Process development and adhesion behavior of electroless copper on liquid crystal polymer (LCP) for electronic packaging application

Liquid crystal polymer (LCP) has potentially a very wide application as substrate material in electronic packaging applications because of its unique advantages. The work in this paper was performed to realize the metallization of LCP for the purpose of board fabrication, and to study the adhesion between deposited copper and LCP. A homogenous electroless plated copper layer on LCP with 4 to 5 /spl mu/m thickness was achieved, while it increased up to 40 /spl mu/m with the subsequent electroplating. The timescale of etching, deposit ion rate, and pH value were gradually changing during the plating process and the influences on copper layer quality were investigated. The adhesion force of the copper-LCP layer system was measured by a shear-off-method. Scanning electron microscopy (SEM) was used to check the surface morphology after etching and the interface after shearing on both the backside of the copper layer and the LCP side. The relationship between the shear-off adhesion of copper and the time of chemical etching before plating was examined, and the optimal etching time is discussed. Heat treatment after plating was used, and it was shown that this significantly improved the adhesion strength.     

Improving MANET performance by a hop‐aware and energy‐based buffer management scheme

A hop‐aware and energy‐based buffer management scheme (HEB) is proposed in this paper. HEB can provide better quality of service to packets with real‐time requirements and improve MANET power efficiency. In our algorithm, the buffer is divided into real‐time and non‐real‐time partitions. We consider the number of hops passed, the power levels of the transmitting node, the predicted number of remaining hops, and waiting time in the buffer to determine packet transmission priority. In addition, specialized queue management and a probabilistic scheduling algorithm are proposed to decrease retransmissions caused by packet losses. Mathematical derivations of loss rates and end‐to‐end delays are also proposed. Coincidence between mathematical and simulation results is also shown. Finally, the HEB is compared with first in first out, random early detection, and hop‐aware buffering scheme. Simulation results show that the proposed algorithm reduces loss rates, power consumption, and end‐to‐end delays for real‐time traffic, considerably improving the efficiency of queue management in MANET. Copyright © 2012 John Wiley & Sons, Ltd.     

Ultrahigh‐Working‐Frequency Embedded Supercapacitors with 1T Phase MoSe2 Nanosheets for System‐in‐Package Application

Commercial aluminium electrolyte capacitors (AECs) are too large for integration in future highly integrated electronic systems. Supercapacitors, in comparison, possess a much higher capacitance per unit volume and can be embedded as passive capacitors to address such challenges in electronics scaling. However, the slow frequency response (<10¹ Hz) typical of supercapacitors is a major hurdle to their practical application. Here, it is demonstrated that 1T‐phase MoSe₂ nanosheets obtained by laser‐induced phase transformation can be used as an electrode material in embedded micro‐supercapacitors. The metallic nature of MoSe₂ nanosheet‐based electrodes provides excellent electron‐ and ion‐transport properties, which leads to an unprecedented high‐frequency response (up to 10⁴ Hz) and cycle stability (up to 10⁶ cycles) when integrated in supercapacitors, and their power density can be ten times higher than that of commercial AECs. Furthermore, fabrication processes of the present device are fully compatible with system‐in‐package device manufacturing to meet stringent specifications for the size of embedded components. The present research represents a critical step forward in in‐package and on‐chip applications of electrolytic capacitors.     

基于DPDK技术的互联网电视智能调度系统研究及实践

伴随着宽带业务大发展,互联网电视业务也成了众多家庭的必选业务.为了保障互联网电视业务感知,各运营商建立了自有业务平台及CDN网络,然而随着电视节目码率的提升和用户数量的日益增加,春节、体育赛事等高并发、大流量业务场景对分布式、多层级CDN平台的调度体系提出了更高的要求.本项课题基于DPDK及大数据技术,综合分析用户感知...     

Nitride-Based ultraviolet metal-semiconductor-metal photodetectors with a low-temperature GaN layer

The GaN metal-semiconductor-metal (MSM) ultraviolet (UV) photodetectors with a low-temperature (LT)-GaN layer have been demonstrated. It was found that we could achieve a two orders of magnitude smaller, photodetector-dark current by introducing a LT-GaN layer, which could be attributed to the larger Schottky-barrier height between the Ni/Au metal contact and the LT-GaN layer. It was also found that photodetectors with the LT-GaN layer could provide a larger photocurrent to dark-current contrast ratio and a larger UV-to-visible rejection ratio. The maximum responsivity was found to be 3.3 A/W and 0.13 A/W when the photodetector with a LT-GaN layer was biased at 5 V and 1 V, respectively.     

Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications

There has been a steadily increasing interest in using electrically conductive adhesives as interconnecting materials in electronics manufacturing. In this paper, several anisotropic conductive adhesive (ACA) pastes were formulated, which consist of diglycidyl ether of bisphenol F or diglycidyl ether of bisphenol A as polymer matrix, imidazoles as curing agents, and different sizes of silver (Ag) powders or gold (Au)-coated polymer spheres as conductive particles. The effects of ACA resin and different curing agents, as well as different conductive particles, on flexible substrate of the flip-chip joint were studied. The results show that the size and type of different conductive particles have very limited influence on an ACA flip-chip joint. The ACA resin as well as the curing agent can affect the reliability of the joint. The same results can be applied for the failure analysis of ACA flip-chip technology.     

Self‐Assembled In‐Plane Growth of Mg2SiO4 Nanowires on Si Substrates Catalyzed by Au Nanoparticles

In‐plane growth of Mg₂SiO₄ nanowires on Si substrates is achieved by using a vapor transport method with Au nanoparticles as catalyst. The self‐assembly of the as‐grown nanowires shows dependence on the substrate orientation, i.e., they are along one, two, and three particular directions on Si (110), (100), and (111) substrates, respectively. Detailed electron microscopy studies suggest that the Si substrates participate in the formation of Mg₂SiO₄, and the epitaxial growth of the nanowires is confined along the Si <110> directions. This synthesis route is quite reliable, and the dimensions of the Mg₂SiO₄ nanowires can be well controlled by the experiment parameters. Furthermore, using these nanowires, a lithography‐free method is demonstrated to fabricate nanowalls on Si substrates by controlled chemical etching. The Au nanoparticle catalyzed in‐plane epitaxial growth of the Mg₂SiO₄ nanowires hinges on the intimate interactions between substrates, nanoparticles, and nanowires, and our study may help to advance the developments of novel nanomaterials and functional nanodevices.     

The Interesting Influence of Nanosprings on the Viscoelasticity of Elastomeric Polymer Materials: Simulation and Experiment

Among all carbon nanostructured materials, helical nanosprings or nanocoils have attracted particular interest as a result of their special mechanical behavior. Here, carbon nanosprings are used to adjust the viscoelasticity and reduce the resulting hysteresis loss (HL) of elastomeric polymer materials. Two types of nanospring‐filled elastomer composites are constructed as follows: system I is obtained by directly blending polymer chains with nanosprings; system II is composed of the self‐assembly of a tri‐block structure such as chain‐nanospring‐chain. Coarse‐grained molecular dynamics simulations show that the incorporation of nanosprings can improve the mechanical strength of the elastomer matrix through nanoreinforcement and considerably decrease the hysteresis loss. This finding is significant for reducing fuel consumption and improving fuel efficiency in the automobile tire industry. Furthermore, it is revealed that the spring constant of nanosprings and the interfacial chemical coupling between chains and nanosprings both play crucial roles in adjusting the viscoelasticity of elastomers. It is inferred that elastomer/carbon nanostructured materials with good flexibility and reversible mechanical response (carbon nanosprings, nanocoils, nanorings, and thin graphene sheets) have both excellent mechanical and low HL properties; this may open a new avenue for fabrication of high performance automobile tires and facilitate the large‐scale industrial application of these materials.     

战场电磁环境构建中的抛物方程应用研究

在进行战场电磁环境的数字化构建过程中,需要结合各类环境要素对电波的传播过程进行建模和仿真。抛物方程(Parabolic Equation,PE)描述的模型适用于从视距到超视距区域计算电波的传播特性,并有分步傅里叶法(Split-Step Fourier Transform,SSFT)对模型进行计算,但该算法是基于步长迭代的方法,不易并行化实现,在计算大区域电磁传播时难以满足时间上的需求,给战场电磁环境的快速构建带来困难。该文提出一种基于矩阵转置的并行计算方法,构造2维矩阵并按行或列分发给不同的进程,实现了算法的并行计算。该方法能够充分利用计算集群的运算能力,降低了计算时间。计算机仿真结果表明并行算法相对于串行算法能达到4倍的加速比,验证了该方法的有效性。     

Electrophosphorescent Polyfluorenes Containing Osmium Complexes in the Conjugated Backbone

Electrophosphorescent copolymers have been synthesized by covalent bonding of a red‐emitting osmium complex Os(bpftz), which contains two 3‐trifluoromethyl‐5‐(4‐tert‐butyl‐2‐pyridyl)triazolate (bpftz) cyclometalated ligands, into the backbone of a bipolar polyfluorene (PF) copolymer. Employing these copolymers, a highly efficient red polymer light‐emitting diode has been realised that has an external quantum efficiency of 18.0%, a maximum brightness of 38 000 cd m^?2, and an emission centered at 618 nm. In addition, after incorporating appropriate amounts of green‐emitting benzothiadiazole (BT) and the aforementioned Os(bpftz) into the bipolar PF, an efficient white‐light electroluminescent polymer is obtained that displays simultaneous blue, green, and red emissions.