Adsorption of bisphenol A from aqueous solution onto activated carbons with different modification treatments

Two commercial carbons (W20 and F20) had been selectively modified with nitric acid and thermal treatment under a flow of N(2) in present study to adsorb bisphenol A from aqueous solution. The results indicated that the experimental data were well described with pseudo-second-order kinetic model. W20 and its thermal modified sample (W20N) represented a better adsorption capacity, and the equilibrium adsorption amounts reached 382.12 and 432.34 mg/g, respectively. Further, effects of temperature, pH and ionic strength on bisphenol A adsorption onto W20 and W20N had been examined. It was found that the adsorbed amount of bisphenol A decreased with the increase of temperature from 288 to 318 K and changed little with the increase of pH from 5.0 to 9.0. At pH 11.0, the two activated carbons represented the weakest adsorption capacity. The adsorption capacities of bisphenol A onto W20 and W20N first decreased and then increased with the increasing of ionic strength.     

Chemically doped macroscopic graphene fibers with significantly enhanced thermoelectric properties

Flexible wearable electronics, when combined with outstanding thermoelectric properties, are promising candidates for future energy harvesting systems. Graphene and its macroscopic assemblies (e.g., graphene-based fibers and films) have thus been the subject of numerous studies because of their extraordinary electrical and mechanical properties. However, these assemblies have not been considered suitable for thermoelectric applications owing to their high intrinsic thermal conductivity. In this study, bromine doping is demonstrated to be an effective method for significantly enhancing the thermoelectric properties of graphene fibers. Doping enhances phonon scattering due to the increased defects and thus decreases the thermal conductivity, while the electrical conductivity and Seebeck coefficient are increased by the Fermi level downshift. As a result, the maximum figure of merit is 2.76 × 10^–3, which is approximately four orders of magnitude larger than that of the undoped fibers throughout the temperature range. Moreover, the room temperature power factor is shown to increase up to 624 μW·m^–1·K^–2, which is higher than that of any other material solely composed of carbon nanotubes and graphene. The enhanced thermoelectric properties indicate the promising potential for graphene fibers in wearable energy harvesting systems.

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苯乙烯-丁二烯嵌段共聚物与废橡胶粉复合改性高黏沥青及混合料性能研究

为了评价高黏改性剂对沥青性能的影响,采用高速剪切法制备了苯乙烯-丁二烯嵌段共聚物(SBS)改性沥青、废橡胶粉改性沥青和两种SBS/橡胶粉复合改性高黏沥青。通过三大指标试验、黏度试验、高温车辙试验和低温小梁弯曲试验,研究了高黏沥青的高低温性能、感温性能及沥青混合料路用性能。结果表明:4种改性沥青的高低温性能随各自改性剂掺量的增加逐渐提高,掺加10%北美岩沥青或2.5%多聚磷酸(PPA)的高黏沥青感温性能更稳定,较大幅度提升了黏度值,高温性能改善明显;掺加2.5%PPA的高黏沥青及其混合料能够更好地抵抗高温条件下的性能衰减,保证了使用效果,更适用于温度较高地区;掺加10%北美岩沥青的高黏沥青及其混合料在低温条件下性能良好,推荐在低温地区使用。     

一种基于点集自适应分组构建Voronoi图的并行算法

论文提出一种基于点集自适应分组构建Voronoi图的并行算法,其基本思路是采用二叉树分裂的方法将平面点集进行自适应分组,将各分组内的点集独立生成Voronoi图,称为Voronoi子图;提取所有分组内位于四边的边界点,对边界点集构建Voronoi 图,称为边界点Voronoi图;最后,针对每个边界点,提取其位于Voronoi子图和边界点Voronoi 图内所对应的两个多边形,进行Voronoi多边形的合并,最终实现子网的合并.考虑到算法耗时主要在分组点集的Voronoi图生成,而各分组的算法实现不受其他分组影响,采用并行计算技术加速分组点集的Voronoi图生成.理论分析和测试表明,该算法是一个效率较高的Voronoi图生成并行算法.     

电力系统中基于自适应衰落卡尔曼滤波器的动态负载变化攻击检测

本文提出了一种有效可行的电力系统动态负荷变化攻击检测方法。首先,建立了基于D-LAAs的智能电网离散系统模型。其次,设计了一种自适应衰落卡尔曼滤波器（AFKF）来估计智能电网的状态,AFKF能完全滤除电力系统的高斯噪声,得到更准确的状态变化曲线（包括攻击）,又提出了一种基于AFKF的欧氏距离比检测算法。通过新的欧氏距离...     

Compact reflection-grating-based phase conjugator in KNbO(3):Fe crystals

We present the design and the results of experimental investigations of a self-pumped phase conjugator through a reflection grating in a special-cut photorefractive KNbO(3):Fe crystal. High reflectivity, good phase-conjugate fidelity, and fast response time are obtained.     

Characters of multicomponent lead-free solders

In the process of electronic packaging, such as flip chip technology, under bump metallization (UBM) can be consumed gradually by solder during soldering. Then dissolution of Ni, Au and Cu from UBM into the solder may change the original solder to a multicomponent one especially under the trend of miniaturization. It is quite necessary to evaluate the properties of the multicomponent solders that have new composition after soldering. In this study, the microstructure, thermal and mechanical properties of five types of multicomponent lead-free solders, i.e. Sn–2Cu–0.5Ni, Sn–2Cu–0.5Ni–0.5Au, Sn–3.5Ag–0.5Ni, Sn–3.5Ag–1Cu–0.5Ni and Sn–3.5Ag–2Cu–0.5Ni (all in wt% unless specified otherwise) were investigated. Comparison with eutectic Sn–0.7Cu, Sn–3.5Ag and Sn–3.5Ag–0.7Cu solders was made. There was no obvious difference of the melting point between the multicomponent lead-free solders and the eutectic ones. For Sn–2Cu–0.5Ni solder, Cu₆Sn₅ and (Cu,Ni)₆Sn₅ intermetallic compounds (IMCs) formed. In the case of Sn–2Cu–0.5Ni–0.5Au, besides (Cu,Ni)₆Sn₅, (Cu,Au)₆Sn₅ and (Cu,Ni,Au)₆Sn₅ were also observed. The IMCs formed in Sn–3.5Ag–0.5Ni solder were Ag₃Sn and Ni₃Sn₄. In both Sn–3.5Ag–1Cu–0.5Ni and Sn–3.5Ag–2Cu–0.5Ni solders, Ag₃Sn and (Cu,Ni)₆Sn₅ were detected. The mechanism for the formation of the IMCs was discussed. Tensile test was also conducted. The fractography indicated that all of the multicomponent lead-free solders exhibited a ductile rupture.