20GHz镜频抑制谐波混频器

镜频抑制混频器能有效地抑制镜像频率,提高雷达和通信系统的抗干扰能力。介绍了一个20 GHz二次谐波镜频抑制混频器的设计与制作,该镜频抑制混频器采用两个相同的二次谐波混频器做为两路混频单元,两路射频输入和中频输出分别用90°的功分器/合路器与两路混频器相连,本征用威尔金森功分器等幅同相输入两路混频。借助于90°的功分器,两路混频器的镜频产物在中频90°合路器的输出端口反相抵消,有用中频在90°合路器的输出端口同相叠加。利用ADS和HFSS对该混频器进行了仿真设计,并对实际电路进行了加工测试。经测试,当中频固定在400 MHz时,射频在20～21 GHz内变频损耗小于10 dB,镜频抑制大于20 dB。     

对IDC测评体系的探讨

随着互联网技术和服务的高速发展,对数据中心的各方面要求不断提高。国外已有多种成熟的评估体系来对数据中心进行评测与分级,但我国尚无这方面的体系。建立完整的标准体系,研究完备的评测方法,形成完善的评估体系,对我国IDC行业的良性发展将会起到至关重要的作用。     

On the Computation of Correlation Sequences in 3-D Recursive Digital Filters

In this paper we are concerned with the computation of correlation sequences and complex integrals arising in Three-dimensional (3-D) recursive digital filtering applications. In particular, we focus on presenting a reliable and accurate method for evaluating triple complex integrals having a rational-form integrand. The basic idea is to reduce the triple complex integral into a double complex integral. The main computational tasks involved in the method includes the product-to-sum decomposition of the rational-form integrand, the integration of a definite integral, and the finding of inside-unit-circle (IUC) roots of 1-D polynomials. The proposed method of evaluating multiple complex integrals has its great applications in the design of optimal 3-D nonseparable-denominator recursive digital filters with minimum sensitivity and/or roundoff error. To demonstrate the effectiveness of the presented method, two numerical examples are given.     

New voice over Internet protocol technique with hierarchical datasecurity protection

The authors propose a voice over Internet protocol (VoIP) technique with a new hierarchical data security protection (HDSP) scheme. The proposed HDSP scheme can maintain the voice quality degraded from packet loss and preserve high data security. It performs both the data inter-leaving on the inter-frame of voice for achieving better error recovery of voices suffering from continuous packet loss, and the data encryption on the intra-frame of voice for achieving high data security, which are controlled by a random bit-string sequence generated from a chaotic system. To demonstrate the performance of the proposed HDSP scheme, we have successfully verified and analysed the proposed approach through software simulation and statistical measures on several test voices     

Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles

In the present work the creep properties of Sn37Pb- and Sn0.7Cu-based composite solders reinforced with metallic nano- and microsized Cu and Ag particles have been studied. First, a series of volume percentages of reinforcements were selected to optimize the content of reinforcing particles. Then, the composite solder with optimum volume fraction of reinforcement particles, corresponding to the maximum creep rupture lifetime, was selected to investigate the effect of applied stress and temperature on the creep rupture lifetime of the composite solder joints. In the creep rupture lifetime test, small single-lap tensile-shear joints were adopted. The results indicate that composite solders reinforced with microsized particles exhibit better creep strengthening than composite solders reinforced with nanosized particles, although the mechanical tensile shear strength of composite solder joints reinforced with nanosized particles may be higher than those reinforced with microsized particles. Moreover, the creep strengthening action of the reinforcement particles is more obvious under conditions of lower applied stress or lower test temperature. Strengthening by metallic Cu or Ag reinforcement particles decreases with increasing temperature or applied stress. The Sn0.7Cu-based composite solder reinforced with microsized Ag particles is a low-cost lead-free solder that is easy to process and may have good market potential.     

A novel on-chip high to low voltage power conversion circuit

A novel power supply transform technique for high voltage IC based on the TSMC 0.6μm BCD process is achieved. An adjustable bandgap voltage reference is presented which is different from the traditional power supply transform technique. It can be used as an internal power supply for high voltage IC by using the push-pull output stage to enhance its load capability. High-order temperature compensated circuit is designed to ensure the precision of the reference. Only 0.01 mm2 area is occupied using this novel power supply technique. Compared with traditional technique, 50% of the area is saved, 40% quiescent power loss is decreased, and the temperature coefficient of the reference is only 4.48 ppm/℃. Compared with the traditional LDO (low dropout) regulator, this power conversion architecture does not need external output capacitance and decreases the chip-pin and external components, so the PCB area and design cost are also decreased. The testing results show that this circuit works well.     

Hierarchically Structured Self‐Healing Sensors with Tunable Positive/Negative Piezoresistivity

It is a challenge to manufacture flexible sensors that possess easily distinguishable biomotion signals, strong response reliability, and excellent self‐healing capability. Herein, a self‐healing sensor with tunable positive/negative piezoresistivity is designed by the construction of hierarchical structure connected through supramolecular metal–ligand coordination bonds. The developed sensors can be integrated with the human body to detect multiple tiny signals, such as pronunciation, coughing, and deep breathing. Interestingly, the nanostructured elastomer sensor with and without a flexible yarn electrode shows negative and positive current signals, respectively, making it easy to be identify. Furthermore, it exhibits very fast (2 min), autonomous, and repeatable self‐healing ability with high‐healing efficiency (88.6% after the third healing process). The healed samples still possess flexibility, high sensitivity, and accurate detection capability, even after bending over 10 000 cycles. The excellent biomimetic self‐healing performance combined with the tunable piezoresistivity make it promising for next‐generation wearable electronics.     

Direct 3D Printing of Ultralight Graphene Oxide Aerogel Microlattices

Graphene aerogel microlattices (GAMs) hold great prospects for many multifunctional applications due to their low density, high porosity, designed lattice structures, good elasticity, and tunable electrical conductivity. Previous 3D printing approaches to fabricate GAMs require either high content of additives or complex processes, limiting their wide applications. Here, a facile ion‐induced gelation method is demonstrated to directly print GAMs from graphene oxide (GO) based ink. With trace addition of Ca²⁺ ions as gelators, aqueous GO sol converts to printable gel ink. Self‐standing 3D structures with programmable microlattices are directly printed just in air at room temperature. The rich hierarchical pores and high electrical conductivity of GAMs bring admirable capacitive performance for supercapacitors. The gravimetric capacitance (C_s) of GAMs is 213 F g^?1 at 0.5 A g^?1 and 183 F g^?1 at 100 A g^?1, and retains over 90% after 50 000 cycles. The facile, direct 3D printing of neat graphene oxide can promote wide applications of GAMs from energy storage to tissue engineering scaffolds.     

视音频延时器用大容量FIFO的设计

介绍视音频延时器用大容量FIFO的设计,大容量FIFO的设计采用了SDRAM代替双口RAM,并采用FPGA设计双口SDRAM控制器.该FIFO也可用作高速数据采集系统的数据缓冲.