Mumford-Shah model for one-to-one edge matching.

This paper presents a new algorithm based on the Mumford-Shah model for simultaneously detecting the edge features of two images and jointly estimating a consistent set of transformations to match them. Compared to the current asymmetric methods in the literature, this fully symmetric method allows one to determine one-to-one correspondences between the edge features of two images. The entire variational model is realized in a multiscale framework of the finite element approximation. The optimization process is guided by an estimation minimization-type algorithm and an adaptive generalized gradient flow to guarantee a fast and smooth relaxation. The algorithm is tested on T1 and T2 magnetic resonance image data to study the parameter setting. We also present promising results of four applications of the proposed algorithm: interobject monomodal registration, retinal image registration, matching digital photographs of neurosurgery with its volume data, and motion estimation for frame interpolation.     

Resistance Compression Networks for Radio-Frequency Power Conversion

A limitation of many high-frequency resonant inverter topologies is their high sensitivity to loading conditions. This paper introduces a new class of matching networks that greatly reduces the load sensitivity of resonant inverters and radio frequency (RF) power amplifiers. These networks, which we term resistance compression networks, serve to substantially decrease the variation in effective resistance seen by a tuned RF inverter as loading conditions change. We explore the operation, performance characteristics, and design of these networks, and present experimental results demonstrating their performance. Their combination with rectifiers to form RF-to-dc converters having narrow-range resistive input characteristics is also treated. The application of resistance compression in resonant power conversion is demonstrated in a dc-dc power converter operating at 100MHz     

A 5-GHz highly integrated receiver front-end

In this paper a radio front-end for a IEEE 802.11a and HIPERLAN2 sliding-IF receiver is presented. The circuit, implemented in a low-cost 46-GHz-f _T silicon bipolar process, includes a variable-gain low noise amplifier and a double-balanced mixer. Thanks to monolithic LC filters and on-chip single-ended-to-differential conversion of the RF signal, the proposed solution does not require the expensive image rejection filter and an external input balun. The receiver front-end exhibits a 4.3-dB noise figure and a power gain of 21 dB, providing an image rejection ratio higher than 50 dB. By using a 1-bit gain control, it achieves an input 1-dB compression point of −11 dBm, while drawing only 22 mA from a 3-V supply voltage.     

Nano-Engineered Carbon Fibre-Based Piezoelectric Smart Composites for Energy Harvesting and Self-Powered Sensing

The integration of piezoelectric materials onto carbon fiber (CF) can add energy harvesting and self-power sensing capabilities enabling great potential for “Internet of Things” (IoT) applications in motion tracking, environmental sensing, and personal portable electronics. Herein, a CF-based smart composite is developed by integrating piezoelectric poly(3,4-ethylenedioxythiophene) (PEDOT)/CuSCN-coated ZnO nanorods onto the CF surfaces with no detrimental effect on the mechanical properties of the composite, forming composites using two different polymer matrices: highly flexible polydimethylsiloxane (PDMS) and more rigid epoxy. The PDMS-coated piezoelectric smart composite can serve as an energy harvester and a self-powered sensor for detecting variations in impact acceleration with increasing output voltage from 1.4 to 7.6 V under impact acceleration from 0.1 to 0.4 m s⁻². Using epoxy as the matrix for a CF-reinforced plastic (CFRP) device with sensing and detection functions produces a voltage varying from 0.27 to 3.53 V when impacted at acceleration from 0.1 to 0.4 m s⁻², with a lower output compared to the PDMS-coated device attributed to the greater stiffness of the matrix. Finally, spatially sensitive detection is demonstrated by positioning two piezoelectric structures at different locations, which can identify the location as well as the level of the impacting force from the fabricated device.     

Energy Transfer Induced by TADF Polymer Enables the Recycling of Excitons in Perovskite Solar Cells

Formamidinium lead triiodide (FAPbI₃) has been demonstrated as the most efficient perovskite system to date, due to its excellent thermal stability and an ideal bandgap approaching the Shockley-Queisser limit. Whereas, there are intrinsic quantum confinement effects in FAPbI₃, which lead to unwanted non-radiative recombination. Additionally, the black α-phase of FAPbI₃ is unstable under room temperature due to the significant residual tensile stress in the film. To simultaneously address the above issues, a thermally-activated delayed fluorescence polymer P1 is designed in the study to modify the FAPbI₃ film. Owing to the spectral overlap between the photoluminescence of P1 and absorption of the above-bandgap quantum wells of FAPbI₃, the Förster energy transfer occurs at the P1/FAPbI₃ interface, which further triggers the Dexter energy transfer within FAPbI₃. The exciton “recycling” can thus be realized, which reduces the non-radiative recombination losses in perovskite solar cells (PSCs). Moreover, P1 is found to introduce compressive stress into FAPbI₃, which relieves the tensile stress in perovskite. Consequently, the PSCs with P1 treatment achieve an outstanding power conversion efficiency (PCE) of 23.51%. Moreover, with the alleviation of stress in the perovskite film, flexible PSCs (f-PSCs) also deliver a high PCE of 21.40%.     

Performance Analysis of the Primary User in the Secondary User Relay Assisted Spectrum Sharing Networks

In this paper, inaccurate spectrum detecting by the secondary user (SU) is taken into account. The impact of the interference caused by the SUs due to miss detection on the primary user (PU) in a spectrum sharing network is analyzed, and those SU nodes of correct detection are assumed to act as potential relays to assist the PU transmission process based on two proposed cooperative transmission schemes, referred to as, the distance based and the signal-to-noise-ratio (SNR) based schemes. We utilize stochastic geometry to analyze the impact of the secondary network parameters and cooperative transmission schemes on a typical primary source–destination (S–D) pair for the SU relay assisted spectrum sharing networks in Rayleigh fading environment. Using this approach, closed-form expressions for the primary system success probabilities with those cooperative transmission schemes as well as the PU direct re-transmission scheme are derived respectively. Simulations confirm our analytical derivations and results demonstrate that significant improvement on the PU success probability by using SU cooperative transmission schemes, and the SNR based scheme is superior to the distance based scheme.     

Design of a Compact Millimeter-Wave Microstrip Antenna with Wide Bandwidth and Broad Beamwidth

Design of a novel compact millimeter-wave microstrip antenna with wide bandwidth and broad beamwidth is presented. In the structure, multiple layers and a parasitic element as well as a coupling aperture are used to achieve wideband, while a conducting cylinder and the coupling aperture are used to obtain broad beamwidth. Finally, phased array with eight present elements has been designed as an example. Compared to traditional microstrip antennas and arrays, present antenna and array are of smaller dimension and broader beamwidth as well as wider bandwidth.     

基于特征参数融合的语音情感识别方法

语音情感识别是人工智能的重要研究领域之一，特征参数提取的准确性直接影响识别的效果。分析了发音持续时间、平均振幅、基音频率，第一共振峰和Mel频率倒谱参数，并基于模糊熵理论提取了各参数的权重。再利用模糊熵进行有效的度量融合．最后通过改进后综合判决对情感语句做出识别判定。研究发现融合后的参数增强了情感识别的效果。     

Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications

This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7/spl deg/C. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps.