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121.
提出一种集成共享平台,是一种可对外提供多种基本且可扩展接口,以适应不同接口的应用系统。基于此平台,多个系统之间可以相互调用多种服务,提高服务管理功能的同时进行无障碍的信息交互;及时发现分析系统交互异常信息,实现智能维护管理。当出现新的接口协议时,只需针对所述平台进行一次新接口协议适配器的开发,即可完成新接口的接入,提高了平台开发效率,降低了开发维护成本。本平台将传统的点对点的应用方式改为多对多的总线方式,实现了各系统间简单便捷的信息交互,优化了各系统间的架构,易于管理和维护,减少了接入系统的接口改造工作。 相似文献
122.
Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS) is investigated as a transparent cathode to replace indium tin oxide (ITO) in inverted polymer solar cells. Increasing the thickness of the PEDOT:PSS electrode leads to a reduction in transparency and sheet resistance which lowers the photocurrent but increases the fill factor of the solar cells. The offset of photocurrent and fill factor as the thickness is increased leads to a saturation of the power conversion efficiency to 3%. These electrodes were applied to flexible substrates showing similar device performance to glass based devices. Cyclic bending test of these flexible polymer electrodes show improved conversion efficiency retention (92%) when compared to flexible ITO based electrodes (50%) after 300 bend cycles. In addition to using PEDOT:PSS as a cathode replacement for ITO in inverted solar cells, its use as a semi-transparent anode replacement to Ag is also examined. Semi-transparent inverted solar cells fabricated with ITO as the cathode and PEDOT:PSS as the top anode electrode were demonstrated showing efficiencies of 2.51% while replacement of both ITO and Ag with PEDOT:PSS as both the cathode and anode show efficiencies of 0.47%. 相似文献
123.
面向服务的综合电子信息系统软件策略 总被引:1,自引:0,他引:1
针对SOA在综合电子信息系统中的应用,介绍了SOA的概念,分析了应用需求,研究了基于SOA的系统软件结构和主要特征;从标准化、构件化、工具化、数据模型、服务总线、治理和管理等方面提出了SOA软件发展策略;探索了SOA软件的实现方法. 相似文献
124.
The thermo-mechanical testing of HYSOL FP4549 polymer-filled underfill materials was conducted under different strain rate and temperature environment. A new specimen preparation procedure and further test methodology are developed to characterize the time–temperature mechanical behaviors of underfill materials. The stress–strain behavior of materials is simulated with constitutive framework, and the dependence of Young’s modulus on temperature and strain rate was evaluated. In addition, the specimens were tested with microforce testing system to evaluate the creep curve of underfill materials as a function of temperature and stress level. In view of the uncertainty of the Young’s modulus determination, the specimens were tested with unloading–reloading technique to verify the test results and investigate its cyclic mechanical behaviors. On the other hand, the adhesion strength of underfill materials are tested between different adhesion surface by different deformation rate after some isothermal and hygro-thermal environments attack, which is to simulate the environment that the electronic components may be encountered. The results reveal that the rise of the temperature and moisture cause the apparent reduction of the surface adhesion strength, due to the microstructure transition of materials and the diffusion and concentration of moisture. For all conditions of the experiment after environmental preconditioning, the specimen fracture surfaces occur between solder mask and FR4 substrates, which means the measured strength is the adhesion strength between solder mask and FR4. Comparing different adhesion surface, the adhesion strength of underfill/FR4 is higher than solder mask/FR4. The interface of solder mask/FR4 is more sensitive to the temperature and moisture. In all of the cases, increasing the moisture level has a varying but significant effect on both fracture strength and absorption energy Ψ. The failure mode transfer and the strength degradation are attributed to the moisture uptake between the FR4/solder mask and solder mask/underfill interface. 相似文献
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128.
Fanyuan Meng Xinyan Liu Yuxuan Chen Xinyi Cai Mengke Li Tingting Shi Ziming Chen Dongcheng Chen Hin‐Lap Yip Charusheela Ramanan Paul W. M. Blom Shi‐Jian Su 《Advanced functional materials》2020,30(19)
With respect to three‐dimensional (3D) perovskites, quasi‐two‐dimensional (quasi‐2D) perovskites have unique advantages in light‐emitting devices (LEDs), such as strong exciton binding energy and good phase stability. Interlayer ligand engineering is a key issue to endow them with these properties. Rational design principles for interlayer materials and their processing techniques remain open to investigation. A co‐interlayer engineering strategy is developed to give efficient quasi‐2D perovskites by employing phenylbutylammonium bromide (PBABr) and propylammonium bromide (PABr) as the ligand materials. Preparation of these co‐interlayer quasi‐2D perovskite films is simple and highly controllable without using antisolvent treatment. Crystallization and morphology are readily manipulated by tuning the ratio of co‐interlayer components. Various optical techniques, including steady and ultrafast transient absorption and photoluminescence spectroscopies, are used to investigate their excitonic properties. Photoluminescence quantum yield (PLQY) of the perovskite film is dramatically improved to 89% due to the combined optimization of exciton binding energy and suppression of trap state formation. Accordingly, a high current efficiency of 66.1 cd A?1 and an external quantum efficiency of 15.1% are achieved for green co‐interlayer quasi‐2D perovskite LEDs without using any light out‐coupling techniques, indicating that co‐interlayer engineering is a simple and effective approach to develop high‐performance perovskite electroluminescence devices. 相似文献
129.
Juseop Lee Man Seok Uhm Jong Heung Park 《Microwave and Wireless Components Letters, IEEE》2005,15(4):256-258
This letter describes synthesis method for a self-equalized dual-passband filter. Compared to a conventional dual-passband filter, the self-equalized dual-passband filter can reduce bit-error rate (BER) in digital data communications and does not need an external equalizer for group delay equalization. To validate the synthesis method described in this letter, a 10-pole dual-passband filter which has two self-equalized five-pole elliptic-response passbands is synthesized. 相似文献
130.
谈我校的电工电子实习 总被引:4,自引:0,他引:4
谷曼 《电气电子教学学报》2006,28(1):78-80
为了提高学生对实验课程的认识,结合教学实践和当前电子技术发展的薪形势,井针对学生实践能力和创新能力的培养,我校电工电子实验中心针对“电气技术与自动控制”各专业统一开设了“电工电子实习”这门课程。本文主要介绍了“电工电子实习”课程开设的目的、内容和作用等,几年的实践所获成效表明,“电工电子实习”课程的开设有利于培养学生的动手能力以及提高学生的学习兴趣。 相似文献