Cs2.5H0.5PW12O40/SiO2催化剂上叔戊烯与甲醇的醚化

摘要：制备了硅胶负载的Cs2．5H0．5PW12O40／SiO2催化剂,并用于叔戊烯与甲醇的醚化反应。考察了催化剂制备方法和工艺条件对叔戊烯转化率的影响。研究结果表明,以低钠硅胶为载体,在负载量40％、焙烧温度400℃条件下制备的Cs2．5H0．5PW12O40／SiO2催化剂具有较高的催化活性。在反应温度为80℃、压力为1．0MPa、n(甲醇)／n(叔戊烯)为1．1、LHSV为1h^-1的条件下,叔戊烯的转化率为68．57％.Cs2．5H0．5PW12O40／SiO2催化剂对于叔戊烯与甲醇的醚化反应具有良好的活性与选择性,是一种理想的叔戊烯与甲醇的醚化反应的催化剂。     

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na<Subscript>2</Subscript>SO<Subscript>4</Subscript> Solutions

Anodic dissolution characteristics and electrochemical migration (ECM) behavior of Sn-3.0Ag-0.5Cu solder in NaCl and Na₂SO₄ solutions were investigated using anodic polarization tests and water drop tests (WDT). The ECM lifetime of Sn-3.0Ag-0.5Cu solder in NaCl solution (42.4 s) was longer than that in Na₂SO₄ solution (34.8 s). The pitting potential of Sn-3.0Ag-0.5Cu solder in NaCl solution (135 mV, SCE) was higher than that in Na₂SO₄ solution (−367 mV, SCE). The passivity film (SnO₂) formed on Sn-3.0Ag-0.5Cu solder during WDTs in NaCl solution was thicker than that formed in Na₂SO₄ solution. Therefore, the longer ECM lifetime of Sn-3.0Ag-0.5Cu solder in NaCl solution than in Na₂SO₄ solution can be attributed to the higher pitting potential in the NaCl solution, which is ascribed to the formation of a thicker passivity film (SnO₂) in the former. It was confirmed that microelements such as Ag and Cu do not take part in ECM because they form chemically stable intermetallic compounds with Sn. We believe that Sn is the only element that contributes to ECM, and dissolution of Sn at the anode is possibly the rate-determining step of ECM of Sn-3.0Ag-0.5Cu solder.     

Surface modification of LiNi0.5Co0.2Mn0.3O2 cathode materials with Li2O‐B2O3‐LiBr for lithium‐ion batteries

LiNi_0.5Co_0.2Mn_0.3O₂ (NCM523) cathode material suffers from phase transformation and electrochemical performance degradation as its main drawbacks, which are strongly dependent on the surface state of NCM523. Herein, an effective surface modification approach was demonstrated; namely, the fast lithium‐ion conductor (Li₂O‐B₂O₃‐LiBr) was coated on NCM523. The Li₂O‐B₂O₃‐LiBr coating layer as a protecting shell can prevent NCM523 particles from corrosion by the acidic electrolyte, leading to a superior discharge capacity, rate capability, and cycling stability. At room temperature, the Li₂O‐B₂O₃‐LiBr–coated NCM523 exhibited an excellent capacity retention of 87.7% after 100 cycles at the rate of 1 C, which is remarkably better than that (29.8%) without the uncoated layer. Furthermore, the coating layer also increased the discharge capacity of NCM523 cathode material from 68.7 to 117.0 mAh g^?1 at 5 C. Those can be attributed to the reduction in the electrode polarization and improvement in the electrode conductivity, which was supported by electrochemical impedance spectroscopy and cyclic voltammetry measurements.     

Bi_(0.5)Na_(0.5)TiO_3基无铅压电陶瓷的研究进展

Bi_(0.5)Na_(0.5)TiO_3基无铅压电陶瓷是目前应用前景最广阔的一类无铅压电陶瓷,本文综述了无铅压电陶瓷的发展概况,系统地概括了国内外从离子掺杂、添加第二组元形成固溶体和晶粒定向生长形成织构陶瓷3个方面对改善Bi_(0.5)Na_(0.5)TiO_3基无铅压电陶瓷性能的研究现状,对无铅压电陶瓷的发展进行了展望。     

Composition Engineering of All‐Inorganic Perovskite Film for Efficient and Operationally Stable Solar Cells

Cesium‐based inorganic perovskites have recently attracted great research focus due to their excellent optoelectronic properties and thermal stability. However, the operational instability of all‐inorganic perovskites is still a main hindrance for the commercialization. Herein, a facile approach is reported to simultaneously enhance both the efficiency and long‐term stability for all‐inorganic CsPbI_2.5Br_0.5 perovskite solar cells via inducing excess lead iodide (PbI₂) into the precursors. Comprehensive film and device characterizations are conducted to study the influences of excess PbI₂ on the crystal quality, passivation effect, charge dynamics, and photovoltaic performance. It is found that excess PbI₂ improves the crystallization process, producing high‐quality CsPbI_2.5Br_0.5 films with enlarged grain sizes, enhanced crystal orientation, and unchanged phase composition. The residual PbI₂ at the grain boundaries also provides a passivation effect, which improves the optoelectronic properties and charge collection property in optimized devices, leading to a power conversion efficiency up to 17.1% with a high open‐circuit voltage of 1.25 V. More importantly, a remarkable long‐term operational stability is also achieved for the optimized CsPbI_2.5Br_0.5 solar cells, with less than 24% degradation drop at the maximum power point under continuous illumination for 420 h.     

Bi0.5Sb1.5Te3/环氧树脂柔性复合热电厚膜的制备及其面内制冷性能

利用丝网印刷法在聚酰亚胺基板上制备了Bi_0.5Sb_1.5Te₃/环氧树脂柔性复合热电厚膜, 通过优化Bi_0.5Sb_1.5Te₃粉末含量提高了其电输运性能。复合厚膜在300 K时的最优功率因子达到1.12 mW·m ^-1·K ^-2, 较前期报道的数值提高了33%。抗弯测试表明复合厚膜的电阻在弯曲半径大于20 mm时基本不变, 在弯曲半径为20 mm, 弯曲次数小于3000次时, 仅有轻微增大, 说明其在柔性热电器件领域具有应用潜力。红外热成像技术显示, 在工作电流为0.01 A到0.05 A时, 复合厚膜热电臂两端可以形成4.2 ℃到7.8 ℃的温差, 表明了其在面内制冷领域应用的可能性。     

轧制温度对Al−4.5Cu−1.5Mg−0.5Zr合金显微组织及性能影响

目的 优化加工工艺,改善合金的组织,提高合金的力学性能。方法 采用金相(OM)观察、拉伸试验和X射线衍射,分析在大应变轧制下冷轧结合T6态处理后板材的成形性能,引入Williamson-Hall模型和Taylor函数,分析合金内部位错密度的变化规律及其对力学性能的影响。结果 随着前期轧制温度从350 ℃升高到400 ℃,合金晶粒得到明显细化,再结晶充分,晶粒尺寸细小,晶界处第二相粗大;冷轧后晶粒破碎严重,晶粒的碎化方向与轧制方向垂直;在350 ℃时,合金内部的位错密度为1.62×10¹⁵ m^?2,位错密度对强度的贡献值为219.5 MPa,其抗拉强度最大为602 MPa、屈服强度为512 MPa、伸长率为12.6%。结论 Al?4.5Cu?1.5Mg?0.5Zr合金的晶粒组织明显细化,其力学性能得到提升。     

Ti-22Al-24Nb-0.5Y合金流变行为及BP神经网络高温本构模型

利用Gleeble-3500热模拟试验机进行等温恒应变热压缩实验,以实验获得的数据为基础,研究Ti-22Al-24Nb-0.5Y合金流变行为,通过正交实验对影响合金的流变应力因素进行分析,并建立基于BP神经网络的合金高温本构关系模型。结果表明:影响合金流变应力的主要因素依次为应变速率、变形温度和应变量;Ti-22Al-24Nb-0.5Y合金在热变形时的流变应力对应变速率和变形温度都较为敏感。当变形温度较低,应变速率较高时,合金变形呈流变软化特征,当变形温度较高,应变速率较低时,合金变形趋向于稳态流动;利用BP神经网络建立的合金高温本构关系模型,具有较高的精度,其相关性系数达到0.9949,平均相对误差在3.23%,预测值偏差在10%以内的数据点达98.79%,该预测模型可作为Ti2AlNb基合金塑性成形过程有限元模拟的本构关系。     

304不锈钢热浸镀铝工艺及镀层的耐冲蚀性能

为提高304不锈钢在实际工况中应用时的耐腐蚀性能,采用熔剂法对304不锈钢热浸镀铝,并对镀铝层进行扩散退火处理,通过厚度测试,形貌观察及成分分析优选了热浸镀工艺及扩散退火工艺,并采用冲刷腐蚀试验研究了最佳工艺制备的镀层的冲蚀性能。结果表明:304不锈钢热浸镀Al-3.0%Si-0.5%RE,在740℃左右浸镀15min时,镀层厚度为100μm左右;在820℃扩渗4 h,获得了较好的扩渗层,其厚度约为115μm;冲蚀时间达到120 h时,经最佳条件热浸镀铝+扩散退火处理后镀层的冲蚀失重速率最小,为0.092 g/(h·m2),未热浸镀铝及扩散退火处理的304钢原始试样的冲蚀失重速度相对较快,其冲蚀腐蚀速率为0.121 g/(h·m^2),约为热浸镀铝试样的1.32倍。     

NBT基无铅压电陶瓷的研究进展

由于环境保护的要求，无铅压电材料越来越受到关注，NBT基压电陶瓷是目前研究较多的一种无铅压电材料，采取各种掺杂措施可以提高其压电性能，获得具有实用价值的无铅压电陶瓷材料。