Sn-3.0Ag-0.5Cu真空再流焊工艺技术研究

为了获得低热阻和解决不同焊接材料之间的热应力匹配问题,大功率DC-DC模块电源产品广泛采用了载体组件作为功率元器件热沉的散热方法。载体组件由金属基板和陶瓷基板焊接而成,为了得到无空洞的焊接界面,载体组件采用了真空再流焊工艺技术。文中从焊料形态、焊接表面处理、真空度等几个方面介绍了载体组件的Sn-3.0Ag-0.5Cu真...     

Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate

For development of a lead-free composite solder for advance electrical components, lead-free Sn3.5Ag0.5Cu solder was produced by mechanically mixing 0.5 wt.% TiO₂ nanopowder with Sn3.5Ag0.5Cu solder. The morphology and growth kinetics of the intermetallic compounds that formed during the soldering reactions between Sn3.5Ag0.5Cu solder with intermixed TiO₂ nanopowder and Cu substrates at various temperatures ranging from 250 to 325 °C were investigated. A scanning electron microscope (SEM) was used to quantify the interfacial microstructure at each processing condition. The thickness of interfacial intermetallic layers was quantitatively evaluated from SEM micrographs using imaging software. Experimental results show that a discontinuous layer of scallop-shaped Cu-Sn intermetallic compounds formed during the soldering. Kinetics analysis shows that the growth of such interfacial Cu-Sn intermetallic compounds is diffusion controlled with an activation energy of 67.72 kJ/mol.     

A Biaxial Fatigue Specimen for Uniaxial Loading

Abstract: The aim of this paper is to present a novel un‐notched fatigue test specimen in which a biaxial stress state is achieved using a uniaxial loading condition. This allows the problem of multi‐axial fatigue to be studied using relatively common one‐axis servo‐hydraulic testing machines. In addition the specimen presented here is very compact and can be made using a small volume of material (100 × 40 × 4.5 mm). For this specimen, the degree of biaxiality, defined by the parameter is equal to approximately 0.45. The specimen geometry was optimised using the Dang Van multi‐axial fatigue criterion. In addition to use as a fatigue specimen, it has been demonstrated that the biaxial specimen presented here is also suitable for biaxial tensile tests, to determine the rupture strength of a material in a biaxial stress state. Two different materials have been investigated: The first was wrought aluminium 2024‐O in the form of 5 mm sheets. The second was a cast aluminium‐silicon alloy AlSi7Cu0.5Mg0.3, commonly used in automotive and aeronautical applications. The fatigue strengths were determined at 2 × 10⁶ cycles and at various R‐ratios using a staircase procedure. For the aluminium 2024, it is shown that the biaxial stress state increases the maximum permissible first principal stress when compared to the uniaxial condition. However, in terms of the cast aluminium alloy, it has been demonstrated that this type of fatigue specimen is not suitable for materials containing casting defects, in particular micro‐shrinkage pores, because the volume of material, in which the stress state is biaxial, is not large enough.     

Electrical memory features of ferromagnetic CoFeAlSi nano-particles embedded in metal-oxide-semiconductor matrix

Half-metallic Heusler material Co₂FeAl_0.5Si_0.5 (CFAS) nano-particles (NPs) embedded in metal-oxide-semiconductor (MOS) structures with thin HfO₂ tunneling and MgO control oxides were investigated. The CFAS NPs were prepared by rapid thermal annealing. The formation of well-controlled CFAS NPs on thin HfO₂ tunneling oxide was confirmed by atomic force microscopy (AFM). Memory characteristics of CFAS NPs in MOS devices exhibited a large memory window of 4.65 V, as well as good retention and endurance times of 10⁵ cycles and 10⁹ s, respectively, demonstrating the potential of CFAS NPs as promising candidates for use in charge storage.     

Influence of flux on wetting behavior of lead-free solder balls during the infrared-reflow process

The effects of two different fluxes (A6 and B6) on the wetting performance of Sn-3.5Ag-0.5Cu lead-free solder balls were investigated during the reflow process. Solder ball wetting behavior in real time via an optical microscope coupled with a video recorder during the reflow process was studied. The lead-free solder balls started to melt and wet at 210°C by using A6, which is 8°C lower than the melting point (218°C) of the solder material used. The wetting performance of the lead-free solder ball was dramatically enhanced by using A6. The wettability test indicated that the height of the solder ball after the reflow process with flux A6 was significantly lower than that with B6. It was found that strong fluxing capability caused these phenomena.     

Dielectric and Piezoelectric Properties of Na<Subscript>0.5</Subscript>Bi<Subscript>0.5</Subscript>TiO<Subscript>3</Subscript>-K<Subscript>0.5</Subscript>Bi<Subscript>0.5</Subscript>TiO<Subscript>3</Subscript>-NaNbO<Subscript>3</Subscript>Lead-Free Ceramics

The ternary lead-free piezoelectric ceramics system of (1 – x) [0.88Na_0.5Bi_0.5TiO₃-0.12K_0.5Bi_0.5TiO₃] – xNaNbO₃(x = 0, 0.02, 0.04, 0.06, 0.08, 0.10) were synthesized by conventional solid state reaction method. The crystal structure, dielectric, piezoelectric properties and P-E hysteresis loops were investigated. The crystalline structure of all compositions is mono-perovskite phase ascertained by XRD, and the lattice constant was calculated from the XRD data. Temperature dependence of dielectric constant _r and dissipation factor tan measurement revealed that all compositions experienced two phase transitions: from ferroelectric to anti-ferroelectric and from anti-ferroelectric to paraelectric, and these two phase transitions have relaxor characteristics. Both transition temperatures T_d and T_m are lowered due to introduction of NaNbO₃. P-E hysteresis loops show that 0.88Na_0.5Bi_0.5TiO₃-0.12K_0.5Bi_0.5TiO₃ ceramics has the maximum P_r and E_c corresponding to the maximum values of electromechanical coupling factor K_p and piezoelectric constant d_33. The piezoelectric constant d₃₃ and electromechanical coupling factor K_p decrease a little, while the dielectric constant ₃₃^T/₀ improves much more when the concentration of NaNbO₃ is 8 mol%.     

Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression

Due to the toxicity of lead (Pb), Pb-containing solder alloys are being phased out from the electronics industry. This has lead to the development and implementation of lead-free solders. Being an environmentally compatible material, the lead-free Sn-3.0Ag-0.5Cu (wt.%) solder alloy is considered to be one of the most promising alternatives to replace the traditionally used Sn-Pb solders. This alloy composition possesses, however, some weaknesses, mainly as a result of its higher melting temperature compared with the Sn-Pb solders. A possible way to decrease the melting temperature of a solder alloy is to decrease the alloy particle size down to the nanometer range. The melting temperature of Sn-3.0Ag-0.5Cu lead-free solder alloy, both as bulk and nanoparticles, was investigated. The nanoparticles were manufactured using the self-developed consumable-electrode direct current arc (CDCA) technique. The melting temperature of the nanoparticles, with an average size of 30 nm, was found to be 213.9°C, which is approximately 10°C lower than that of the bulk alloy. The developed CDCA technique is therefore a promising method to manufacture nanometer-sized solder alloy particles with lower melting temperature compared with the bulk alloy.     

垂直布里奇曼法生长的Cd_（0.8）Mn_（0.2）Te单晶体中Te沉淀相分析

Cd1-xMnxTe（CdMnTe,CMT）是制备光学隔离器、太阳能电池、x射线和γ射线探测器的优选材料。本实验采用垂直布里奇曼（VB）法成功地生长出Cd0.8Mn0.2Te单晶体。用JEM-3010型高分辨透射电子显微镜（HRTEM）观察了CMT晶体中的纳米级Te沉淀。选区电子衍射得到了Te沉淀与CMT基体两相的合成电子衍射图。计算出单斜Te沉淀的晶胞参数为：a=0.31nm,b=0.79nm,c=0.47nm,β=92.71°。确定了Te沉淀和CMT基体的取向关系为（0 31）Te//（202）CMT,[100]Te//[111]CMT。最后,对Te沉淀（缺陷）的形成原因进行了分析。     

Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn

Solder alloys doped with rare-earth elements have been reported to show many beneficial effects. However, tin whiskers have been observed to appear on the surface of Sn-3Ag-0.5Cu-0.5Ce solder joints after air exposure for short periods. Such a phenomenon of abnormal whisker growth may significantly degrade the reliability of electronic packaging. The present study shows that the tin whiskers can be prevented by the addition of 0.5 wt.% Zn into a Sn-3Ag-0.5Cu-0.5Ce solder. The inhibition effect on the whisker growth is correlated to the refining of (Ce_0.9Zn_0.1)Sn₃ intermetallics in this Sn-3Ag-0.5Cu-0.5Ce-0.5Zn alloy.     

柠檬酸盐法制备Na0.5Bi0.5TiO3陶瓷粉体的工艺研究

本实验采用柠檬酸盐法制备（NaBi）0.5TiO3无铅压电陶瓷粉体,系统研究了柠檬酸浓度、溶液pH值、煅烧温度等工艺条件对制备的影响。经研究分析,当柠檬酸浓度C=9%,溶液pH=7.5时,能形成透明、均匀、稳定的溶胶,且形成时间最短;650℃下煅烧2h能够合成单一的钙钛矿结构的钛酸铋钠晶相,比传统固相反应法煅烧温度降低了200℃。