Cholesterol‐imprinted polymer receptor prepared by a hybrid imprinting method

A novel cholesterol‐imprinted polymer (CMIP‐H) was prepared by a hybrid method of covalent imprinting and non‐covalent imprinting. This approach involves the copolymerization of a template‐containing monomer, cholesteryl 2‐hydroxyethyl methacrylate carbonate, and a cross‐linker, followed by hydrolysis to afford a flexible guest‐binding site accompanied with the easy and efficient removal of a ‘sacrificial spacer’. The effect of solvent on the binding capacity of CMIP‐H towards cholesterol was studied, indicating that a good binding capacity towards cholesterol could be achieved in a less‐polar solvent. The binding experiments of CMIP‐H towards a series of structural analogues of cholesterol, including cholesterol acetate, progesterone and stigmasterol, were carried out in hexane. The results showed that CMIP‐H almost did not bind cholesterol acetate at all because the hydrogen‐bonding site is blocked. It exhibited a similar binding towards both cholesterol and stigmasterol, but much higher binding towards progesterone. Copyright © 2005 Society of Chemical Industry     

Adhesive element modelling and weighted static shape control of composite plates with piezoelectric actuator patches

A novel finite element model is presented for static and dynamic analysis of composite plates integrated with a laminated piezoelectric layer, a host laminated composite plate and an adhesive layer between them. A new adhesive element is developed which includes both peel and shear effects in the adhesive layer based on first‐order shear deformation plate theory. The thin adhesive layer between the piezoelectric layer and the host plate is modelled by assuming that it carries constant shear and peel strains throughout its thickness. In addition, a weighted static shape control scheme for finding the optimal voltage distribution for static shape control is given. By selecting different weighting matrices, a variety of items such as displacements, slopes, curvatures, strains and even generalized forces, can be included in finding the optimal actuating voltage for static shape control. The present model is validated by comparing with those results available in the literature. The numerical results show that the weighted linear least method can give a satisfactory voltage distribution to best match the desired shape. Copyright © 2004 John Wiley & Sons, Ltd.     

螺栓角钢钢节点的三维非线性有限元分析

对螺栓角钢钢节点半刚性连接采用非线性有限元分析方法 ,对连接中的主要构件的顶部、底部、腹板角钢、高强螺栓、梁翼缘、柱翼缘和柱翼缘加劲肋进行三维非线性有限元精细模拟 ,针对有无柱加劲肋、有无腹板角钢等几种连接的情况进行比较分析 ,探讨了螺栓角钢半刚性连接的受力性能。     

Two-dimensional symmetric multimode interferences in silicon square waveguides

Symmetric interference in two-dimensional multimode silicon waveguides is experimentally investigated. For a 100/spl times/100 /spl mu/m/sup 2/ cross section, 2700-/spl mu/m-long waveguide fabricated on silicon-on-insulator substrate, an 8/spl times/8 matrix of replicated images with high contrast ratio is demonstrated for 1530-1570 nm wavelength range. Symmetric interference results in reduced device length, and the actual device length is consistent with the theoretical expectation. The device also exhibits stable imaging in terms of good loss uniformity, and low wavelength and polarization dependencies among the replicated images.     

IF钢冷轧及再结晶初期微观组织的TEM研究

采用透射电子显微镜对不同压下量和再结晶初期的IF钢样品进行了研究．结果表明：无论是在较小形变量下还是在较大形变量下，形变不均匀性是普遍存在的；冷变形程度不同，织构组分不同，TEM形貌也不同；在再结晶的最初期，冷轧的形变组织演变为近乎等轴的亚晶，优先形成{111}〈uvw〉取向的晶核，晶核逐渐吞并周围的形变基体而长大，最终形成再结晶γ-纤维织构．     

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

In this paper we verified the submodeling technique applied in the thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since the steady-state creep model was implemented for the solder bump to better represent its realistic mechanical behavior, submodeling procedures developed specifically for path-dependent thermomechanical problems were considered. A detailed global model for the flip-chip BGA was built up to verify submodeling solutions. This model also served as a benchmark to examine solution discrepancies caused by different simplifications of the global model.     

曲靖二期工程电气、热控工艺质量策划的运用

介绍了曲靖电厂二期工程电气、热控安装工艺质量策划工艺质量的方法 ,及策划过程和划重点     

超分子主体化合物在分析化学中的应用研究进展

综述了近年来超分子主体化合物在分析化学领域的应用研究与进展。分别以冠醚、环糊精、杯芳烃、卟啉4类超分子为主体功能化合物的研究进行了详细的评述，并对这几类主体化合物在分析化学中的应用研究进行了展望。     

新型超微晶软磁合金FePCCuMoSi微观结构缺陷的正电子湮没研究

用正电子湮没方法研究了新型超微晶软磁合金的微观结构缺陷，样品选用的是在不同温度下退火的Ｆｅ８１Ｐ１２Ｃ３Ｃｕ１Ｍｏ０．５Ｓｉ２．５合金，结果表明，合金的微观结构构陷大小，密度随退火温度有规律地变化，这种现象可能与非晶的晶化过程有关。     

A novel proof of the Souriau-Frame-Faddeev algorithm

A simple and elegant proof is given for a recurrence relation that computes the coefficients of the characteristic polynomial of a linear system used in the Souriau-Frame-Faddeev algorithm