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31.
Youngmo Han 《IEEE transactions on systems, man, and cybernetics. Part A, Systems and humans : a publication of the IEEE Systems, Man, and Cybernetics Society》2007,37(6):854-863
This paper is about gaze control in active vision. The problem to tackle is, given a camera imaging a particular 3-D point, to place the 3-D point at the center of the image by rotating the camera about its own optical center. For separating this procedure from structure estimation, we use a normalized camera coordinate system, which leads to formulation defined on the unit sphere. In designing the algorithm, we try to avoid the disadvantages of local coordinates or approximation. For this purpose, we design the algorithm by considering the intrinsic geometric properties of the underlying space, not using any kinds of parameterization or approximation. The proposed algorithm is simple and of a closed form, and that makes it suitable for real-time application. 相似文献
32.
33.
全球粮食危机中化肥产业面临的问题与对策 总被引:3,自引:1,他引:2
从国内外整体形势来看,通货膨胀带来的粮食危机正在全球蔓延,化肥供应不稳、价格不断增长已经对粮食生产以及农业甚至国家经济平稳发展形成了严重影响.能源和粮食紧张将是我国长期面临的问题,这就决定了化肥产业的发展方向.在产业内部,必须走向大型化基础产业与小型服务型产业结合的道路,各种产品应该根据商品特性和农业需求进行市场细分.建议国家加强对化肥产业的宏观调控、转变调控方式,加强市场需求的预警预测和实时调节,提高国家对肥料施用技术的支持力度.同时建议企业做好信息分析工作,及时做出有利于国家和企业长远发展的决策,不应盲目跟随涨价而丧失市场,当前应利用化肥涨价的时机开展技术服务工作,抢占化肥市场制高点. 相似文献
35.
36.
基于FPGA乘法器架构的RNS与有符号二进制量转换 总被引:1,自引:1,他引:0
RNS(余数数制系统)是一种整数运算系统,在粒度精确性,能源损耗和响应速度上有很大的优势.从RNS到二进制数的输入输出转换是基于余数算法的专用架构实现的关键.本文提出了一个基于N类模的RNS与有符号二进制量的通用转换算法在FPGAs的乘法器上的实现过程.该算法能更有效地进行有符号数与RNS的转换.基于该算法类型乘法器在同类型乘法器中显示出了速度优势.文章中该架构被映射到Altera的10K系列的FPGA上. 相似文献
37.
文章介绍了有机热载体炉配套用的膨胀槽出现超温现象的常见原因,并结合实例着重分析了两炉或多炉并用循环管路时膨胀槽超温的原因和处理措施。 相似文献
38.
On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages 总被引:1,自引:0,他引:1
Theoretical and practical ranges of leak rates measurable by the helium mass spectrometer are characterized. The effect of noise due to: 1) background helium present in the spectrometer and 2) desorption of helium that attaches itself to the specimen surface during bombing is quantified experimentally. The results guide a framework to extract the true leak rate from the measured leak rate profile. An optical interferometry based hermeticity measurement technique for ultra-fine leaks is proposed. The setup to implement the technique is described and a preliminary experimental result is reported. 相似文献
39.
40.
Bin Xie Shi X.Q. Han Ding 《Components and Packaging Technologies, IEEE Transactions on》2008,31(2):361-369
In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues. 相似文献