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11.
Yong Ma Yong‐zhen Peng Xiao‐lian Wang Shu‐ying Wang 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》2005,80(10):1118-1124
The laboratory scale anaerobic–anoxic–aerobic (A2O) process fed with synthetic brewage wastewater was designed to investigate the effects of changing feed C/P ratio on the performance of biological nutrient removal (BNR) processes. In the experiment, the influent chemical oxygen demand (COD) concentration was kept at approximately 300 mg L?1 while the total phosphorus concentration was varied to obtain the desired C/P ratio. Results showed that when the C/P ratio was lower than 32, phosphorus removal efficiency increased as C/P ratio increased linearly, while when the C/P ratio was higher than 32, the P removal efficiency was maintained at 90–98%, and effluent P concentration was lower than 0.5 mg L?1. However, regardless of the C/P ratio, excellent COD removal (90% or higher) and good total nitrogen removal (75–84%) were maintained throughout the experiments. It was also found that very good linear correlation was obtained between COD uptake per unit P released in the anaerobic zone and C/P ratio. In addition, the P content in the wasted activated sludge increased with the decrease in the C/P ratio. Based on the results, it was recommended that the wastewater C/P ratio and its effects be incorporated into BNR design and operational procedures, appropriate C/P ratios were used to achieve the effluent treatment goals. Copyright © 2005 Society of Chemical Industry 相似文献
12.
部分种子成分的特征X射线在等效生物材料中衰减的测定 总被引:6,自引:5,他引:1
用Si(Li)探测器实现了Na、Mg、S、Cl的特征X射线在有机膜中的相对衰减以及与O、K元素的特征X射线能量相当的X射线或轫致辐射在有机膜中的相对衰减,分别得出了它们减的数学描述,并把实验得到不同能量的X射线在有机膜中的质量吸收系数与Berkeley的OCG软件计算出的结果相比,相关都小于30%。 相似文献
13.
本文讨论了用辉光放电法制备氮化硅薄膜时衬底温度、射频功率和气体流量比对薄膜的电导率、介电常数和击穿强度的影响。通过优化生长条件,制备了优质非晶氮化硅薄膜,其介电常数为7.5、击穿强度为5.5MV/cm、电导率为10-13(Ωcm)-1。 相似文献
14.
2,3,4- or 2,3,5-trisubstituted furans were highly regioselectively formed from the cycloisomerization reaction of the same starting cyclopropenes 1 via the subtle choice of the transition metal halides. Under the catalysis of 5 mol % PdCl2(CH3CN)2, 2,3,5-trisubstituted furans 2 were given in 50-88% yields with 95-99% regioselectivities, while 2,3,4-trisubstituted furans 3 were formed in 78-96% yields with 99% regioselectivities under the catalysis of 5 mol % CuI. 相似文献
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An extended analysis of ground impedance measurement using the fall-of-potential method will be presented. An interesting curve that represents the exact locations of the potential probe when the potential and current probes are in different directions is obtained for the first time. Curves representing measurement error are also presented for the case when the potential probe is placed in locations where the correct ground impedance cannot be measured. A similar analysis for ground impedance measurements in multilayer soils is also discussed. The study presented in this paper has extended the theory of the conventional fall-of-potential method and the results obtained can serve as a practical guide for ground impedance measurements made using this method. 相似文献
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Ma Z.J. Chen J.C. Liu Z.H. Krick J.T. Cheng Y.C. Hu C. Ko P.K. 《Electron Device Letters, IEEE》1994,15(3):109-111
It has been reported that high-temperature (~1100°C) N2 O-annealed oxide can block boron penetration from poly-Si gates to the silicon substrate. However, this high-temperature step may be inappropriate for the low thermal budgets required of deep-submicron ULSI MOSFETs. Low-temperature (900~950°C) N2O-annealed gate oxide is also a good barrier to boron penetration. For the first time, the change in channel doping profile due to compensation of arsenic and boron ionized impurities was resolved using MOS C-V measurement techniques. It was found that the higher the nitrogen concentration incorporated at Si/SiO2 interface, the more effective is the suppression of boron penetration. The experimental results also suggest that, for 60~110 Å gate oxides, a certain amount of nitrogen (~2.2%) incorporated near the Si/SiO2 interface is essential to effectively prevent boron diffusing into the underlying silicon substrate 相似文献
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