A wafer-level 3D packaging structure with Benzocyclobutene as a dielectric for multichip module fabrication

A new wafer-level 3D packaging structure with Benzocyclobutene (BCB) as interlayer dielectrics (ELDs) for multichip module fabrication is proposed for application in the Ku-band wave. The packaging structure consists of two layers of BCB films and three layers of metallized films, in which the monolithic microwave IC (MMIC), thin film resistors, striplines and microstrip lines are integrated. Wet etched cavities fabricated on the silicon substrate are used for mounting active and passive components. BCB layers cover the components and serve as ILDs for interconnections. Gold bumps are used as electric interconnections between different layers, which eliminates the need to prepare vias by costly dry etching and deposition processes. In order to get high-quality BCB films for the subsequent chemical mechanical planarization (CMP) and multilayer metallization processes, the BCB curing profile is optimized and the roughness of the BCB film after the CMP process is kept lower than 10 nm. The thermal, mechanical and electrical properties of the packaging structure are investigated. The thermal resistance can be controlled below 2 ℃/W. The average shear strength of the gold bumps on the BCB surface is around 70 N/mm~2. The performances of MMIC and interconnection structure at high frequencies are optimized and tested. The 5 -parameters curves of the packaged MMIC shift slightly showing perfect transmission character. The insertion loss change after the packaging process is less than 1 dB range at the operating frequency and the return loss is less than -8 dB from 10 to 15 GHz.     

高速运动目标宽带雷达回波频域模拟及分析

该文提出了一种高速运动目标宽带雷达回波频域模拟方法。根据雷达波与运动目标相互作用的物理过程建立了运动目标宽带雷达回波的频谱模型,提出了一种雷达回波的频域建模流程,分析了目标径向距离和径向速度对LFM 信号匹配滤波结果的影响,推导了高分辨率距离像(HRRP)平移和扩展的定量结论。仿真结果验证了该方法的正确性和有效性。      

现场总线互操作性的探讨

介绍了现场总线的概念和特点,着重对“互操作性”进行了分析,对互操作性的定义,分类和度量进行了阐述,分析了出现互操作性问题的原因,提出了提高互操作性置信度的方法,并在此基础上,研究了现场总线的互操作性及其采用的技术和面对的问题。     

无线局域网中基于RC4的加密算法的分析与改进

分析RC4加密算法自身的缺陷和无线局域网WEP协议对RC4的误用,介绍了TKIP协议在安全性方面的改进。     

基于三层C/S结构的OMC-R系统的研究与实现

基站维护对提高移动网络的运营质量具有重要意义。目前基于双层C／S（Client/Server）结构的OMC－R（Operations Maintenance Center for Radio，无线基站操作维护系统）存在着维护地点局限性大，输出结果信息量小等不足。针对这些不足，本文提出采用三层C／S体系结构改进OMC－R系统，介绍了一个已经实现的基于三层C／S体系结构的OMC－R系统，并据此对三层C／S体系结构实现OMC－R优势进行了全面分析。     

Half-time image reconstruction in thermoacoustic tomography

Thermoacoustic tomography (TAT) is an emerging imaging technique with great potential for a wide range of biomedical imaging applications. In this paper, we propose and investigate reconstruction approaches for TAT that are based on the half-time reflectivity tomography paradigm. We reveal that half-time reconstruction approaches permit for the explicit control of statistically complementary information that can result in the optimal reduction of image variances. We also show that half-time reconstruction approaches can mitigate image artifacts due to heterogeneous acoustic properties of an object. Reconstructed images and numerical results produced from simulated and experimental TAT measurement data are employed to demonstrate these effects.     

A Novel Approach for Redirecting Module in Honeypot Systems

1 Introduction Computer network security has been focus on passivedefense strategies usingtools and conceptslike Firewall ,Intrusion Detection System(IDS)[1 ~3]. This is an un-reasonable situation,because users have to protect com-puter systems perfectly, while hackers can use one ofvulnerabilities to attackthe systems . We are alwaysin apassive position.The bad guys have theinitiative .Theyhave unli mited resources and attack you whenever theywant , however they want . Moreover ,in a trad…     

基于结构化噪声矩阵补全的Web服务QoS预测

随着面向服务计算技术的快速发展,越来越多具有相同或相似功能的Web服务被部署在网络上。用户进行服务选择之前,通常需要根据历史调用信息对未使用过的服务QoS进行预测。由于历史调用信息收集过程缺乏有效的监督和约束机制,所采样的QoS信息往往容易受到结构化噪声污染,从而导致现有方法预测性能急剧下降。为了克服这个困难,通过将Web服务QoS预测问题建模为L2,1范数正则化矩阵补全问题,提出了一类基于结构化噪声矩阵补全的Web服务QoS预测方法。真实数据集上的实验结果表明,该方法不仅能精确地辨识出QoS采样矩阵中噪声行所在位置,而且能对缺失Web服务QoS进行有效预测。     

VHF-PECVD制备微晶硅材料及电池

采用VHF-PECVD技术制备了不同功率系列的微晶硅薄膜和电池,测试结果表明：制备的适用于微晶硅电池的有源层材料的暗电导和光敏性都在电池要求的参数范围内．低功率或高功率条件下,电池从n和p方向的喇曼测试结果是不同的,在晶化率方面材料和电池也有很大的差别,把相应的材料应用于电池上时,这一点很重要．采用VHFPECVD技术制备的微晶硅电池效率为5%,Voc=0.45V,Jsc=22mA/cm2,FF=50%,Area=0.253cm2．     

电极结构对硅薄膜生长过程及材料特性的影响

在制备硅薄膜材料的PECVD系统中,分别采用普通平行板电极和网状电极,在相同的工艺条件下研究了电极结构对硅薄膜材料均匀性、电学性能以及微结构的影响．发现采用网状电极使薄膜（400～500nm）均匀性得到明显改善,在20cm×20cm内不均匀性从±12.6%下降到±2.1％．等离子体发光光谱的测试表明,网状电极可大大提高硅烷的利用率,因而在相同工艺条件下,生长微晶硅材料需要更高的功率密度．文中对实验结果进行了详细的讨论．