钛离子注入硅薄层硅化物结构和特性

用大束流密度的钛金属离子注入硅,能够直接合成性能良好的薄层硅化物,随束流密度的增加,硅化钛生长,薄层硅化物的薄层电阻（Ｒｓ） 明显下降,当束流密度（Ｊ）为０－７５Ａ／ｍ２ 时,Ｒｓ 达到最小值１６Ω／□,电阻率达到０－６４μΩ·ｍ 。经过１０５０ ℃快速退火２０ｓ 后,Ｒｓ 可下降到２－２Ω／ □,说明退火可进一步改善硅化钛的质量。扫描电子显微镜观察表明,枝状连续的硅化物已经形成。Ｘ衍射分析表明,注入层中形成了ＴｉＳｉ和ＴｉＳｉ２ 。背散射分析表明,其薄层厚度为８０ｎｍ 。利用ＭＥＶＶＡ金属离子注入,可获得直径达到Φ５００ｍ ｍ 注入斑点。     

Stabilizing Polymer–Lithium Interface in a Rechargeable Solid Battery

Solid polymer electrolytes (SPEs) are promising candidates for developing high‐energy‐density Li metal batteries due to their flexible processability. However, the low mechanical strength as well as the inferior interfacial regulation of ions between SPEs and Li metal anode limit the suppress ion of Li dendrites and destabilize the Li anode. To meet these challenges, interfacial engineering aiming to homogenize the distribution of Li⁺/electron accompanied with enhanced mechanical strength by Mg₃N₂ layer decorating polyethylene oxide is demonstrated. The intermediary Mg₃N₂ in situ transforms to a mixed ion/electron conducting interlayer consisting of a fast ionic conductor Li₃N and a benign electronic conductor Mg metal, which can buffer the Li⁺ concentration gradient and level the nonuniform electric current distribution during cycling, as demonstrated by a COMSOL Multiphysics simulation. These characteristics endow the solid full cell with a dendrite‐free Li anode and enhanced cycling stability and kinetics. The innovative interface design will accelerate the commercial application of high‐energy‐density solid batteries.     

针对更精确电迁移预测应用的热耦合模型建模

基于先进逻辑CMOS工艺平台,构建了集成电路热耦合模型,为后端金属线电迁移预测提供更精确的温度变化和分布信息。在建模过程中,为了提高建模和仿真效率,对金属线网络和晶体管有源区进行简化,并用热传输比率对热耦合进行表征。考虑到晶体管参数、金属线走向、金属线之间相对位置对热传输比率的影响,模型中引入相关因子对热传输比率做进一步修正。最后,将该热传输模型嵌入到商用仿真软件中。结果表明,热传输比率(即温度)的仿真值与基于工艺平台流片的实测值吻合良好,验证了模型的准确性。     

Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application

<正>Packaging of MEMS ( micro-electro-mechanical system ) devices poses more challenges than conventional IC packaging, since the performance of the MEMS devices is highly dependent on packaging processes. A Land Grid Array ( LGA ) package is introduced for MEMS technology based linear multi-axis accelerometers. Finite element modeling is conducted to simulate the warpage behavior of the LGA packages. A method to correlate the package warpage to matrix block warpage has been developed. Warpage for both package and sensor substrate are obtained. Warpage predicted by simulation correlates very well with experimental measurements. Based on this validated method, detailed design analysis with different package geometrical variations are carried out to optimize the package design. With the optimized package structure, the packaging effect on accelerometer signal performance is well controlled.     

ESD与EMP对微波晶体管损伤机理研究

主要论述了电子装备中易受静电放电(ESD)和电磁脉冲(EMP)损伤的微波半导体器件的失效模式和失效机理.实验与理论分析结果表明,电流放大系数hFE是ESD、EMP损伤的敏感参数;在ESD、EMP的作用下,器件进入雪崩击穿状态(反偏注入),从而诱发热电子注入效应,使hFE逐渐退化;BC结反偏时的失效能量低于EB结反偏时的失效能量,BC结是EMP损伤的较易损端口;改进器件的结构设计、提高器件抗ESD、EMP能量,可有效提高电子装备抗电磁脉冲的可靠性水平.     

基于卤素灯激励的红外热成像裂纹无损检测研究

钢轨安全状态的监测对保证列车的安全运行至关重要,针对钢轨裂纹的检测,本文阐述了几种不同的裂纹检测技术.重点分析了红外热成像检测技术在钢轨裂纹检测中的应用,该检测技术包括外激励加热、红外图像采集以及图像处理三部分.本文将常用激励方式进行了介绍和对比,详细阐述了卤素灯作为激励在裂纹检测中的应用;其次,搭建了基于卤素灯激励的...     

基于实测数据的地面慢速动目标检测

2001年夏对某机载战场侦察雷达的GMTI功能进行了挂飞试验,并录取了一批双通道(天线)数据.本文给出此数据的部分处理结果,包括地面场景的多普勒波束锐化(DBS)成像,落在旁瓣区的动目标的检测和干涉定位,空时联合处理杂波抑制和动目标检测.     

通信防雷系统的建立

本介绍通信防雷系统的建立途径。并按通信系统的各组成部分的区域属性及设施属性不同，介绍了应设置防雷装置的特点和防雷措施。     

人舌鳞癌组织超薄切片的AFM成像和切割

利用一种基于电镜超薄切片法改进的制样方法，将人舌鳞状细胞癌病理组织以环氧树脂包埋并切片后，将薄片平整地贴附在云母上，用原子力显微镜(AFM)对切片表面进行研究，可以得到高分辨率的细胞超微结构图像，局部的亚细胞水平的形态结构可以与电镜下得到的图像相比拟。在此基础上，利用AFM针尖对肿瘤细胞核内特定区域进行切割和操纵，形成生物分子的堆积，从而为拾取(pjck—up)和进一步用分子生物学手段在亚细胞基因水平研究人舌鳞癌的病理学奠定了基础。