Preparation, sintering, and microstructures of strontium barium bismuth tantalate layered perovskite ceramics

The solid solutions of Ba-doped SrBi₂Ta₂O₉ layered perovskite ceramic powders have been successfully prepared via a two-step process using BiTaO₄ as a precursor. The lattice constants of the solid solutions monotonically increase with increasing barium-ion content. The sinterability of (Sr_1–xBa_x)Bi₂Ta₂O₉ powders is significantly improved by increasing the barium-ion content. When the specimens with high barium-ion contents are sintered at 1100°C, they thermally decompose to form rod-like grains and the matrix expands, leading to a lower density. The addition of barium ions to SrBi₂Ta₂O₉ also results in significant variation in the morphology of the sintered specimens and the occurrence of c-axis preferred orientation which is ascribed to the anisotropic growth of plate-like grains. The precise control of the barium-ion content as well as the sintering conditions is critical for obtaining densified barium-ion doped SrBi₂Ta₂O₉ ceramics with a pure, layered perovskite structure.     

Piezoresistive Behavior Study on Finger‐Sensing Silicone Rubber/Graphite Nanosheet Nanocomposites

A novel finger‐sensing nanocomposite with remarkable and reversible piezoresistivity is successfully fabricated by dispersing homogeneously conductive graphite nanosheets (GNs) in a silicone rubber (SR) matrix. Because of the high aspect ratio of the graphite nanosheets, the nanocomposite displays a very low percolation threshold. The SR/GN nanocomposite with a volume fraction of conductive nanosheets closest to that for the percolation threshold presents a sharp positive‐pressure coefficient effect of the resistivity under very low pressure, namely, in the finger‐pressure range (0.3–0.7 MPa), whereby the abrupt transition could be attributed to compressive‐stress‐induced deformation of the conducting network. The super‐sensitive piezoresistive behavior of the nanocomposite is accounted for by an extension of the tunneling conduction theory which provides a good approximation to the piezoresistive effect.     

Silicon-to-steel bonding using rapid thermal annealing

This paper presents the rapid, low-temperature bonding between silicon and steel using the rapid thermal annealing process. Three different thin-film adhesion layer systems including silver, gold, and nickel were utilized as the intermediate bonding material to assist the eutectic Pb/Sn bonding between silicon and steel. The bonding temperature was set at 220/spl deg/C for 20 s, with a 20-s ramp-up time. Five experiments were conducted to determine the strength of the bond, including static tensile and compressive four-point bend tests, axial extension tests, tensile bending fatigue tests, and corrosion resistance tests. The test results have shown that the gold adhesion layer is the most robust, demonstrating minimal creep during fatigue tests, no delamination during the tensile or compressive four-point bend tests, and acceptable strength during the axial extension tests. Additionally, all adhesion layers have withstood four months of submersion in various high-temperature solutions and lubricants without failure. Simulations of the axial stresses and strains that developed during the four-point bend and axial extension tests were performed and showed that the presence of the silicon die provides a local reinforcement of the bond as observed in the experimental tests.     

Enhancing echo cancellation via estimation of delay

The advent of packetized audio transmission, such as voice over IP (VoIP), has resulted in challenging requirements for echo cancellation technology. One key aspect of this technology is the need to characterize, quickly and accurately, the echo paths in the transmission media. Echo paths consist of a constant time delay with no echo signal and active regions in which the echo signal is present. When an adaptive filter echo cancellation algorithm is used, its performance can be greatly increased, and its complexity can be reduced if it is only applied to the active regions. This requires an algorithm to estimate the constant delay and locate the active regions. Traditionally, delay estimation has been based on direct application of cross-correlation. This method has poor performance because the input signals are highly correlated and has a high implementation cost because many cross-correlation lags have to be computed for longer time delays. The delay estimation addressed in this paper has two major advantages over the traditional methods. The first is that it has improved performance because the input signals are processed to have less correlation. The second is that the implementation cost is significantly reduced because fewer cross-correlation lags are computed, and an efficient method to estimate lags is created.     

改性生物质作为型煤黏结剂的研究

探讨了用NaOH改性生物质秸秆作为型煤黏结剂的可行性,考察了NaOH溶液浓度对生物质改性的影响以及生物质添加量、无机物(MgO和MgCl2)添加量对型煤机械强度、防水性能和着火温度的影响。研究结果表明,NaOH改性液的质量分数为1.0%~2.0%时,制得的生物质型煤有较高的机械强度;生物质添加量在2%~20%时,随生物质添加量的增加,机械强度增加,着火温度降低,但防水性较差;而在生物质型煤中加入适量无机黏结剂后,型煤有很高的浸水强度,表现出优越的防水性能。     

棉织物手感值的模糊综合评判研究

利用模糊综合评判数学模型对棉织物的手感值进行了计算与分析，这种方法简单、可靠，与主观评估结果有很好的一致性，为纺织生产的质量判断提供了便利。     

负载型固体催化剂在生物柴油制备中的研究现状及应用前景

对生物柴油及其制备方法进行简单介绍，重点综述了负载型固体酸、碱催化剂在生物柴油制备中的研究现状，并指出当前负载型固体催化剂研制中的研究热点，最后对其应用前景了进行展望。     

用VB解决CAI中的几个问题

本文利用Windows的API函数将VB窗体前置,避免教师在CAI过程中频繁切换活动窗口,并通过VB控件将各种不同的电子文档内容在窗体中显示出来。     

3-D MCM封装技术及其应用

介绍了超大规模集成电路（VLSI）用的3-D MCM封装技术的最新发展，重点介绍了3-D MCM封装垂直互连工艺，分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题，并对3-D MCM封装的应用作了简要说明。