Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the convergence of the inverses of Toeplitz matrices and its applications

Many issues in signal processing involve the inverses of Toeplitz matrices. One widely used technique is to replace Toeplitz matrices with their associated circulant matrices, based on the well-known fact that Toeplitz matrices asymptotically converge to their associated circulant matrices in the weak sense. This often leads to considerable simplification. However, it is well known that such a weak convergence cannot be strengthened into strong convergence. It is this fact that severely limits the usefulness of the close relation between Toeplitz matrices and circulant matrices. Observing that communication receiver design often needs to seek optimality in regard to a data sequence transmitted within finite duration, we define the finite-term strong convergence regarding two families of matrices. We present a condition under which the inverses of a Toeplitz matrix converges in the strong sense to a circulant matrix for finite-term quadratic forms. This builds a critical link in the application of the convergence theorems for the inverses of Toeplitz matrices since the weak convergence generally finds its usefulness in issues associated with minimum mean squared error and the finite-term strong convergence is useful in issues associated with the maximum-likelihood or maximum a posteriori principles.     

无油分子泵机组的组装

介绍了将ALCATEL公司生产的一台ATPl00涡轮分子泵、一台MDP50ll牵引分子泵及一台VRC公司生产的lBy6型干泵组装成无油分子泵机组的过程。文中给出了泵间配合的计算、机组方案的设计、连接管路、仪器支架的设计及选择。本机组所采取的设计方案使三个泵都最大限度地发挥了优点避免了缺陷，较好地满足了使用要求，为今后选购单泵和组装无油分子泵机组提供了可靠的理论和实验依据。     

Mobility management architectures based on joint mobile IP and SIP protocols

In the all-IP wireless networks beyond the third generation, mobility management can be effectively achieved by applying mobile IP (MIP) and the session initiation protocol (SIP) jointly. Nevertheless, an efficient combination of both protocols remains an open research issue. Conventional hybrid MIP-SIP mobility architectures operate MIP and SIP almost independently, resulting in significant redundant costs. This article investigates the representative hybrid MIP-SIP architectures and explores the joint optimizations between MIP and SIP for a more cost-efficient mobility support whilst utilizing their complementary power. Two novel design approaches are presented. The first approach culminates in a tightly integrated architecture, which merges the redundant mobility entities in MIP and SIP to yield maximum system efficiency. The other approach leads to a loosely integrated architecture, where necessary interactions are introduced between MIP and SIP mobility servers while their physical entities are kept intact. Major mobility procedures, including location update, session setup and handoff, are discussed in these architectures. The analytical results demonstrate that both proposed architectures outperform typical hybrid MIP-SIP architectures in terms of clear-cut reduced signaling costs     

不同注F剂量与CMOS运放电路辐照损伤的相关性

在不同注F剂量条件下,对P沟和N沟两种不同差分对输入CMOS运放电路的电离辐照响应进行了研究.分析比较了注F和未注F运放电路电离辐照响应之间的差异.结果表明,在栅场介质注入适量的F,可有效抑制辐照感生的氧化物电荷尤其是界面态的增长,从而提高CMOS运放电路的抗辐照特性.     

Al、Mo含量对铸造钛合金力学性能的影响

运用正交实验 ,考察了Al、Mo含量对Ti Al Mo 1Zr系铸造钛合金力学性能的影响。试验结果表明 :随Al、Mo含量提高 ,铸造合金的强度增加 ,塑性和冲击韧性降低 ,但Al、Mo的交互作用却使合金塑性提高 ,强度和冲击韧性降低     

下一代无线通信概念和技术

下一代无线通信(NextG:Next-generationwireless)的主流是随时随地的无线通信系统和无缝的高质量无线业务。概述了随时随地的无线通信和业务发展情况,并且介绍了为下一代无线通信的发展提供基础的关键技术。     

珠光体球化的分形研究

珠光体球化反映到金相上，是一种不规则图像的变化，并且具有分形的特征，可望用分形几何的方法来进行描述。以Cr-Mo钢的珠光体球化为例，用分形维数来描述珠光体球化程度；用小岛法对15CrMo钢的珠光体球化图谱进行了测量。实验表明，珠光体球化从1级到6级，其相应的分形维数范围为1.3156-1.9282。从电厂运行了10^5h的15CrMo钢管上取样，实测了该试样的珠光体球化等级，结果表明，以分形维数表示的球化程度与按图谱评定的球化等级完全吻合。     

海底输油管道内智能引导装置研究

对海底输油管道内智能引导装置研究的必要性进行了分析;介绍了国内外在该领域的技术发展状况。针对智能引导装置的作业对象和环境,提出了技术要求和指标,对智能引导装置进行了总体设计,分析了其作业机理,建立了力学模型并进行了计算。对智能引导装置的控制系统进行了设计,提出了设计过程中应注意的问题。所研制的管内轮式智能引导装置具有质量轻、输出牵引力大、体积小、结构紧凑等特点,对较小管内空间类似系统的设计有一定参考价值。     

石膏转化制硫酸钾结晶动力学及结晶添加剂研究

研究了浓氨介质中石膏与氯化钾直接转化制硫酸钾的结晶动力学及结晶添加剂的作用效果。结果表明 ,硫酸钾在氨介质中的成核速率与晶体生长速率、悬浮密度、搅拌速率存在如下关联式 :B0 =5 .64 13×10 8G3.32 0 8Mt0 .0 559np0 .2 92 8。加入异丙醇、OP乳化剂及十二烷基苯磺酸钠等添加剂 ,可使硫酸钾结晶产品纯度提高 ,晶体形态整齐均匀