Low temperature sintering of barium titanate ceramics assisted by addition of lithium fluoride-containing sintering additives

By addition of LiF-containing sintering additives to commercial BaTiO₃ powder, more than 98% of the theoretical density was reached at a sintering temperature of 900 °C both on powder compacts and laminates. Dielectric measurements were performed on ceramic samples in the temperature and frequency ranges from −20 °C to 125 °C and from 10³ to 10⁶ Hz, respectively. High relative permittivity (_r  3160) and low dielectric loss (tan δ  0.014) were measured for tapes of the favoured material. The breakdown strength for tapes with a thickness of about 80 μm is 30 kV/mm. The microprobe analysis showed, that no interfacial reaction between the dielectric layer and the Ag-electrode had occurred.The newly developed barium titanate ceramics completely densifying at 900 °C turned out to be promising for integration of buried capacitors in LTCC multilayers.     

High-Q microwave dielectrics in low-temperature sintered (Zn1−xNix)3Nb2O8 ceramics

The effects of Ni substitution for Zn on microwave dielectric properties of (Zn_1−xNi_x)₃Nb₂O₈ (x = 0.02–0.08) ceramics were investigated in this study. The XRD patterns of the sintered samples reveal single-phase formation with a monoclinic structure. The tremendous improvement of Q × f value can be achieved by a small level of Ni substitution (x = 0.05). The τ_f value was found to decrease with a decreasing A-site bond valence. In addition, B₂O₃ and CuO were used as a sintering aid to lower the sintering temperature from 1180 to 900 °C. Excellent microwave dielectric properties (ɛ_r ∼ 20.7, Q × f ∼ 98,000 GHz and τ_f ∼ −85.2 ppm/°C) and a chemical compatibility with Ag electrodes can be obtained for 4 wt% B₂O₃–CuO doped (Zn_0.95Ni_0.05)₃Nb₂O₈ ceramics sintered at 930 °C for 2 h. This constitutes a very promising material for LTCC applications.     

通孔柱银浆用超细银粉的制备研究

通孔银浆料是低温共烧陶瓷(LTCC)基板配套的系列电子浆料中必不可少的一种材料,对银粉有很高的要求。用抗坏血酸还原体系制备银粉,研究硝酸银溶液浓度、p H值、还原剂浓度对银粉形貌及粒度分布的影响,采用扫描电子显微镜对制备的银粉进行表征分析,选取3种不同类型的银粉调制成通孔银浆进行匹配性试验。结果表明,均一性、分散性良好且平均粒径为2.0μm的球形银粉具有较好的应用潜力。     

Ba_5(Nb_(1-x)Sb_x)_4O_(15)微波介电陶瓷的低温烧结

添加质量分数为1%的H3BO3为助烧剂。研究了Ba5(Nb1–xSbx)4O15(0≤x≤0.2)陶瓷的烧结特性、显微结构和微波介电性能。结果表明:当x≤0.15时,该类陶瓷可在900℃附近烧结,并伴有少量BaSb2O6和BaB2O4相;随着x从0增加到0.2,εr和τf均有较大幅度下降;Q.f先升后降。在900℃烧成温度下,x为0.15的陶瓷获得较好的微波介电性能:εr为29.21,Q.f为13 266 GHz,τf为11×10–6℃–1,并能与Ag电极很好相容,基本满足LTCC工艺的要求。     

基于LTCC技术的片式带通滤波器设计

设计了一种尺寸小、频响特性优良的片式LTCC带通滤波器.通过场路结合的分析方法,对滤波器的物理结构进行了优化,从而避免了小尺寸带来的寄生效应,提高了电容耦合系数,减小了不需要的互感耦合.同时引入了谐振器的对地电感,得到了两个带外传输零点,实现了较大的带外抑制.实物测试结果和电磁场仿真结果吻合较好.     

LTCC高温压力传感器的设计制作和测试

提出了一种基于低温共烧陶瓷(LTCC)的无线电容式压力传感器,并具体讨论了传感器的设计、制作以及测试。与传统的LTCC工艺所不同的是,引入了碳膜作为牺牲层来填充传感器结构的内置式空腔,可以有效地防止空腔在层压和烧结时的变形。测试中传感器表现出了良好的灵敏度,高于之前国际上的研究水平。同时给出了现有结构优化改进的方向。     

无机添加剂对低温共烧用表面金导体的影响

金系导体低温共烧陶瓷(LTCC)技术为一些用于恶劣环境中的器件提供了高可靠性。当金厚膜导体与瓷料共烧时,无机添加剂可以和LTCC瓷料反应实现附着,但是在烧结过程中可能会发生起泡和烧结收缩失配,影响金导体的导电和焊接性能。本文针对金导体中的玻璃和无机物对金导体层和LTCC瓷料反应的影响做了综合性的研究,初步确定金导体层和瓷料的最佳烧结行为,为制备具有良好烧结匹配性、表面缺陷少、有良好附着力和键合性能的金导体浆料提供了一定参考。     

40 GHz Vertical Transition with a Dual‐Mode Cavity for a Low‐Temperature Co‐fired Ceramic Transceiver Module

A new vertical transition between a substrate integrated waveguide in a low‐temperature co‐fired ceramic substrate and an air‐filled standard waveguide is proposed in this paper. A rectangular cavity resonator with closely spaced metallic vias is designed to connect the substrate integrated waveguide to the standard air‐filled waveguide. Physical characteristics of an air‐filled WR‐22 to WR‐22 transition are compared with those of the proposed transition. Simulation and experiment demonstrate that the proposed transition shows a ?1.3 dB insertion loss and 6.2 GHz bandwidth with a 10 dB return loss for the back‐to‐back module. A 40 GHz low‐temperature co‐fired ceramic module with the proposed vertical transition is also implemented. The implemented module is very compact, measuring 57 mm × 28 mm × 3.3 mm.     

LTCC基片的飞针测试工艺研究

低温共烧陶瓷技术(Low Temperature Co-fired Ceramic LTCC)是近年来兴起的一种相当令人瞩目的多学科交叉的整合组件技术,广泛用于基板、封装及微波器件等领域。主要介绍当前广泛用于检测混合电路板、LTCC陶瓷基板、PCB裸板故障的飞针测试设备在陶瓷基片测试中的工艺研究。     

双传输零点LTCC带通滤波器的设计与仿真

提出了一种新型的基于LTCC技术的带通滤波器实现方法。带通滤波器采用两个谐振单元耦合,在输入输出端引入并联反馈电容在通带两边形成一对传输零点,提高了阻带的衰减性能。分别在HFSS和IE3D中构建物理模型,采用εr=2.2的介质材料,尺寸为5 mm×4 mm×2 mm,设计出中心频率f0=1.6 GHz,相对带宽约9%的滤波器,通带内插入损耗小于1 dB,在1.1 GHz和2.1 GHz处形成两个传输零点,两种软件的仿真结果很好地吻合。