, databases, and wireless networks. On the theoretical side, he is interested in cryptography and game theory. Yang Richard Yang is an Assistant Professor of Computer Science at Yale University. His research interests include computer networks, mobile computing, wireless networking, sensor networks, and network security. He leads the LAboratory of Networked Systems (LANS) at Yale. His recent awards include a Schlumberger Fellowship and a CAREER Award from the National Science Foundation. He received his B.E. degree from Tsinghua University (1993), and his M.S. and Ph.D. degrees from the University of Texas at Austin (1998 and 2001).