Understanding the Influence of Copper Nanoparticles on Thermal Characteristics and Microstructural Development of a Tin-Silver Solder

This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper nanoparticles was observed to have no appreciable influence on melting temperature of the composite solder. However, it does influence solidification of the composite solder. The addition of 0.5 wt.% copper nanoparticles lowered the solidification temperature to 219.5 °C, while addition of 1.0 wt.% copper nanoparticles lowered the solidification temperature to 217.5 °C, which is close to the melting point of the ternary eutectic Sn-Ag-Cu solder alloy, Sn-3.7Ag-0.9Cu. This indicates the copper nanoparticles are completely dissolved in the eutectic Sn-3.5%Ag solder and precipitate as the Cu₆Sn₅, which reinforces the eutectic solder. Optical microscopy observations revealed the addition of 1.0 wt.% of copper nanoparticles to the Sn-3.5%Ag solder results in the formation and presence of the intermetallic compound Cu₆Sn_5. These particles are polygonal in morphology and dispersed randomly through the solder matrix. Addition of microsized copper particles cannot completely dissolve in the eutectic solder and projects a sunflower morphology with the solid copper particle surrounded by the Cu₆Sn₅ intermetallic compound coupled with residual porosity present in the solder sample. Microhardness measurements revealed the addition of copper nanopowder to the eutectic Sn-3.5%Ag solder resulted in higher hardness.     

二辊轧机轧辊堆焊新技术应用

介绍了二辊粗轧机轧辊利用堆焊新技术开展堆焊修复试验与应用，并介绍了堆焊材料的选择、堆焊工艺以及取得的良好效果。     

钼塑性变形抗力数学模型的研究

在Gleeble-1500热模拟试验机上,对钼板进行塑性变形抗力的研究。通过不同的变形温度、应变速率和应变对变形抗力的影响,分析了钼的高温变形特征,并对钼板进行塑性变形抗力的研究,进而采用非线性回归方法建立了钼板的变形抗力模型。通过理论计算与实测值进行对比,证明此模型有较好的线性拟合性。     

A study of the corrosion properties of plasma nitrocarburized and oxidized AISI 1020 steels

Plasma nitrocarburized AISI 1020 steels were oxidized for 15, 30 and 60 min to evaluate their corrosion and microstructural properties. After plasma nitrocarburizing for 3 h at 570°C in a gas mixture comprising 85 vol.% N₂, 12vol.% H₂ and 3 vol.% CH₄, the compound layer composed of ɛ-Fe_2–3(N,C) and γ’-Fe₄(N,C) phases and the diffusion layer above the matrix were observed. The top oxide layer, consisting mainly of magnetite (Fe₂O₄) and hematite (Fe₂O₃) phases, forms after post-oxidation treatment at 500°C. However, the oxide layer was severely degraded by spallation as a result of increases in post-oxidizing time. The difference in corrosion resistance should be attributed to the thickness of the top oxide layer, which was governed by post-oxidizing time.     

离心铸造梯度功能材料凝固过程中第二相的迁移行为

金属液在离心铸造下将发生第二相质点的径向移动。本文分析了第二相质点的移动规律。     

盐浴硫氮碳共渗45钢的接触疲劳性能

对４５钢经盐浴硫氮碳共渗处理的大批试样，进行了滚子接触疲劳性能试验，绘出了Ｐ－Ｓ－Ｎ曲线，分析了接触疲劳断口形貌及破坏机理。     

钛合金中亚晶的电子显微镜观察

用透射电子显微镜观察了TC6钛合金在高温退火过程中形成的亚晶(Subgrain)。合金经850℃,920℃退火后炉冷和空冷,在初生α相晶粒内形成亚晶,多为成簇分布的狭长形状,亚晶的数量随退火后冷却速度的增加而减少。亚晶界(Subgrain boundary)是由位错构成的,亚晶的形成是多边化(polygonization)的结果。     

PZT／Terfenol-D／PVDF层状复合磁电材料谐振特性

采用热压法制备出二层锆钛酸铅(PZT)／聚偏氟乙烯(PVDF)与1层Tb0.28Dy0.72Fe2(Terfenol-D)／PVDF叠层结构的三元复合磁电材料，研究了不同PVDF含量，以及不同层厚比tp／L对样品的介电常数、介电损耗、电阻率、谐振频率以及磁电转换系数αE33，αE31的影响规律，结果显示PVDF的含量和层厚比都存在最佳值(最佳值出现在产0．5，tp／L=2／7)，并且在这个最佳值处，磁电转换系数达到最大。     

C2H2/N2流量对反应等离子喷涂TiCN涂层影响的研究

以不同流量的C2H2与N2作为反应气体，通过反应等离子喷涂的方法制备TiCN涂层。并对涂层中物相、组织形貌和显微硬度进行比较与分析。实验结果表明，以C2H2气体流量为0．25m3／h喷涂时。所得涂层的组织致密，硬度较高；以C2H2N2流量比为1：1进行喷涂时，涂层中的氧化物含量较少，但组织致密性较差，硬度降低。     

Nanostructured component fabrication by electron beam-physical vapor deposition

Fabrication of cost-effective, nano-grained net-shaped components has brought considerable interest to Department of Defense, National Aeronautics and Space Administration, and Department of Energy. The objective of this paper is to demonstrate the versatility of electron beam-physical vapor deposition (EB-PVD) technology in engineering new nanostructured materials with controlled microstructure and microchemistry in the form of coatings and net-shaped components for many applications including the space, turbine, optical, biomedical, and auto industries. Coatings are often applied on components to extent their performance and life under severe environmental conditions including thermal, corrosion, wear, and oxidation. Performance and properties of the coatings depend upon their composition, microstructure, and deposition condition. Simultaneous co-evaporation of multiple ingots of different compositions in the high energy EB-PVD chamber has brought considerable interest in the architecture of functional graded coatings, nano-laminated coatings, and design of new structural materials that could not be produced economically by conventional methods. In addition, high evaporation and condensate rates allowed fabricating precision net-shaped components with nanograined microstructure for various applications. Using EB-PVD, nano-grained rhenium (Re) coatings and net-shaped components with tailored microstructure and properties were fabricated in the form of tubes, plates, and Re-coated spherical graphite cores. This paper will also present the results of various metallic and ceramic coatings including chromium, titanium carbide (TiC), titanium diboride (TiB₂), hafnium nitride (HfN), titanium-boron-carbonitride (TiBCN), and partially yttria stabilized zirconia (YSZ) TBC coatings deposited by EB-PVD for various applications. This paper was presented at the International Symposium on Manufacturing, Properties, and Applications of Nanocrystalline Materials sponsored by the ASM International Nanotechnology Task Force and TMS Powder Materials Committee, October 18–20, 2004, Columbus, OH.