A physically based method for triangulated surface flattening

This paper introduces a new method of generating 2D flat patterns from a 3D triangulated surface by opening the bending configuration of each winged triangle pair. The flattening can be divided into four steps. First, a 3D triangulated surface is modeled with a mass-spring system that simulates the surface deformation during the flattening. Second, an unwrapping force field is built to drive the mass-spring system to a developable configuration through the numerical integration. Third, a velocity redistribution procedure is initiated to average velocity variances among the particles. Finally, the mass-spring system is forced to collide with a plane, and the final 2D pattern is generated after all the winged triangle pairs are spread onto the colliding plane. To retain the size and area of the original 3D surface, a strain control mechanism is introduced to keep the springs from over-elongation or over-shrinkage at each time step.     

Synthesis and aqueous solution behaviors of sodium sulfonate‐terminated dendritic poly(ester‐amine)

Sodium sulfonate‐terminated dendritic poly(ester‐amine) (SPEA) was synthesized by sulfonation of acrylic double bond‐terminated dendritic poly(ester‐amine) (APEA) with sodium hydrogen sulfite (NaHSO₃) in mixture of diglycol and 2‐butanone under normal pressure. The structure of SPEA was characterized by IR, ¹H‐NMR, and elemental analysis. SPEA was water‐soluble. 1.0–40.0% (mass) SPEA aqueous solutions appeared as dilatant fluid. When pH value varied from 1.5 to 12.0, the viscosity of 1–5% (mass) SPEA aqueous solutions changed very small, and the electric conductivity almost kept stable within pH 3.0–10.0. The relationship between the viscosity and the concentration of SPEA water solutions was similar to that of NaCl water solutions. The surface tension of SPEA water solutions was lower than that of polyethylene glycol 2000 water solutions with the same concentration. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Thermal and mechanical properties of epoxy composites reinforced by a natural hydrophobic sand

If a low weight percentage of crude fine fillers can improve properties of polymer materials directly without complicated chemical treatment process involved, it will be significant for many industrial applications. Our previous study indicated that a kind of Cancun natural sand could be an effective filler material for polymer composites. In this current work, the epoxy composites reinforced by this kind of natural sand particles were prepared and thermal and mechanical properties of the composites containing up to 5 wt % of the sand particles were characterized. Results showed that the highest flexural strength appears in the epoxy composite containing 1 wt % sand particles. A damage model was used to interpret the flexural properties, which showed an acceptable agreement with the experimental results. The glass transition temperature, high temperature storage modulus, and dimensional stability of the sand/epoxy composites monotonically increased with the addition of the sand particles. The sand particle/epoxy composites also displayed a noticeable enhancement in thermal conductivity. Theoretical analysis showed that in addition to conduction, other heat transport mechanisms played roles in the improved heat transmission through the composites. As a natural porous micron-scale material, Cancun sand has the potential for applications in cost-effective composites with enhanced mechanical and thermal properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Effect of current stressing on the reliability of 63Sn37Pb solder joints

The effect of current stressing on the reliability of 63Sn37Pb solder joints with Cu pads was investigated at temperatures of −5 °C and 125 °C up to 600 h. The samples were stressed with 3 A current (6.0 × 10² A/cm² in the solder joint with diameter of 800 μm and 1.7 × 10⁴ A/cm² in the Cu trace with cross section area of 35 × 500 μm). The temperatures of the samples and interfacial reaction within the solder joints were examined. The microstructural change of the solder joints aged at 125 °C without current flow was also evaluated for comparison. It was confirmed that the current flow could cause the temperature of solder joints to rise rapidly and remarkably due to accumulation of massive Joule heat generated by the Cu trace. The solder joints stressed at 125 °C with 3 A current had an extensive growth of Cu₆Sn₅ and Cu₃Sn intermetallic compounds (IMC) at both top and bottom solder-to-pad interfaces. It was a direct result of accelerated aging rather than an electromigration or thermomigration effect in this experiment. The kinetic is believed to be bulk diffusion controlled solid-state reaction, irrespective of the electron flow direction. When stressed at −5 °C with 3 A current, no significant change in microstructure and composition of the solder joints had occurred due to a very low diffusivity of the atoms as most Joule heat was eliminated at low temperature. The IMC evolution of the solder joints aged at 125 °C exhibited a subparabolic growth behavior, which is presumed to be a combined mechanism of grain boundary diffusion and bulk diffusion. This is mainly ascribed to the retardant effect against the diffusion course by the sufficiently thick IMC layer that was initially formed during the reflow soldering.     

Techniques and Apparatus for Measuring Rotational Core Losses of Soft Magnetic Materials

In many situations such as the cores of a rotating electrical machine and the T joints of a multiphase transformer, the local flux density varies with time in terms of both magnitude and direction, i.e. the flux density vector is rotating. Therefore, the magnetic properties of the core materials under the rotating flux density vector excitation should be properly measured, modeled and applied in the design and analysis of these electromagnetic devices. This paper presents an extensive review on the development of techniques and apparatus for measuring the rotational core losses of soft magnetic materials based on the experiences of various researchers in the last hundred years.     

Piezoelectric Nanogenerators for Self-Powered Nanodevices

A novel approach converts nanoscale mechanical energy into electric energy for self-powering nanodevices.In our own work, we've used piezoelectric zinc-oxide nanowire (ZnO NW) arrays to demonstrate a novel approach for converting nanoscale mechanical energy into electric energy. Here, we review the fundamental principle behind the nanogenerator, present an approach for improving its performance, and discuss some of the challenges we face in pushing this technology to reach its potential.     

塔河渣油高温催化临氢热转化技术研究

以塔河减压渣油（简称塔河减渣）为原料，在实验室小型试验装置和中型连续试验装置上，对在较高温度条件下催化临氢热转化加工塔河减渣的工艺操作条件及改质效果进行了系统研究。采用高分散的油溶性催化剂，在高压釜反应器中考察了反应温度、反应压力、催化剂添加量、溶剂油添加量、反应时间以及助剂添加量对塔河减渣催化临氢热转化反应的转化率和缩合率的影响，优化了操作参数。在优化的操作条件下，进行了塔河减渣催化临氢热转化中型试验，得到初馏点大于524 ℃组分的裂化率为85.2%，馏分油收率为80%，金属（Ni+V）和沥青质脱除率均大于90%。     

Verifiable Distributed Oblivious Transfer and Mobile Agent Security

The mobile agent is a fundamental building block of the mobile computing paradigm. In mobile agent security, oblivious transfer (OT) from a trusted party can be used to protect the agent’s privacy and the hosts’ privacy. In this paper, we introduce a new cryptographic primitive called Verifiable Distributed Oblivious Transfer (VDOT), which allows us to replace a single trusted party with a group of threshold trusted servers. The design of VDOT uses a novel technique called consistency verification of encrypted secret shares. VDOT protects the privacy of both the sender and the receiver against malicious attacks of the servers. We also show the design of a system to apply VDOT to protect the privacy of mobile agents. Our design partitions an agent into the general portion and the security-sensitive portion. We also implement the key components of our system. As far as we know, this is the first effort to implement a system that protects the privacy of mobile agents. Our preliminary evaluation shows that protecting mobile agents not only is possible, but also can be implemented efficiently. This work was supported in part by the DoD University Research Initiative (URI) program administered by the Office of Naval Research under grant N00014-01-1-0795. Sheng Zhong was supported by ONR grant N00014-01-1-0795 and NSF grants ANI-0207399 and CCR-TC-0208972. Yang Richard Yang was supported in part by NSF grant ANI-0207399. A preliminary version of this paper was presented at the DialM-POMC Joint Workshop on Foundations of Mobile Computing in 2003. Sheng Zhong received his Ph.D. in computer science from Yale University in the year of 2004. He holds an assistant professor position at SUNY Buffalo and is currently on leave for postdoctoral research at the Center for Discrete Mathematics and Theoretical Computer Science (DIMACS). His research interests, on the practical side, are security and incentives in data mining, databases, and wireless networks. On the theoretical side, he is interested in cryptography and game theory. Yang Richard Yang is an Assistant Professor of Computer Science at Yale University. His research interests include computer networks, mobile computing, wireless networking, sensor networks, and network security. He leads the LAboratory of Networked Systems (LANS) at Yale. His recent awards include a Schlumberger Fellowship and a CAREER Award from the National Science Foundation. He received his B.E. degree from Tsinghua University (1993), and his M.S. and Ph.D. degrees from the University of Texas at Austin (1998 and 2001).