Effects of Ag addition and Ag3Sn formation on the mechanical reliability of Ni/Sn solder joints

Formation of intermetallic compounds (IMCs) in solder joints is closely associated with the mechanical reliability of the system. Though internal voids formed in Ni/Sn solder joints are known to be related to the formation of Ni₃Sn₄ IMC, a detailed study on the mechanical reliability has not yet been reported. In this study, the mechanical reliability of Ni/Sn joints was investigated using two different soldering systems: Ni/Ag-Ag/Sn/Ni bilayers and Ni/Sn/Ag-Ag/Sn/Ni sandwich structures. The failure mode was found to be closely related to the formation and growth of an Ag₃Sn phase. Filling of the voids with Ag₃Sn IMC resulted in maximum shear strength, with a failure locus through Ni₃Sn₄ and Ag₃Sn. However, formation of a large amount of Ag₃Sn decreased the shear strength once again.     

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

In this paper, vibration tests are conducted to investigate the influence of temperature on PCB responses. A set of combined tests of temperature and vibration is designed to evaluate solder interconnect reliability at 25 °C, 65 °C and 105 °C. Results indicate that temperature significantly affects PCB responses, which leads to remarkable differences in vibration loading intensity. The PCB eigenfrequency shifts from 290 Hz to 276 Hz with an increase of test temperature from 25 °C to 105 °C, during which the peak strain amplitude is almost the same.Vibration reliability of solder interconnects is greatly improved with temperature rise from 25 °C to 105 °C. Mean time to failure (MTTF) of solder joint at 65 °C and 105 °C is increased by 70% and 174% respectively compared to that of solder joint at 25 °C. Temperature dominates crack propagation path of solder joint during vibration test. Crack propagation path is changed from the area between intermetallic compound (IMC) layer and Cu pad to the bulk solder with temperature increase.     

用简单原位试验确定切线模量法的参数及 其在砂土地基非线性沉降分析中的验证

地基沉降计算一直是岩土工程研究中的热点和难点问题,其困难在于室内试验与原位岩土参数差异较大,尤其是砂土地基和结构性强的硬黏土地基,基于室内试验参数的沉降计算与实际的误差较大。基于原位压板载荷试验来确定计算参数的切线模量法能克服这个缺点,并能计算地基的非线性沉降,是地基沉降计算的一个新进步。但原位压板载荷试验相对其他试验难度大、费用高,尤其对于深层土体,难度更大。为此,利用位于美国Texas A&M University大学河滨校区砂土地基上进行的系统的岩土试验资料,通过其不同压板尺寸的载荷试验,对切线模量法应用于砂土地基非线性沉降计算的适用性进行了验证,然后进一步研究由旁压试验、静力触探等简单的原位试验确定切线模量法所需的计算参数的可行性。结果表明：切线模量法所需的计算参数由旁压试验、静力触探等简单的原位试验确定是可行的,从而为切线模量法的推广应用确定提供了更简单的方法。对推动地基设计理论的发展有较好的意义。     

考虑拟弹性塑性变形的土体弹塑性本构模型

传统弹塑性理论下的关联流动模型用于岩土材料时,对更一般的本构关系的描述难以令人满意,这是因为土的塑性应变增量方向存在非唯一性,这在理论和试验上都已得到证明。传统弹塑性理论是基于塑性应变增量方向具有唯一性的假设之上的,因而不论采用关联流动法则还是非关联流动法则,都难以较好地解决岩土材料本构关系的建模问题,有必要去发展新的理论。同时已有的研究也表明土的塑性应变增量方向不仅取决于总应力,也与应力增量是相关的,即表现出弹性应变的特性。在广义位势理论的基础上,研究塑性应变增量的分解准则,提出了考虑拟弹性塑性变形的土体弹塑性本构模型,把传统不可恢复的塑性应变增量分解为具有弹性应变特性的拟弹性部分和纯塑性部分。拟弹性部分遵从弹性法则,并与应力增量有相同的方向,采用弹性模型表示;纯塑性部分遵从传统塑性理论的假设,方向具有唯一性,可以采用符合塑性理论的假设来建模。这样分解后建立的模型将更为合理和简便,又可以解决土的塑性应变增量方向存在非唯一性的问题。最后通过与试验结果的对比证明了其可行性,对试验结果可得到效果更好的模型。     

元器件纯锡镀层表面晶须风险评估与对策

讨论了各种锡晶须的形态以及其长度的具体测量方法,并在试验研究的基础上进一步分析抑制非光滑(哑光)纯锡镀层上锡晶须生长的对策.研究结果表明,增加锡镀层厚度(＞7 μm),或通过使用添加剂来产生更加粗糙的表面以适当增大晶粒尺寸,电镀完成后及时进行退火程序是进一步减轻雾锡镀层上锡晶须困扰的有效手段.如果引入Ni作为中间镀层,则需要达到一定的厚度(估计＞0.7 μm),方可达到预期的效果.     

电子元器件失效模式影响分析技术

在元器件中进行失效模式影响分析(FMEA)技术研究和应用的基础上,论述了适合元器件的失效模式、机理影响分析(FMMEA)技术,在国内首次将FMMEA技术应用到元器件的基础上,研制了FMMEA技术分析软件,为元器件的研制和使用中控制或消除相关的失效模式及机理,提高产品质量和可靠性提供了一个新的方法和思路。     

汽车电压调节器的性能可靠性计算机仿真

利用系统性能可靠性仿真,对汽车电压调节器的设计及性能进行分析,找出了对其性能可靠性影响最大的元器件,以及对环境温度敏感的元器件;通过提高元器件精度和改善半导体器件的温度特性,对初始设计进行了改进,提高了汽车电压调节器在使用中的性能可靠性.