黄磷生产中磷过滤新工艺的开发及应用效果

结合国内外元素磷分离提纯的生产工艺，提出了中国石化集团南京工程有限公司昆明设计分司自行开发创新的磷过滤新工艺技术，并对其流程和工艺特点进行了阐述。该工艺装置已在黄磷企业成功运行，取得了较好的节能减排效果和经济效益，有广泛的应用前景，对于黄磷生产企业具有一定的参考和借鉴价值。     

An LP/CBP reconfigurable analog baseband circuit for software-defined radio receivers in 65 nm CMOS

A low pass (LP) and complex band pass (CBP) reconfigurable analog baseband circuit for software-defined radio (SDR) receivers is presented. It achieves 1–15 MHz LP bandwidth, 2–8 MHz CBP bandwidth and 0–36 dB gain range with 1 dB step. Nulling-resistor Miller feed-forward (NRMFF) differential-mode compensation, passive left half-plane (LHP) zero common-mode compensation and Quasi-Floating Gate (QFG) technique are proposed to improve the high frequency performance and driving capability of the embedded fully differential operational amplifier (Op-Amp). The analog baseband circuit has been implemented in 65 nm CMOS. It achieves 15.2 dB m/27.1 dB m IB/OB-IIP3, −2 dB m IP1dB and 71 dB m IIP2 while consuming 3.6–9.1 mW from a 1.2 V power supply and 0.75 mm² chip area.     

半水-二水湿法磷酸生产循环料浆比的控制

半水-二水湿法磷酸生产因磷矿质量的下降,引起半水料浆发黏,分解速率降低,二水转化槽P2O5含量偏高,二水石膏技术指标不合格等问题。通过几年来的生产实践经验总结发现:磷矿中酸不溶物和MgO高时,采取提高循环料浆比是解决上述问题的有效措施;而当磷矿质量好时,则不宜控制较高的循环料浆比。     

云南省城市污水处理厂污泥处置技术探讨

随着城市污水收集率及处理率的不断提高,污水处理厂污泥量不断增加,若不加妥善处置易造成二次环境污染。国外发达国家以土地利用为主,且土地利用的比例还在不断提高,云南省污泥处置方式以卫生填埋为主。分析了云南省污水处理厂污泥产生的特点及处置现状,提出了应该按照统一规划,合理布局,充分研究,优先选择土地利用特别是用于园林绿化的方案。     

建筑业信用体系建设研究

探讨了建立我国建筑业信用体系的必要性,分析了建筑业信用缺失的原因,提出了构建适合我国国情的建筑业信用体系的基本思路。     

浅谈设备管理的发展

简要介绍了设备管理的定义及意义。阐述了传统设备管理的局限性,分析了5S设备管理、设备综合工程学、后勤学、全员生产维修、全员规范化生产维修、可靠性为中心的维修管理、状态检测为基础的“状态维修”等几种先进的现代设备综合管理方法及其特点。     

鱼雷磁耦合传动金属隔离罩分析与优化设计

磁耦合传动技术可解决鱼雷大深度攻击所面临的尾轴密封问题,但其金属隔离罩的优化设计与损耗分析是该技术难点之一.基于一型磁耦合传动机构的工作特性,开展了金属隔离罩的优化设计及参数计算工作,建立了2D和3D有限元损耗模型,开展了感应电流、涡流损耗分析,建立了3D有限元耐压强度模型,并进行了耐压强度分析.仿真结果表明,金属隔离罩设计合理,涡流损耗小,能满足耐压强度要求.     

Nano structured CdO films grown by the SILAR method: Influence of silver-doping on the morphological,structural and optical properties

Cadmium oxide films with and without silver-doping have been prepared by the SILAR method onto soda-lime-silica glass slides and characterized by scanning electron microscopy, UV-Visible spectroscopy and X-ray diffraction measurements. Scanning electron microscopy images show that increasing silver concentration contributed to adjust surface properties and led to a decrease in particle size from the UV-Visible spectroscopy analysis it was found that the optical band gap value of the films is increased with silver doping.     

基于B/S结构网上管理信息系统的设计与实现

通过分析三层B/S结构的特点,提出基于B/S结构网上管理信息系统的基本设计思想,简要介绍系统各功能及数据库的设计,着重讨论用ASP技术和XML开发网上管理信息系统时的数据库访问技术和动态网页制作技术,并给出部分实现代码。通过该系统使用户可以方便地在网上进行浏览和查询等操作。.     

The combined effects of grain and sample sizes on the mechanical properties and fracture modes of gold microwires

Hall-Petch relation was widely applied to evaluate the grain size effect on mechanical properties of metallic material. However, the sample size effect on the Hall-Petch relation was always ignored. In the present study, the mechanical test and microstructure observation were performed to investigate the combined effects of grain and sample sizes on the deformation behaviors of gold microwires. The polycrystalline gold microwires with diameter of 16 ?m were annealed at temperatures from 100°C to 600°C, leading to different ratios(t/d) of wire diameter(t) to grain size(d) from 0.9 to 16.7. When the t/d was lower than 10, the yield stress dropped fast and deviated from the Hall-Petch relation. The free-surface grains played key role in the yield stress softening, and the volume fraction of free-surface grains increased with the t/d decreasing. Furthermore, the effects of t/d on work-hardening behaviors and fracture modes were also studied. With t/d value decreasing from 17 to 3.4, the samples exhibited necking fracture and the dislocation pile-ups induced work-hardening stage was gradually activated.With the t/d value further decreasing(t/d 3.4), the fracture mode turned into shear failure, and the work-hardening capability lost. As the gold microwire for wire bonding is commonly applied in the packaging of integrated circuit chips, and the fabrication of microwire suffers multi-pass cold-drawing and annealing treatments to control the grain size. The present study could provide instructive suggestion for gold microwire fabrication and bonding processes.