聚氧化乙烯—聚磷酸钠共混物的钠离子导电性

研究了聚氧化乙烯-聚磷酸钠共混物的钠离子导电性和低分子量多缩乙二醇对共混物导电性的改进作用。结果表明,降低多缩乙二醇的分子量以及增加其含量都有利于提高共混物的离子导电率。增塑剂改进共混物导电性的实质是提高共混物的非晶相含量,共混物内钠离子传导发生在非晶区,聚合物链段运动是离子传导的主要推动力。     

Self-consistent calculation of the lasing eigenmode of thedielectrically apertured Fabry-Perot microcavity with idealized ordistributed Bragg reflectors

Optical confinement in the dielectrically apertured Fabry-Perot microcavity is investigated theoretically. The apertured region is first treated as embedded in an idealized planar waveguide to show that the confined eigenmode's resonant frequency can cut off parasitic waveguide modes existing outside the aperture, and lead to three-dimensional optical confinement. For more realistic cavities with nonunity mirror reflectivities, self-consistent calculations of the eigenmode characteristics are performed for the limit of an optically thin aperture to derive the lowest order confined eigenmode frequency, threshold susceptibility, and mode profile. The analysis is then extended to treat dielectric cavities based on Bragg reflectors     

无染色牛肝过氧化氢酶薄晶的图象处理

本文根据Ｐ．Ｎ．Ｔ．Ｕｎｗｉｎ和Ｒ．Ｈｅｎｄｅｒｓｏｎ等人提出的对生物大分子晶体的囹象处理方法，对无染色的牛肝过氧化氢酶薄晶的显微象和衍射图进行了图象处理，最后得到了牛肝过氧化氢酶薄晶的二维结构。从中可以看出，牛肝过氧化氢酶薄晶的一个单胞由４个子胞组成，４个子胞排列方向各异。     

平面扇形可倾瓦气体推力轴承的优化设计

气体动压轴承在小型透平机械中有着诱人的应用前景．本文介绍了平面扇形可倾瓦气体推力轴承的工作特性计算及其参数优化的方法．利用自编的软件取得了瓦块最佳直径比和支承位置等参数的优化结果，并且在微机上实现了该种轴承的优化设计．     

SAW滤波器简化衍射频响的计算方法

提出了由一个变迹ＩＤＴ叉指换能器和一个均匀ＩＤＴ组成的ＳＡＷ滤波器简化衍射频响的计算方法，即将均匀ＩＤＴ简化成单根指计算其衍射频响。该方法与未简化衍射频响的计算方法相比，计算量大为减小，前者约为后者的（Ｎ为均匀ＩＤＴ的指对数）。并给出了一个实例，用未简化与简化方法分别计算了其衍射频响，结果表明，两者符合得较好。     

压力对Fe－29wt％Ni合金超细微粒特性的影响

利用蒸发冷凝法，制备了不同平均粒径的Ｆｅ－２９ｗｔ％Ｎｉ合金超细微粒。在不同压强下，将超细微粒压制成片。随压强增大，马氏体体积分数和比饱和磁化强度σｓ明显增大，而矫顽力Ｈｃ呈线性下降。压力效应与平均粒径ｄ大小密切相关     

Water‐soluble/dispersible cationic pressure‐sensitive adhesives. I. Adhesives from solution polymerization

Pressure‐sensitive adhesives (PSAs) have long been a problem as sticky contaminants for paper recycling mills. The main problem associated with such stickies is that the PSAs in the waste papers deposit on the felts, press rolls, and drying cylinders of paper machines, and this creates problems with paper formation, reducing the paper quality and paper machine runnability. The annual cost of stickies to the U.S. paper industry is estimated to be about $600,000,000–650,000,000. To solve this problem, a series of cationic water‐soluble/dispersible PSAs have been synthesized by the free‐radical solution polymerization of butyl acrylate and [3‐(methacryloylamino)propyl]trimethylammonium chloride in ethanol. The PSA end‐use properties, repulpability in paper recycling, and the effects on the properties of recycled paper products have been studied. The cationic PSAs can be dissolved or dispersed in water if the cationic charge density in the PSA backbone is controlled, and so they do not deposit as stickies during recycling and papermaking processes. Because the PSAs are cationically charged, they can easily be removed from the papermaking system by adsorption onto the negatively charged fibers and fine surfaces. Furthermore, the adsorbed colloidal or dissolved PSAs have little effect on the final paper properties. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1624–1630, 2003     

横波速度各向异性初步探讨：—多波勘探资料的应用

在纵波、SH 型横波资料处理和解释过程中,我们发现四川 HBC 地区地下介质普遍存在方向各向异性。当横波通过方向各向异性介质时,分裂成两个波:一个波的偏振方向与裂缝平行,叫快横波;另一个波的偏振方向与裂缝走向垂直,叫慢横波。采用相应的观测和处理方法,便可获得快横波和慢横波剖面。根据同一界面的快、慢横波的旅行时可以求得各向异性系数。同样,还可以利用 SH 波与转换波的速度比求取各向异性系数。各向异性系数的大小,反映了裂缝的发育程度。如果野外作了 X、Y 分量观测,室内又作了坐标旋转处理,那么,就可以进一步确定裂缝带的方向。如果未作上述工作,也可以根据构造线走向,大致确定裂缝带的发育方向。     

Thermal Shock Behavior of Porous Silicon Carbide Ceramics

Using the water-quenching technique, the thermal shock behavior of porous silicon carbide (SiC) ceramics was evaluated as a function of quenching temperature, quenching cycles, and specimen thickness. It is shown that the residual strength of the quenched specimens decreases gradually with increases in the quenching temperature and specimen thickness. Moreover, it was found that the fracture strength of the quenched specimens was not affected by the increase of quenching cycles. This suggests a potential advantage of porous SiC ceramics for cyclic thermal-shock applications.     

2.5-dimensional VLSI system integration

The excessive interconnection delay and fast increasing development cost, as well as complexity of the single-chip integration of different technologies, are likely to become the major stumbling blocks for the success of monolithic system-on-chips. To address the above problems, this paper investigates a new VLSI integration paradigm, the so-called 2.5-dimensional (2.5-D) integration scheme. Using this scheme, a VLSI system is implemented as a three-dimensional stacking of monolithic chips. A cost analysis framework was developed to justify the 2.5-D integration scheme from an economic point of view. Enabling technologies for the new integration scheme are also reviewed.